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name:-0.018777847290039
name:-0.00051093101501465
Kitayama; Hirofumi Patent Filings

Kitayama; Hirofumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kitayama; Hirofumi.The latest application filed is for "conductor treating single-wafer type treating device and method for semi-conductor treating".

Company Profile
0.12.2
  • Kitayama; Hirofumi - Nirasaki JP
  • Kitayama, Hirofumi - Nirasaki-shi JP
  • Kitayama, Hirofumi - Kanagawa-ken JP
  • Kitayama; Hirofumi - Aiko-gun JP
  • Kitayama; Hirofumi - Kanagawa JP
  • Kitayama; Hirofumi - Aikawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Conductor treating single-wafer type treating device and method for semi-conductor treating
Grant 7,235,137 - Kitayama , et al. June 26, 2
2007-06-26
Conductor treating single-wafer type treating device and method for semi-conductor treating
App 20040097088 - Kitayama, Hirofumi ;   et al.
2004-05-20
Apparatus and method for feeding gases for use in semiconductor manufacturing
App 20010013363 - Kitayama, Hirofumi ;   et al.
2001-08-16
Apparatus for feeding gases for use in semiconductor manufacturing
Grant 6,210,482 - Kitayama , et al. April 3, 2
2001-04-03
Semiconductor wafer boat and vertical heat treating system
Grant 6,095,806 - Suzuki , et al. August 1, 2
2000-08-01
Heat treating apparatus
Grant 5,622,639 - Kitayama , et al. April 22, 1
1997-04-22
Wafer boat
Grant D378,823 - Watanabe , et al. April 15, 1
1997-04-15
Substrate transferring apparatus
Grant 5,445,486 - Kitayama , et al. August 29, 1
1995-08-29
Vertical boat used for heat treatment of semiconductor wafer and vertical heat treatment apparatus
Grant 5,316,472 - Niino , et al. May 31, 1
1994-05-31
Vertical wafer heat treatment apparatus having dual load lock chambers
Grant 5,217,501 - Fuse , et al. June 8, 1
1993-06-08
Vertical heat treatment apparatus having wafer transfer mechanism and method for transferring wafers
Grant 5,162,047 - Wada , et al. November 10, 1
1992-11-10
Vertical heat-treatment apparatus having a wafer transfer mechanism
Grant 5,110,248 - Asano , et al. May 5, 1
1992-05-05
Substrate transfer device
Grant 5,030,056 - Kitayama , et al. July 9, 1
1991-07-09
Apparatus for reaction treatment
Grant 4,989,540 - Fuse , et al. February 5, 1
1991-02-05

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