KITAZAWA; Takashi
Patent Applications and Registrations
Patent applications and USPTO patent grants for KITAZAWA; Takashi.The latest application filed is for "heat medium circulation system and substrate processing apparatus".
Company Profile
4.24.21
- KITAZAWA; Takashi - Kurokawa-gun JP
- Kitazawa; Takashi - Miyagi JP
- Kitazawa; Takashi - Nirasaki N/A JP
- Kitazawa; Takashi - Kumagaya JP
- KITAZAWA; Takashi - Nirasaki City JP
- Kitazawa; Takashi - Kumagaya-shi JP
- Kitazawa; Takashi - Kumagaya-city JP
- Kitazawa; Takashi - Fukuoka JP
- Kitazawa; Takashi - Saitama JP
- Kitazawa; Takashi - Nirasaki-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Heat Medium Circulation System And Substrate Processing Apparatus App 20210074519 - ISAGO; Masaru ; et al. | 2021-03-11 |
| Processing method and processing apparatus Grant 10,676,823 - Sakane , et al. | 2020-06-09 |
| Supporting member and substrate processing apparatus Grant 10,553,408 - Yoshimura , et al. Fe | 2020-02-04 |
| Substrate processing apparatus Grant 10,249,478 - Sasaki , et al. | 2019-04-02 |
| Processing Method And Processing Apparatus App 20180148838 - Sakane; Ryota ; et al. | 2018-05-31 |
| Substrate Processing Apparatus App 20150179415 - SASAKI; Nobutaka ; et al. | 2015-06-25 |
| Supporting Member And Substrate Processing Apparatus App 20150013938 - YOSHIMURA; Akihiro ; et al. | 2015-01-15 |
| Plasma processing apparatus Grant 8,858,754 - Horiguchi , et al. October 14, 2 | 2014-10-14 |
| Circuit device having funnel shaped lead and method for manufacturing the same Grant 8,829,685 - Fukushima , et al. September 9, 2 | 2014-09-09 |
| Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer Grant 8,692,370 - Kitazawa , et al. April 8, 2 | 2014-04-08 |
| Substrate mounting table of substrate processing apparatus Grant 8,687,343 - Sato , et al. April 1, 2 | 2014-04-01 |
| Lead frame and method for manufacturing circuit device using the same Grant 8,609,467 - Fukushima , et al. December 17, 2 | 2013-12-17 |
| Method of setting thickness of dielectric and substrate processing apparatus having dielectric disposed in electrode Grant 8,426,318 - Oyabu , et al. April 23, 2 | 2013-04-23 |
| Method Of Setting Thickness Of Dielectric And Substrate Processing Apparatus Having Dielectric Disposed In Electrode App 20110318935 - OYABU; Jun ; et al. | 2011-12-29 |
| Semiconductor Device And Method For Producing The Same App 20110304046 - Kitazawa; Takashi ; et al. | 2011-12-15 |
| Plasma Processing Apparatus App 20110290419 - Horiguchi; Masato ; et al. | 2011-12-01 |
| Substrate Mounting Table Of Substrate Processing Apparatus App 20110116207 - SATO; Tetsuji ; et al. | 2011-05-19 |
| Lead Frame And Method For Manufacturing Circuit Device Using The Same App 20100244210 - Fukushima; Tetsuya ; et al. | 2010-09-30 |
| Circuit Device And Method For Manufacturing The Same App 20100244209 - Fukushima; Tetsuya ; et al. | 2010-09-30 |
| Motor control apparatus Grant 7,589,488 - Kitazawa , et al. September 15, 2 | 2009-09-15 |
| Vacuum apparatus Grant 7,472,581 - Kitazawa , et al. January 6, 2 | 2009-01-06 |
| Relative pressure control system and relative flow control system Grant 7,353,841 - Kono , et al. April 8, 2 | 2008-04-08 |
| Circuit device Grant 7,332,803 - Tsubonoya , et al. February 19, 2 | 2008-02-19 |
| Motor Control Apparatus App 20070229016 - Kitazawa; Takashi ; et al. | 2007-10-04 |
| Vacuum processing apparatus and substrate transfer method Grant 7,201,851 - Kitoku , et al. April 10, 2 | 2007-04-10 |
| Vacuum apparatus, method for measuring a leak rate thereof, program used in measuring the leak rate and storage medium storing the program App 20060207314 - Kitazawa; Takashi ; et al. | 2006-09-21 |
| Relative pressure control system and relative flow control system App 20060097644 - Kono; Tetsujiro ; et al. | 2006-05-11 |
| Motor control device Grant 7,023,153 - Kitazawa April 4, 2 | 2006-04-04 |
| Vacuum processing apparatus and substrate transfer method App 20060032074 - Kitoku; Toshihiko ; et al. | 2006-02-16 |
| Vacuum processing apparatus and substrate transfer method Grant 6,990,747 - Kitoku , et al. January 31, 2 | 2006-01-31 |
| Motor control device App 20050218847 - Kitazawa, Takashi | 2005-10-06 |
| Vacuum processing apparatus and control method therefor App 20050167049 - Kitazawa, Takashi | 2005-08-04 |
| Vacuum processing apparatus and control method therefor App 20050167398 - Kitazawa, Takashi | 2005-08-04 |
| Vacuum processing apparatus and control method thereof Grant 6,896,764 - Kitazawa May 24, 2 | 2005-05-24 |
| Circuit device App 20050040512 - Tsubonoya, Makoto ; et al. | 2005-02-24 |
| Vacuum processing apparatus and substrate transfer method App 20040255485 - Kitoku, Toshihiko ; et al. | 2004-12-23 |
| Exhaust ring for manufacturing semiconductors Grant D494,552 - Tezuka , et al. August 17, 2 | 2004-08-17 |
| Exhaust ring mechanism and plasma processing apparatus using the same App 20040129218 - Takahashi, Toshiki ; et al. | 2004-07-08 |
| Vacuum processing apparatus and control method therefor App 20030097985 - Kitazawa, Takashi | 2003-05-29 |
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