| Patent | Date |
|---|
Polarizing Plate And Optical Display Device Including Same
App 20220299691 - LEE; Sang Hum ; et al. | 2022-09-22 |
Polarizing Plate And Optical Display Device Comprising Same
App 20220276424 - KOO; Jun Mo ; et al. | 2022-09-01 |
Polarizing Plate And Display Device Including Same
App 20220252773 - YOU; Jung Hun ; et al. | 2022-08-11 |
Polarizing Plate And Optical Display Apparatus Comprising Same
App 20220187524 - KOO; Jun Mo ; et al. | 2022-06-16 |
Polarizing Plate And Optical Display Comprising The Same
App 20220075108 - KOO; Jun Mo ; et al. | 2022-03-10 |
Polarizing Plate And Optical Display Apparatus Comprising The Same
App 20220026614 - KIM; Bong Choon ; et al. | 2022-01-27 |
Polarizing Plate And Liquid Crystal Display Device Including Same
App 20210405273 - KOO; Jun Mo ; et al. | 2021-12-30 |
Optical Film, Polarizing Plate Including Same, And Display Device Including Same
App 20210132278 - KOO; Jun Mo ; et al. | 2021-05-06 |
Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
Grant 10,998,248 - Pagaila , et al. May 4, 2 | 2021-05-04 |
Polarizing Plate And Optical Display Apparatus Comprising The Same
App 20210033768 - KOO; Jun Mo ; et al. | 2021-02-04 |
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
Grant 10,242,948 - Shim , et al. | 2019-03-26 |
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
App 20180108542 - Pagaila; Reza A. ; et al. | 2018-04-19 |
Semiconductor device and method of forming interposer with opening to contain semiconductor die
Grant 9,875,911 - Pagaila , et al. January 23, 2 | 2018-01-23 |
Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP
Grant 9,679,824 - Pagaila , et al. June 13, 2 | 2017-06-13 |
Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure
Grant 9,620,455 - Pagaila , et al. April 11, 2 | 2017-04-11 |
Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package
App 20170098610 - Shim; Il Kwon ; et al. | 2017-04-06 |
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
Grant 9,559,039 - Shim , et al. January 31, 2 | 2017-01-31 |
Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect
Grant 9,437,538 - Pagaila , et al. September 6, 2 | 2016-09-06 |
Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
App 20160197022 - Pagaila; Reza A. ; et al. | 2016-07-07 |
Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die
Grant 9,337,116 - Pagaila , et al. May 10, 2 | 2016-05-10 |
Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
Grant 9,318,441 - Pagaila , et al. April 19, 2 | 2016-04-19 |
Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package
Grant 9,305,854 - Shim , et al. April 5, 2 | 2016-04-05 |
Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die
Grant 9,263,301 - Pagaila , et al. February 16, 2 | 2016-02-16 |
Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer
Grant 9,224,647 - Koo , et al. December 29, 2 | 2015-12-29 |
Method And Apparatus For Controlling Switching Of Connection To An Access Point Of A Wireless Network Based On Information Of Access Points Of The Network
App 20150296450 - Koo; Jun Mo ; et al. | 2015-10-15 |
Semiconductor device with protective layer over exposed surfaces of semiconductor die
Grant 9,142,515 - Pagaila , et al. September 22, 2 | 2015-09-22 |
Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
Grant 8,999,760 - Pagaila , et al. April 7, 2 | 2015-04-07 |
Semiconductor device and method of bonding different size semiconductor die at the wafer level
Grant 8,993,377 - Koo , et al. March 31, 2 | 2015-03-31 |
Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
Grant 8,866,294 - Pagaila , et al. October 21, 2 | 2014-10-21 |
Semiconductor Device Including RDL Along Sloped Side Surface of Semiconductor Die for Z-Direction Interconnect
App 20140264786 - Pagaila; Reza A. ; et al. | 2014-09-18 |
Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
App 20140252631 - Pagaila; Reza A. ; et al. | 2014-09-11 |
Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect
Grant 8,796,137 - Pagaila , et al. August 5, 2 | 2014-08-05 |
Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package
App 20140077389 - Shim; Il Kwon ; et al. | 2014-03-20 |
Semiconductor Device with Protective Layer Over Exposed Surfaces of Semiconductor Die
App 20140077344 - Pagaila; Reza A. ; et al. | 2014-03-20 |
Semiconductor Device and Method of Forming RDL Using UV-Cured Conductive Ink Over Wafer Level Package
App 20140054802 - Shim; Il Kwon ; et al. | 2014-02-27 |
Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die
Grant 8,642,381 - Pagaila , et al. February 4, 2 | 2014-02-04 |
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
App 20130299982 - Pagaila; Reza A. ; et al. | 2013-11-14 |
Semiconductor Device and Method of Forming Bond-on-Lead Interconnection for Mounting Semiconductor Die in FO-WLCSP
App 20130214409 - Pagaila; Reza A. ; et al. | 2013-08-22 |
Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP
Grant 8,435,834 - Pagaila , et al. May 7, 2 | 2013-05-07 |
Semiconductor Device and Method of Forming FO-WLCSP with Discrete Semiconductor Components Mounted Under and Over Semiconductor Die
App 20130001771 - Pagaila; Reza A. ; et al. | 2013-01-03 |
Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation
App 20120261818 - Pagaila; Reza A. ; et al. | 2012-10-18 |
Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die
Grant 8,288,201 - Pagaila , et al. October 16, 2 | 2012-10-16 |
Semiconductor Device and Method of Forming Thermally Conductive Layer Between Semiconductor Die and Build-Up Interconnect Structure
App 20120248596 - Pagaila; Reza A. ; et al. | 2012-10-04 |
Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
Grant 8,241,964 - Pagaila , et al. August 14, 2 | 2012-08-14 |
Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
Grant 8,236,617 - Pagaila , et al. August 7, 2 | 2012-08-07 |
Semiconductor Device and Method of Forming Stepped Interposer for Stacking and Electrically Connecting Semiconductor Die
App 20120104623 - Pagaila; Reza A. ; et al. | 2012-05-03 |
Semiconductor Device and Method of Forming TSV Interposer With Semiconductor Die and Build-Up Interconnect Structure on Opposing Surfaces of the Interposer
App 20120074585 - Koo; Jun Mo ; et al. | 2012-03-29 |
Semiconductor Device and Method of Bonding Different Size Semiconductor Die at the Wafer Level
App 20120074587 - Koo; Jun Mo ; et al. | 2012-03-29 |
Semiconductor Device And Method Of Forming Bond-on-lead Interconnection For Mounting Semiconductor Die In Fo-wlcsp
App 20120061824 - Pagaila; Reza A. ; et al. | 2012-03-15 |
Semiconductor Device and Method of Forming Leadframe as Vertical Interconnect Structure Between Stacked Semiconductor Die
App 20120049334 - Pagaila; Reza A. ; et al. | 2012-03-01 |
Semiconductor Device and Method of Forming FO-WLCSP with Discrete Semiconductor Components Mounted Under and Over Semiconductor Die
App 20120049344 - Pagaila; Reza A. ; et al. | 2012-03-01 |
Semiconductor Device and Method of Forming Protective Layer Over Exposed Surfaces of Semiconductor Die
App 20120012990 - Pagaila; Reza A. ; et al. | 2012-01-19 |
Semiconductor Device and Method of Forming RDL Along Sloped Side Surface of Semiconductor Die for Z-Direction Interconnect
App 20110316156 - Pagaila; Reza A. ; et al. | 2011-12-29 |
Semiconductor Device and Method of Forming Anisotropic Conductive Film Between Semiconductor Die and Build-Up Interconnect Structure
App 20110316146 - Pagaila; Reza A. ; et al. | 2011-12-29 |
Semiconductor Device and Method of Forming Thermally Conductive Layer Between Semiconductor Die and Build-Up Interconnect Structure
App 20110298110 - Pagaila; Reza A. ; et al. | 2011-12-08 |
Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
App 20110298137 - Pagaila; Reza A. ; et al. | 2011-12-08 |
Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die Into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation
App 20110278717 - Pagaila; Reza A. ; et al. | 2011-11-17 |
Hand-shake correction method and apparatus of camera module for use in mobile device
Grant 8,009,971 - Koo , et al. August 30, 2 | 2011-08-30 |
Apparatus and method for proportional-integral-derivative control
Grant 7,979,143 - Koo , et al. July 12, 2 | 2011-07-12 |
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
App 20110068459 - Pagaila; Reza A. ; et al. | 2011-03-24 |
Optical image stabilizer for camera lens assembly
Grant 7,489,340 - Koo , et al. February 10, 2 | 2009-02-10 |
Apparatus And Method For Proportional-integral-derivative Control
App 20080195236 - Koo; Jun-Mo ; et al. | 2008-08-14 |
Hand-shake Correction Method And Apparatus Of Camera Module For Use In Mobile Device
App 20080152332 - Koo; Jun-Mo ; et al. | 2008-06-26 |
Apparatus and method for generating pilot beacon signal in base stations of CDMA system
Grant 7,254,122 - Choi , et al. August 7, 2 | 2007-08-07 |
Optical demultiplexer having bragg diffration grating and optical communication module using the optical demultiplexer
Grant 7,215,884 - Koo , et al. May 8, 2 | 2007-05-08 |
Photoresist coating apparatus and method
App 20070054050 - Lee; Jin Sung ; et al. | 2007-03-08 |
Optical image stabilizer for camera lens assembly
App 20060092514 - Koo; Jun-Mo ; et al. | 2006-05-04 |
Optical image stabilizer for camera lens assembly
App 20060082659 - Koo; Jun-Mo | 2006-04-20 |
Optical demultiplexer having bragg diffration grating and optical communication module using the optical demultiplexer
App 20040264975 - Koo, Jun-Mo ; et al. | 2004-12-30 |
Apparatus and method for generating pilot beacon signal in base stations of CDMA system
App 20030214926 - Choi, An Na ; et al. | 2003-11-20 |
Method for synchronizing reverse link and transmission method using synchronous reverse link
Grant 6,516,007 - Hong , et al. February 4, 2 | 2003-02-04 |
CDMA modulation and demodulation method reducing interference and a communication system using the same
Grant 6,009,074 - Kim , et al. December 28, 1 | 1999-12-28 |
Rake receiving apparatus for direct sequence code division multiple access system
Grant 5,956,367 - Koo , et al. September 21, 1 | 1999-09-21 |
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