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Microarray carrier assembly
Grant 10,913,070 - Zhou , et al. February 9, 2 | 2021-02-09 |
Microarray and method for forming the same
Grant 10,872,924 - Ku , et al. December 22, 2 | 2020-12-22 |
Method for in-line measurement of quality of microarray
Grant 10,732,166 - Ku , et al. | 2020-08-04 |
Structures and manufacture method of electrochemical units
Grant 10,416,114 - Chen , et al. Sept | 2019-09-17 |
Microarray And Method For Forming The Same
App 20190165039 - Ku; Tzu-Kun ; et al. | 2019-05-30 |
Microarray Carrier Assembly
App 20180345290 - Zhou; Wei ; et al. | 2018-12-06 |
Method For In-line Measurement Of Quality Of Microarray
App 20180238855 - Ku; Tzu-Kun ; et al. | 2018-08-23 |
Structures And Manufacture Method Of Electrochemical Units
App 20170343506 - CHEN; Jui-Chin ; et al. | 2017-11-30 |
Semiconductor device and manufacturing method thereof
Grant 9,368,475 - Chen , et al. June 14, 2 | 2016-06-14 |
Method for manufacturing through substrate via (TSV), structure and control method of TSV capacitance
Grant 9,257,322 - Chen , et al. February 9, 2 | 2016-02-09 |
TSV substrate structure and the stacked assembly thereof
Grant 9,257,338 - Wang , et al. February 9, 2 | 2016-02-09 |
Semiconductor Device And Manufacturing Method Thereof
App 20150294953 - Chen; Shang-Chun ; et al. | 2015-10-15 |
Semiconductor device and manufacturing method thereof
Grant 9,093,312 - Chen , et al. July 28, 2 | 2015-07-28 |
Tsv Substrate Structure And The Stacked Assembly Thereof
App 20150155204 - WANG; CHUNG-CHIH ; et al. | 2015-06-04 |
Semiconductor Device And Manufacturing Method Thereof
App 20140346666 - Chen; Shang-Chun ; et al. | 2014-11-27 |
Method Of Flattening Surface Of Conductive Structure And Conductive Structure With Flattened Surface
App 20140238725 - Chen; Erh-Hao ; et al. | 2014-08-28 |
Chip Bonding Structure And Manufacturing Method Thereof
App 20140175655 - Chen; Jui-Chin ; et al. | 2014-06-26 |
Wafer Stacking Structure And Method Of Manufacturing The Same
App 20140175614 - WANG; CHUNG-CHIH ; et al. | 2014-06-26 |
Method For Manufacturing Through Substrate Via (tsv), Structure And Control Method Of Tsv Capacitance
App 20140008800 - Chen; Erh-Hao ; et al. | 2014-01-09 |
Through-substrate Via Structure
App 20140008652 - Hsu; Tzu-Chien ; et al. | 2014-01-09 |
Dual Damascene Structure Having Through Silicon Via And Manufacturing Method Thereof
App 20130270713 - Liao; Sue-Chen ; et al. | 2013-10-17 |
Tsv Substrate Structure And The Stacked Assembly Thereof
App 20130214390 - WANG; CHUNG-CHIH ; et al. | 2013-08-22 |
Through Substrate Via Structure And Method For Fabricating The Same
App 20130161825 - HSU; TZU-CHIEN ; et al. | 2013-06-27 |
Semiconductor structure with conductive plug in an oxide layer
Grant 8,445,995 - Lin , et al. May 21, 2 | 2013-05-21 |
Manufacturing Method Of Semiconductor Structure
App 20120322249 - Chen; Jui-Chin ; et al. | 2012-12-20 |
Method of fabricating oxide material layer with openings attached to device layers
Grant 8,309,402 - Lin , et al. November 13, 2 | 2012-11-13 |
Semiconductor Structure And Manufacturing Method Thereof
App 20120139105 - Lin; Cha-Hsin ; et al. | 2012-06-07 |
Manufacturing Method Of Semiconductor Structure
App 20120142184 - Lin; Cha-Hsin ; et al. | 2012-06-07 |
Tsv Substrate Structure And The Stacked Assembly Thereof
App 20120133030 - Wang; Chung-Chih ; et al. | 2012-05-31 |
Trench Capacitor Structures And Method Of Manufacturing The Same
App 20120127625 - Wang; Chung-Chih ; et al. | 2012-05-24 |
Semiconductor Structure And Manufacturing Method Thereof
App 20120119375 - Chen; Jui-Chin ; et al. | 2012-05-17 |
Method of forming shallow trench isolation with silicon oxynitride barrier film
Grant 6,784,075 - Ku , et al. August 31, 2 | 2004-08-31 |
Method of forming a metal-oxide semiconductor transistor
Grant 6,743,690 - Ku , et al. June 1, 2 | 2004-06-01 |
Method of forming shallow trench isolation in a semiconductor substrate
Grant 6,720,235 - Ku , et al. April 13, 2 | 2004-04-13 |
Method for forming a damascene structure
Grant 6,713,379 - Ku , et al. March 30, 2 | 2004-03-30 |
Method of forming shallow trench isolation in a semiconductor substrate
App 20040048442 - Ku, Tzu-Kun ; et al. | 2004-03-11 |
Method of forming a metal-oxide semiconductor transistor
App 20040048438 - Ku, Tzu-Kun ; et al. | 2004-03-11 |
Method Of Forming Shallow Trench Isolation In A Semiconductor Substrate
App 20040048443 - Ku, Tzu-Kun ; et al. | 2004-03-11 |
Interconnect structure capped with a metallic barrier layer and method fabrication thereof
App 20030116826 - Hsue, Chen-Chiu ; et al. | 2003-06-26 |
Interconnect structure manufacturing process
App 20020182850 - Hsue, Chen-Chiu ; et al. | 2002-12-05 |
Silicide glue layer for W-CVD plug application
App 20010000158 - Ku, Tzu-Kun ; et al. | 2001-04-05 |
Insitu formation of TiSi.sub.2 /TiN bi-layer structures using self-aligned nitridation treatment on underlying CVD-TiSi.sub.2 layer
Grant 6,071,552 - Ku June 6, 2 | 2000-06-06 |
Insitu formation of TiSi2/TiN bi-layer structures using self-aligned nitridation treatment on underlying CVD-TiSi2 layer
Grant 5,856,237 - Ku January 5, 1 | 1999-01-05 |
Method of fabricating a field emission device
Grant 5,643,032 - Cheng , et al. July 1, 1 | 1997-07-01 |
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