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Microelectromechanical Device Including An Encapsulation Layer Of Which A Portion Is Removed To Expose A Substantially Planar Surface Having A Portion That Is Disposed Outside And Above A Chamber And Including A Field Region On Which Integrated Circuits Are Formed, And Methods For Fabricating Same App 20130280842 - PARTRIDGE; Aaron ;   et al. | 2013-10-24 |
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Microelectromechanical Device Including An Encapsulation Layer Of Which A Portion Is Removed To Expose A Substantially Planar Surface Having A Portion That Is Disposed Outside And Above A Chamber And Including A Field Region On Which Integrated Circuits Are Formed, And Methods For Fabricating Same App 20110221013 - Partridge; Aaron ;   et al. | 2011-09-15 |
Electromechanical system having a controlled atmosphere, and method of fabricating same Grant 8,018,077 - Partridge , et al. September 13, 2 | 2011-09-13 |
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Method for producing a capping wafer for a sensor App 20110012248 - Reichenbach; Frank ;   et al. | 2011-01-20 |
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Crack And Residue Free Conformal Deposited Silicon Oxide With Predictable And Uniform Etching Characteristics App 20100159627 - Partridge; Aaron ;   et al. | 2010-06-24 |
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Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics Grant 7,625,603 - Partridge , et al. December 1, 2 | 2009-12-01 |
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Method for Manufacturing a Semiconductor Structure, and a Corresponding Semiconductor Structure App 20090236610 - Lammel; Gerhard ;   et al. | 2009-09-24 |
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Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same Grant 7,579,206 - Lutz , et al. August 25, 2 | 2009-08-25 |
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Method of fabricating electromechanical device having a controlled atmosphere Grant 7,514,283 - Partridge , et al. April 7, 2 | 2009-04-07 |
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Microelectromechanical systems, and methods for encapsualting and fabricating same App 20080237756 - Partridge; Aaron ;   et al. | 2008-10-02 |
Component including a fixed element that is in a silicon layer and is mechanically connected to a substrate via an anchoring element and method for its manufacture Grant 7,382,031 - Kronmueller , et al. June 3, 2 | 2008-06-03 |
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same App 20080108165 - Lutz; Markus ;   et al. | 2008-05-08 |
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Microelectromechanical systems encapsulation process App 20080050845 - Ulm; Markus ;   et al. | 2008-02-28 |
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Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same Grant 7,317,233 - Lutz , et al. January 8, 2 | 2008-01-08 |
Microelectromechanical systems, and devices having thin film encapsulated mechanical structures Grant 7,288,824 - Partridge , et al. October 30, 2 | 2007-10-30 |
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Method of fabricating microelectromechanical systems and devices having trench isolated contacts Grant 6,936,491 - Partridge , et al. August 30, 2 | 2005-08-30 |
Microelectromechanical systems having trench isolated contacts, and methods for fabricating same App 20050156260 - Partridge, Aaron ;   et al. | 2005-07-21 |
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Component and method of manufacturing same App 20040081802 - Pannek, Thorsten ;   et al. | 2004-04-29 |