Koyata; Sakae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Koyata; Sakae.The latest application filed is for "method for smoothing wafer surface and apparatus used therefor".

Company Profile

0.18.27

Koyata; Sakae - Tokyo JP
Koyata; Sakae - Ogi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing epitaxial wafer Grant 8,759,229 - Koyata , et al. June 24, 2	2014-06-24
Method for etching single wafer Grant 8,466,071 - Koyata , et al. June 18, 2	2013-06-18
Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer Grant 8,066,896 - Koyata , et al. November 29, 2	2011-11-29
Method for smoothing wafer surface and apparatus used therefor Grant 7,955,982 - Katoh , et al. June 7, 2	2011-06-07
Single wafer etching method Grant 7,906,438 - Koyata , et al. March 15, 2	2011-03-15
Alkaline etchant for controlling surface roughness of semiconductor wafer Grant 7,851,375 - Koyata , et al. December 14, 2	2010-12-14
Method For Smoothing Wafer Surface And Apparatus Used Therefor App 20100151597 - Katoh; Takeo ; et al.	2010-06-17
Wafer polishing apparatus and method for polishing wafers Grant 7,717,768 - Hashii , et al. May 18, 2	2010-05-18
Wafer Manufacturing Method And Wafer Obtained Through The Method App 20100021688 - KATOH; Takeo ; et al.	2010-01-28
Process for producing silicon wafer Grant 7,648,890 - Koyata , et al. January 19, 2	2010-01-19
Manufacturing method of silicon wafer Grant 7,645,702 - Koyata , et al. January 12, 2	2010-01-12
Semiconductor Wafer App 20090297755 - KOYATA; Sakae ; et al.	2009-12-03
Method of processing silicon wafer Grant 7,601,642 - Koyata , et al. October 13, 2	2009-10-13
Method for manufacturing silicon wafers Grant 7,601,644 - Koyata , et al. October 13, 2	2009-10-13
Single-Wafer Etching Method for Wafer and Etching Apparatus Thereof App 20090181546 - KATOH; Takeo ; et al.	2009-07-16
Etching Method of Single Wafer App 20090117749 - KOYATA; Sakae ; et al.	2009-05-07
Method for Manufacturing Epitaxial Wafer App 20090053894 - Koyata; Sakae ; et al.	2009-02-26
Etchant For Silicon Wafer Surface Shape Control And Method For Manufacturing Silicon Wafers Using The Same App 20090042390 - Koyata; Sakae ; et al.	2009-02-12
Apparatus for etching wafer by single-wafer process Grant 7,488,400 - Koyata , et al. February 10, 2	2009-02-10
Method for Etching Single Wafer App 20090004876 - Koyata; Sakae ; et al.	2009-01-01
Method for producing a silicon wafer Grant 7,456,106 - Koyata , et al. November 25, 2	2008-11-25
Method For Manufacturing Silicon Wafer App 20080214094 - KATOH; Takeo ; et al.	2008-09-04
Method for manufacturing single-side mirror surface wafer Grant 7,338,904 - Koyata , et al. March 4, 2	2008-03-04
Alkaline Etchant for Controlling Surface Roughness of Semiconductor Wafer App 20070298618 - Koyata; Sakae ; et al.	2007-12-27
Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer App 20070298614 - Koyata; Sakae ; et al.	2007-12-27
Processing Method of Silicon Wafer App 20070267387 - Koyata; Sakae ; et al.	2007-11-22
Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same Grant 7,288,207 - Koyata , et al. October 30, 2	2007-10-30
Method for Manufacturing Silicon Wafers App 20070224821 - Koyata; Sakae ; et al.	2007-09-27
Etching Liquid for Controlling Silicon Wafer Surface Shape App 20070184658 - Koyata; Sakae ; et al.	2007-08-09
Single Wafer Etching Apparatus and Single Wafer Etching Method App 20070175863 - Koyata; Sakae ; et al.	2007-08-02
Method for manufacturing single-side mirror surface wafer App 20070158308 - Koyata; Sakae ; et al.	2007-07-12
Etching Method Of Single Wafer App 20070161247 - KOYATA; Sakae ; et al.	2007-07-12
Method for producing a silicon wafer Grant 7,226,864 - Koyata , et al. June 5, 2	2007-06-05
Manufacturing method of silicon wafer App 20070119817 - Koyata; Sakae ; et al.	2007-05-31
Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer App 20070087568 - Koyata; Sakae ; et al.	2007-04-19
Process for producing silicon wafer App 20070042567 - Koyata; Sakae ; et al.	2007-02-22
Apparatus for polishing wafer and process for polishing wafer App 20060264158 - Hashii; Tomohiro ; et al.	2006-11-23
Wafer polishing apparatus and method for polishing wafers App 20060264157 - Hashii; Tomohiro ; et al.	2006-11-23
Method of processing silicon wafer App 20060252272 - Koyata; Sakae ; et al.	2006-11-09
Method for etching a silicon wafer and method for performing differentiation between the obverse and the reverse of a silicon wafer using the same method App 20060194441 - Koyata; Sakae ; et al.	2006-08-31
Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same App 20060169667 - Koyata; Sakae ; et al.	2006-08-03
Method for producing a silicon wafer App 20050148181 - Koyata, Sakae ; et al.	2005-07-07
Method for producing a silicon wafer App 20050112893 - Koyata, Sakae ; et al.	2005-05-26

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