| Patent | Date |
|---|
Memory Device And Manufacturing Method Thereof
App 20220246578 - Huang; Ching-Yu ; et al. | 2022-08-04 |
Memory device and manufacturing method thereof
Grant 11,335,666 - Huang , et al. May 17, 2 | 2022-05-17 |
Memory Device And Manufacturing Method Thereof
App 20220013494 - Huang; Ching-Yu ; et al. | 2022-01-13 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20210351126 - Huang; Ching-Yu ; et al. | 2021-11-11 |
Package structure and method of manufacturing the same
Grant 11,127,708 - Liu , et al. September 21, 2 | 2021-09-21 |
Integrated fan-out packages and methods of forming the same
Grant 11,075,159 - Huang , et al. July 27, 2 | 2021-07-27 |
Memory Device And Manufacturing Method Thereof
App 20210202354 - Chuang; Lipu Kris ; et al. | 2021-07-01 |
Semiconductor package and manufacturing method thereof
Grant 10,879,170 - Chiang , et al. December 29, 2 | 2020-12-29 |
Semiconductor Package And Manufacturing Method Thereof
App 20200335439 - Chiang; Yung-Ping ; et al. | 2020-10-22 |
Semiconductor device and method
Grant 10,629,540 - Yu , et al. | 2020-04-21 |
Package Structure And Method Of Manufacturing The Same
App 20200075526 - Liu; Ming-Kai ; et al. | 2020-03-05 |
Semiconductor Device and Method
App 20200027838 - Yu; Chen-Hua ; et al. | 2020-01-23 |
Integrated Fan-out Packages And Methods Of Forming The Same
App 20200020628 - Huang; Ching-Yu ; et al. | 2020-01-16 |
Package structure and method of manufacturing the same
Grant 10,504,865 - Liu , et al. Dec | 2019-12-10 |
Package Structure And Method Of Manufacturing The Same
App 20190096841 - Liu; Ming-Kai ; et al. | 2019-03-28 |
Semiconductor Device and Method
App 20190096817 - Yu; Chen-Hua ; et al. | 2019-03-28 |
System and methods for converting planar design to FinFET design
Grant 9,634,001 - Wann , et al. April 25, 2 | 2017-04-25 |
Contact structure of semiconductor device
Grant 9,379,108 - Wann , et al. June 28, 2 | 2016-06-28 |
Structure and method for high performance interconnect
Grant 9,330,970 - Wann , et al. May 3, 2 | 2016-05-03 |
Strained structure of a semiconductor device
Grant 9,236,253 - Chen , et al. January 12, 2 | 2016-01-12 |
Contact Structure of Semiconductor Device
App 20150236016 - Wann; Clement Hsingjen ; et al. | 2015-08-20 |
Contact structure of semiconductor device
Grant 9,048,317 - Wann , et al. June 2, 2 | 2015-06-02 |
Contact Structure of Semiconductor Device
App 20150035017 - Wann; Clement Hsingjen ; et al. | 2015-02-05 |
System And Methods For Converting Planar Design To Finfet Design
App 20140332904 - WANN; Clement Hsingjen ; et al. | 2014-11-13 |
System and methods for converting planar design to FinFET design
Grant 8,816,444 - Wann , et al. August 26, 2 | 2014-08-26 |
Structure and Method for High Performance Interconnect
App 20140235051 - Wann; Clement Hsingjen ; et al. | 2014-08-21 |
Low resistance and reliable copper interconnects by variable doping
Grant 8,785,321 - Ko , et al. July 22, 2 | 2014-07-22 |
Strained Structure of a Semiconductor Device
App 20140147978 - Chen; Chung-Hsien ; et al. | 2014-05-29 |
Structure and method for high performance interconnect
Grant 8,716,863 - Wann , et al. May 6, 2 | 2014-05-06 |
Strained Structure of a Semiconductor Device
App 20140048888 - Chen; Chung-Hsien ; et al. | 2014-02-20 |
Structure And Method For High Performance Interconnect
App 20130015581 - Wann; Hsingjen ; et al. | 2013-01-17 |
System And Methods For Converting Planar Design To Finfet Design
App 20120273899 - WANN; Clement Hsingjen ; et al. | 2012-11-01 |
Low Resistance And Reliable Copper Interconnects By Variable Doping
App 20120021602 - Ko; Ting-Chu ; et al. | 2012-01-26 |
Approach to reduce the contact resistance
Grant 8,101,489 - Shue , et al. January 24, 2 | 2012-01-24 |
Low resistance and reliable copper interconnects by variable doping
Grant 8,053,892 - Ko , et al. November 8, 2 | 2011-11-08 |
Electro chemical plating additives for improving stress and leveling effect
Grant 7,771,579 - Ko , et al. August 10, 2 | 2010-08-10 |
Novel Approach to Reduce the Contact Resistance
App 20090191684 - Shue; Shau-Lin ; et al. | 2009-07-30 |
Salicidation Process Using Electroless Plating To Deposit Metal And Introduce Dopant Impurities
App 20090004851 - Shue; Shau-Lin ; et al. | 2009-01-01 |
Interconnect structures and methods for fabricating the same
App 20070287294 - Ko; Ting-Chu ; et al. | 2007-12-13 |
Damascene interconnect structure with cap layer
Grant 7,259,463 - Huang , et al. August 21, 2 | 2007-08-21 |
Method and apparatus for fabricating metal layer
App 20070181434 - Lee; Hsien-Ming ; et al. | 2007-08-09 |
Method and apparatus for fabricating metal layer
Grant 7,226,860 - Lee , et al. June 5, 2 | 2007-06-05 |
Low resistance and reliable copper interconnects by variable doping
App 20070054488 - Ko; Ting-Chu ; et al. | 2007-03-08 |
Damascene interconnect structure with cap layer
App 20060118962 - Huang; Jui Jen ; et al. | 2006-06-08 |
Electro chemical plating addictives for improving stress and leveling effect
App 20060118422 - Ko; Ting-Chu ; et al. | 2006-06-08 |
Low resistance and reliable copper interconnects by variable doping
Grant 7,026,244 - Ko , et al. April 11, 2 | 2006-04-11 |
Method and apparatus for fabricating metal layer
App 20050245072 - Lee, Hsien-Ming ; et al. | 2005-11-03 |
Method to improve copper electrochemical deposition
App 20050045485 - Shih, Chien-Hsueh ; et al. | 2005-03-03 |
Low resistance and reliable copper interconnects by variable doping
App 20050029659 - Ko, Ting-Chu ; et al. | 2005-02-10 |
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