Ko; Tze-man

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ko; Tze-man.The latest application filed is for "doping of copper wiring structures in back end of line processing".

Company Profile

0.7.8

Ko; Tze-man - Hopewell Junction NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Doping Of Copper Wiring Structures In Back End Of Line Processing App 20150255397 - Dyer; Thomas W. ; et al.	2015-09-10
Doping of copper wiring structures in back end of line processing Grant 9,059,177 - Dyer , et al. June 16, 2	2015-06-16
Semiconductor device processing with reduced wiring puddle formation Grant 9,018,097 - Dyer , et al. April 28, 2	2015-04-28
Through-silicon Via Structure And Method For Improving Beol Dielectric Performance App 20150097274 - Collins; Christopher ; et al.	2015-04-09
Through-silicon Via Structure And Method For Improving Beol Dielectric Performance App 20150069608 - Collins; Christopher ; et al.	2015-03-12
Doping Of Copper Wiring Structures In Back End Of Line Processing App 20140246776 - Dyer; Thomas W. ; et al.	2014-09-04
Doping of copper wiring structures in back end of line processing Grant 8,765,602 - Dyer , et al. July 1, 2	2014-07-01
Semiconductor Device Processing With Reduced Wiring Puddle Formation App 20140099787 - Dyer; Thomas W. ; et al.	2014-04-10
Doping Of Copper Wiring Structures In Back End Of Line Processing App 20140061914 - Dyer; Thomas W. ; et al.	2014-03-06
Structure and method for detecting defects in BEOL processing Grant 8,623,673 - Dyer , et al. January 7, 2	2014-01-07
Interconnect structure and process of making the same Grant 7,488,679 - Standaert , et al. February 10, 2	2009-02-10
Interconnect Structure And Process Of Making The Same App 20080026568 - Standaert; Theodorus Eduardus ; et al.	2008-01-31

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