Kinsman; Larry D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kinsman; Larry D..The latest application filed is for "multi-chip package for imaging systems".

Company Profile

0.144.117

Kinsman; Larry D. - Boise ID US
Kinsman; Larry D. - Kuna ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-chip package for imaging systems Grant 8,981,511 - Kinsman , et al. March 17, 2	2015-03-17
Multi-chip Package For Imaging Systems App 20130221470 - Kinsman; Larry D. ; et al.	2013-08-29
Electronic device package with an optical device Grant 8,097,895 - Kinsman January 17, 2	2012-01-17
256 Meg dynamic random access memory App 20110261628 - Keeth; Brent ; et al.	2011-10-27
256 Meg dynamic random access memory Grant 7,969,810 - Keeth , et al. June 28, 2	2011-06-28
Vertical Surface Mount Assembly And Methods App 20110101514 - Kinsman; Larry D. ; et al.	2011-05-05
Vertical surface mount assembly and methods Grant 7,871,859 - Kinsman , et al. January 18, 2	2011-01-18
Stackable ceramic FBGA for high thermal applications Grant 7,829,991 - Moden , et al. November 9, 2	2010-11-09
Method for fabricating a chip scale package using wafer level processing Grant 7,727,858 - Kinsman , et al. June 1, 2	2010-06-01
Electronic Device Packages And Methods Of Fabricating Electronic Device Packages App 20100052086 - Kinsman; Larry D.	2010-03-04
Methods of fabrication for flip-chip image sensor packages Grant 7,638,813 - Kinsman December 29, 2	2009-12-29
Bumped die and wire bonded board-on-chip package Grant 7,629,686 - Kinsman December 8, 2	2009-12-08
256 Meg dynamic random access memory App 20090245009 - Keeth; Brent ; et al.	2009-10-01
Methods for securing packaged semiconductor devices to carrier substrates Grant 7,569,418 - Kinsman , et al. August 4, 2	2009-08-04
Optically interactive device package array Grant 7,541,658 - Kinsman June 2, 2	2009-06-02
Reduced-dimension Microelectronic Component Assemblies With Wire Bonds And Methods Of Making Same App 20080296781 - Kinsman; Larry D.	2008-12-04
Flip-chip image sensor packages Grant 7,443,038 - Kinsman October 28, 2	2008-10-28
Assembly for stacked BGA packages Grant 7,408,255 - Corisis , et al. August 5, 2	2008-08-05
Module assembly for stacked BGA packages Grant 7,400,032 - Corisis , et al. July 15, 2	2008-07-15
Module assembly and method for stacked BGA packages Grant 7,396,702 - Corisis , et al. July 8, 2	2008-07-08
Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same Grant 7,385,298 - Kinsman June 10, 2	2008-06-10
Stackable Ceramic Fbga For High Thermal Applications App 20080042252 - Moden; Walter L. ; et al.	2008-02-21
Microelectronic devices and methods for packaging microelectronic devices Grant 7,321,455 - Kinsman January 22, 2	2008-01-22
Stackable ceramic FBGA for high thermal applications Grant 7,285,442 - Moden , et al. October 23, 2	2007-10-23
Back-to-back semiconductor device assemblies Grant 7,282,789 - Kinsman October 16, 2	2007-10-16
Module assembly and method for stacked BGA packages Grant 7,279,797 - Corisis , et al. October 9, 2	2007-10-09
Double-packaged multi-chip semiconductor module Grant 7,259,450 - Wood , et al. August 21, 2	2007-08-21
Method for fabricating a chip scale package using wafer level processing App 20070148918 - Kinsman; Larry D. ; et al.	2007-06-28
Vertical surface mount assembly and methods Grant 7,227,261 - Kinsman , et al. June 5, 2	2007-06-05
Semiconductor device package and method Grant 7,214,566 - Wood , et al. May 8, 2	2007-05-08
Method for fabricating a chip scale package using wafer level processing Grant 7,183,191 - Kinsman , et al. February 27, 2	2007-02-27
Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same App 20070029681 - Kinsman; Larry D.	2007-02-08
Bumped die and wire bonded board-on-chip package App 20070013084 - Kinsman; Larry D.	2007-01-18
Assembly method for semiconductor die and lead frame App 20070000599 - Kinsman; Larry D. ; et al.	2007-01-04
Methods of flip-chip image sensor package fabrication App 20060292732 - Kinsman; Larry D.	2006-12-28
Semiconductor package having exposed heat dissipating surface and method of fabrication Grant 7,151,013 - Corisis , et al. December 19, 2	2006-12-19
Varied-thickness heat sink for integrated circuit (IC) package App 20060267184 - Kinsman; Larry D. ; et al.	2006-11-30
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages Grant 7,125,749 - Kinsman , et al. October 24, 2	2006-10-24
Methods of fabrication for flip-chip image sensor packages Grant 7,122,390 - Kinsman October 17, 2	2006-10-17
Bumped die and wire bonded board-on-chip package Grant 7,116,001 - Kinsman October 3, 2	2006-10-03
Bumped die and wire bonded board-on-chip package Grant 7,115,990 - Kinsman October 3, 2	2006-10-03
Assembly method for semiconductor die and lead frame Grant 7,112,252 - Kinsman , et al. September 26, 2	2006-09-26
Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same Grant 7,095,122 - Kinsman August 22, 2	2006-08-22
Semiconductor device, ball grid array connection system, and method of making Grant 7,091,622 - Kinsman , et al. August 15, 2	2006-08-15
Methods for modifying a vertical surface mount package Grant 7,082,681 - Kinsman , et al. August 1, 2	2006-08-01
Methods of fabrication for flip-chip image sensor packages App 20060154405 - Kinsman; Larry D.	2006-07-13
Methods for securing vertically mountable semiconductor devices in back-to back relation Grant 7,057,291 - Kinsman June 6, 2	2006-06-06
Module assembly and method for stacked BGA packages App 20060060957 - Corisis; David J. ; et al.	2006-03-23
Methods of utilizing a back to back semiconductor device module Grant 7,015,063 - Kinsman March 21, 2	2006-03-21
Module assembly and method for stacked BGA packages App 20060051953 - Corisis; David J. ; et al.	2006-03-09
Module assembly and method for stacked BGA packages App 20060049504 - Corisis; David J. ; et al.	2006-03-09
Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same App 20060043611 - Kinsman; Larry D.	2006-03-02
Vertically mountable and alignable semiconductor device packages and assemblies including the same App 20060033190 - Kinsman; Larry D. ; et al.	2006-02-16
Method for burn-in testing semiconductor dice Grant 6,998,860 - Wood , et al. February 14, 2	2006-02-14
Methods for securing packaged semiconductor devices to carrier substrates App 20060030072 - Kinsman; Larry D. ; et al.	2006-02-09
Semiconductor device packages including leads with substantially planar exposed portions extending from bottom edges of the packages, and assemblies including the packages App 20060001155 - Kinsman; Larry D. ; et al.	2006-01-05
Alignment devices for securing semiconductor devices to carrier substrates, and assemblies including the alignment devices App 20060001150 - Kinsman; Larry D. ; et al.	2006-01-05
Chip size image sensor camera module Grant 6,979,902 - Kinsman December 27, 2	2005-12-27
Method of fabricating a tape having apertures under a lead frame for conventional IC packages Grant 6,979,596 - Corisis , et al. December 27, 2	2005-12-27
Interconnections for a semiconductor device Grant 6,974,725 - Moden , et al. December 13, 2	2005-12-13
Microelectronic devices and methods for packaging microelectronic devices App 20050255628 - Kinsman, Larry D.	2005-11-17
Methods of fabrication for flip-chip image sensor packages Grant 6,964,886 - Kinsman November 15, 2	2005-11-15
Vertically mountable and alignable semiconductor device assembly Grant 6,963,128 - Kinsman , et al. November 8, 2	2005-11-08
Flip-chip image sensor packages and methods of fabrication App 20050230844 - Kinsman, Larry D.	2005-10-20
Methods of fabrication for flip-chip image sensor packages App 20050233502 - Kinsman, Larry D.	2005-10-20
Flip-chip image sensor packages Grant 6,956,295 - Kinsman October 18, 2	2005-10-18
Chip Size Image Sensor Camera Module App 20050200012 - Kinsman, Larry D.	2005-09-15
Flip-chip image sensor packages and methods of fabrication Grant 6,940,141 - Kinsman September 6, 2	2005-09-06
Microelectronic devices and methods for packaging microelectronic devices Grant 6,934,065 - Kinsman August 23, 2	2005-08-23
Optically interactive device package array App 20050173811 - Kinsman, Larry D.	2005-08-11
Method for fabricating a chip scale package using wafer level processing App 20050164429 - Kinsman, Larry D. ; et al.	2005-07-28
Tape under frame for lead frame IC package assembly Grant 6,921,966 - Corisis , et al. July 26, 2	2005-07-26
Stackable ceramic FBGA for high thermal applications App 20050146010 - Moden, Walter L. ; et al.	2005-07-07
Semiconductor device package and method Grant 6,911,737 - Wood , et al. June 28, 2	2005-06-28
Semiconductor package and method producing same Grant 6,906,424 - Kinsman June 14, 2	2005-06-14
Method for fabricating a chip scale package using wafer level processing Grant 6,900,079 - Kinsman , et al. May 31, 2	2005-05-31
Module assembly and method for stacked BGA packages App 20050110135 - Corisis, David J. ; et al.	2005-05-26
Tape under frame for lead frame IC package assembly Grant 6,894,372 - Corisis , et al. May 17, 2	2005-05-17
Flip-chip image sensor packages and methods of fabrication Grant 6,885,107 - Kinsman April 26, 2	2005-04-26
Vertical surface mount package utilizing a back-to-back semiconductor device module Grant 6,873,037 - Kinsman March 29, 2	2005-03-29
Microelectronic devices and methods for packaging microelectronic devices App 20050063033 - Kinsman, Larry D.	2005-03-24
Back-to-back semiconductor device assemblies App 20050040511 - Kinsman, Larry D.	2005-02-24
Stackable ceramic FBGA for high thermal applications Grant 6,858,926 - Moden , et al. February 22, 2	2005-02-22
Methods for securing vertically mountable semiconductor devices in back-to back relation App 20050032274 - Kinsman, Larry D.	2005-02-10
Module assembly for stacked BGA packages Grant 6,838,768 - Corisis , et al. January 4, 2	2005-01-04
Semiconductor device, ball grid array connection system, and method of making App 20040262757 - Kinsman, Larry D. ; et al.	2004-12-30
Flip-chip image sensor packages Grant 6,833,612 - Kinsman December 21, 2	2004-12-21
Semiconductor device including edge bond pads and methods Grant 6,828,173 - Farnworth , et al. December 7, 2	2004-12-07
Semiconductor device including edge bond pads Grant 6,825,547 - Farnworth , et al. November 30, 2	2004-11-30
Semiconductor device including combed bond pad opening Grant 6,803,656 - Farnworth , et al. October 12, 2	2004-10-12
Semiconductor device including edge bond pads and related methods Grant 6,800,505 - Farnworth , et al. October 5, 2	2004-10-05
Vertically mountable semiconductor device and methods Grant 6,800,942 - Kinsman October 5, 2	2004-10-05
Low profile ball grid array package Grant 6,798,063 - Kinsman September 28, 2	2004-09-28
Circuit boards containing vias and methods for producing same Grant 6,797,616 - Kinsman September 28, 2	2004-09-28
Interconnections for a semiconductor device App 20040178512 - Moden, Walter L. ; et al.	2004-09-16
Bumped die and wire bonded board-on-chip package App 20040169278 - Kinsman, Larry D.	2004-09-02
Bumped die and wire bonded board-on-chip package App 20040169203 - Kinsman, Larry D.	2004-09-02
Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom Grant 6,780,746 - Kinsman , et al. August 24, 2	2004-08-24
Vertical surface mount apparatus with thermal carrier and method Grant 6,781,839 - Kinsman , et al. August 24, 2	2004-08-24
Semiconductor package and method producing same App 20040159942 - Kinsman, Larry D.	2004-08-19
Semiconductor device, ball grid array connection system, and method of making Grant 6,773,965 - Kinsman , et al. August 10, 2	2004-08-10
Circuit boards containing vias and methods for producing same Grant 6,774,486 - Kinsman August 10, 2	2004-08-10
Semiconductor device socket Grant 6,765,803 - Farnworth , et al. July 20, 2	2004-07-20
Heat sink with alignment and retaining features Grant 6,760,224 - Moden , et al. July 6, 2	2004-07-06
Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom App 20040126928 - Kinsman, Larry D. ; et al.	2004-07-01
Stackable ceramic FBGA for high thermal applications App 20040104408 - Moden, Walter L. ; et al.	2004-06-03
Bumped die and wire bonded board-on-chip package Grant 6,744,137 - Kinsman June 1, 2	2004-06-01
Structure and method for securing bussing leads Grant 6,737,734 - Brooks , et al. May 18, 2	2004-05-18
256 Meg dynamic random access memory Grant 6,735,102 - Keeth , et al. May 11, 2	2004-05-11
Vertically mountable interposer and assembly Grant 6,734,529 - Kinsman , et al. May 11, 2	2004-05-11
Interdigitated capacitor design for integrated circuit lead frames and methods Grant 6,730,994 - Kinsman May 4, 2	2004-05-04
Chip scale packages performed by wafer level processing Grant 6,717,245 - Kinsman , et al. April 6, 2	2004-04-06
Methods for stress reduction feature for LOC lead frame App 20040056336 - Kinsman, Larry D. ; et al.	2004-03-25
Flip-chip image sensor packages and methods of fabrication App 20040056365 - Kinsman, Larry D.	2004-03-25
Interconnections for a semiconductor device and method for forming same Grant 6,709,893 - Moden , et al. March 23, 2	2004-03-23
Flip-chip image sensor packages and methods of fabrication App 20040041247 - Kinsman, Larry D.	2004-03-04
Flip-chip image sensor packages and methods of fabrication App 20040041282 - Kinsman, Larry D.	2004-03-04
Flip-chip Image Sensor Packages And Methods Of Fabrication App 20040041261 - Kinsman, Larry D.	2004-03-04
Methods of fabrication for flip-chip image sensor packages App 20040043540 - Kinsman, Larry D.	2004-03-04
Stacked semiconductor package and method producing same Grant 6,700,206 - Kinsman March 2, 2	2004-03-02
Method and apparatus for coupling a semiconductor die to die terminals Grant 6,699,734 - Schoenfeld , et al. March 2, 2	2004-03-02
Vertical surface mount assembly and methods App 20040034997 - Kinsman, Larry D. ; et al.	2004-02-26
Optically interactive device packages and methods of assembly App 20040038442 - Kinsman, Larry D.	2004-02-26
Stacked Semiconductor Package And Method Producing Same App 20040021229 - Kinsman, Larry D.	2004-02-05
Vertically mountable interposer, assembly and method Grant 6,684,493 - Kinsman , et al. February 3, 2	2004-02-03
Methods for bumped die and wire bonded board-on-chip package Grant 6,682,998 - Kinsman January 27, 2	2004-01-27
Stackable ceramic fbga for high thermal applications Grant 6,650,007 - Moden , et al. November 18, 2	2003-11-18
Structure and method for securing bussing leads App 20030205789 - Brooks, Jerry M. ; et al.	2003-11-06
Vertical surface mount apparatus with thermal carrier and method App 20030198020 - Kinsman, Larry D. ; et al.	2003-10-23
Module assembly for stacked BGA packages App 20030197271 - Corisis, David J. ; et al.	2003-10-23
Methods for modifying a vertical surface mount package App 20030196323 - Kinsman, Larry D. ; et al.	2003-10-23
Methods for assembling, modifying and manufacturing a vertical surface mount package Grant 6,634,098 - Kinsman , et al. October 21, 2	2003-10-21
Stress reduction feature for LOC lead frame Grant 6,635,954 - Kinsman , et al. October 21, 2	2003-10-21
Method and apparatus for testing a semiconductor package Grant 6,628,136 - Roberts , et al. September 30, 2	2003-09-30
Methods for stress reduction feature for LOC lead frame Grant 6,610,162 - Kinsman , et al. August 26, 2	2003-08-26
Vertical surface mount assembly and methods Grant 6,611,058 - Kinsman , et al. August 26, 2	2003-08-26
Double-packaged multi-chip semiconductor module App 20030155649 - Wood, Alan G. ; et al.	2003-08-21
Low profile ball grid array package Grant 6,607,943 - Kinsman August 19, 2	2003-08-19
Method for bumped die and wire bonded board-on-chip package App 20030148599 - Kinsman, Larry D.	2003-08-07
256 Meg dynamic random access memory App 20030142559 - Keeth, Brent ; et al.	2003-07-31
Method and apparatus for coupling a semiconductor die to die terminals Grant 6,600,215 - Schoenfeld , et al. July 29, 2	2003-07-29
Heat sink with alignment and retaining features App 20030128523 - Moden, Walter L. ; et al.	2003-07-10
Method and apparatus for coupling a semiconductor die to die terminals App 20030113953 - Schoenfeld, Aaron ; et al.	2003-06-19
Vertically mountable and alignable semiconductor device assembly App 20030111718 - Kinsman, Larry D. ; et al.	2003-06-19
Tape under frame for lead frame IC package assembly App 20030107115 - Corisis, David J. ; et al.	2003-06-12
Tape under frame for lead frame IC package assembly App 20030102539 - Corisis, David J. ; et al.	2003-06-05
Vertical surface mount package utilizing a back-to-back semiconductor device module App 20030102558 - Kinsman, Larry D.	2003-06-05
Apparatus and methods of packaging and testing die Grant 6,558,966 - Mess , et al. May 6, 2	2003-05-06
Vertical surface mount assembly App 20030076667 - Kinsman, Larry D. ; et al.	2003-04-24
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages App 20030077853 - Kinsman, Larry D. ; et al.	2003-04-24
Circuit boards containing vias and methods for producing same App 20030068877 - Kinsman, Larry D.	2003-04-10
Circuit boards containing vias and methods for producing same App 20030067074 - Kinsman, Larry D.	2003-04-10
Interdigitated capacitor design for integrated circuit lead frames and method Grant 6,531,765 - Kinsman March 11, 2	2003-03-11
Heat sink with alignment and retaining features Grant 6,525,943 - Moden , et al. February 25, 2	2003-02-25
Thermally enhanced high density semiconductor package App 20030030152 - Corisis, David J. ; et al.	2003-02-13
Tape under frame for lead frame IC package assembly Grant 6,518,650 - Corisis , et al. February 11, 2	2003-02-11
256 Meg dynamic random access memory App 20030021136 - Keeth, Brent ; et al.	2003-01-30
Apparatus and methods of packaging and testing die Grant 6,512,302 - Mess , et al. January 28, 2	2003-01-28
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages Grant 6,506,629 - Kinsman , et al. January 14, 2	2003-01-14
Vertical surface mount package utilizing a back-to-back semiconductor device module Grant 6,507,109 - Kinsman January 14, 2	2003-01-14
Semiconductor device including edge bond pads assemblies including the same and related methods App 20030003689 - Farnworth, Warren M. ; et al.	2003-01-02
Interdigitated capacitor design for integrated circuit lead frames App 20030001245 - Kinsman, Larry D.	2003-01-02
Thermally enhanced high density semiconductor package App 20020185729 - Corisis, David J. ; et al.	2002-12-12
Vertical surface mount assembly and methods App 20020187626 - Kinsman, Larry D. ; et al.	2002-12-12
Semiconductor device socket, assembly and methods App 20020182920 - Farnworth, Warren M. ; et al.	2002-12-05
Vertical surface mount apparatus with thermal carrier App 20020176230 - Kinsman, Larry D. ; et al.	2002-11-28
Bumped Die And Wire Bonded Board-on-chip Package App 20020171142 - Kinsman, Larry D.	2002-11-21
Bumped die and wire bonded board-on-chip package App 20020171143 - Kinsman, Larry D.	2002-11-21
Semiconductor package having metal foil die mounting plate Grant 6,482,674 - Kinsman November 19, 2	2002-11-19
256 meg dynamic random access memory Grant 6,477,073 - Keeth , et al. November 5, 2	2002-11-05
Vertically mountable interposer, assembly and method App 20020149100 - Kinsman, Larry D. ; et al.	2002-10-17
256 meg dynamic random access memeory App 20020149957 - Keeth, Brent ; et al.	2002-10-17
Back-to-back semiconductor device module, assemblies including the same and methods App 20020146860 - Kinsman, Larry D.	2002-10-10
Vertical surface mount assembly and methods Grant 6,455,351 - Kinsman , et al. September 24, 2	2002-09-24
Module assembly for stacked BGA packages App 20020125571 - Corisis, David J. ; et al.	2002-09-12
Semiconductor device, ball grid array connection system, and method of making App 20020121688 - Kinsman, Larry D. ; et al.	2002-09-05
Semiconductor device including edge bond pads and methods App 20020121677 - Farnworth, Warren M. ; et al.	2002-09-05
Semiconductor device including edge bond pads and methods App 20020123171 - Farnworth, Warren M. ; et al.	2002-09-05
Semiconductor device including edge bond pads and methods App 20020119596 - Farnworth, Warren M. ; et al.	2002-08-29
Semiconductor device socket, assembly and methods Grant 6,442,044 - Farnworth , et al. August 27, 2	2002-08-27
Stress reduction feature for LOC lead frame App 20020113299 - Kinsman, Larry D. ; et al.	2002-08-22
Vertically mountable interposer, assembly and method App 20020095786 - Kinsman, Larry D. ; et al.	2002-07-25
Tape under frame for conventional-type IC package assembly App 20020098624 - Corisis, David J. ; et al.	2002-07-25
Semiconductor device including edge bond pads and methods Grant 6,414,374 - Farnworth , et al. July 2, 2	2002-07-02
Module assembly for stacked BGA packages with a common bus bar in the assembly Grant 6,414,391 - Corisis , et al. July 2, 2	2002-07-02
Semiconductor device including edge bond pads and methods Grant 6,410,406 - Farnworth , et al. June 25, 2	2002-06-25
Interdigitated capacitor design for integrated circuit lead frames App 20020074632 - Kinsman, Larry D.	2002-06-20
Vertical surface mount package utilizing a back-to-back semiconductor device module App 20020070447 - Kinsman, Larry D.	2002-06-13
Vertical surface mount package utilizing a back-to-back semiconductor device module Grant 6,380,630 - Kinsman April 30, 2	2002-04-30
Apparatus and methods of packaging and testing die Grant 6,380,631 - Mess , et al. April 30, 2	2002-04-30
Apparatus and methods of packaging and testing die App 20020043658 - Mess, Leonard E. ; et al.	2002-04-18
Semiconductor device, ball grid array connection system, and method of making Grant 6,372,552 - Kinsman , et al. April 16, 2	2002-04-16
Interconnections for a semiconductor device and method for forming same App 20020041034 - Moden, Walter L. ; et al.	2002-04-11
Vertically mountable semiconductor device and methods App 20020031857 - Kinsman, Larry D.	2002-03-14
Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom App 20020027257 - Kinsman, Larry D. ; et al.	2002-03-07
Low profile ball grid array package App 20020024123 - Kinsman, Larry D.	2002-02-28
Heat sink with alignment and retaining features App 20020024798 - Moden, Walter L. ; et al.	2002-02-28
Method And Apparatus For Testing A Semiconductor Package App 20020024350 - ROBERTS, STUART L. ; et al.	2002-02-28
Vertically mountable semiconductor device, assembly, and methods App 20020008310 - Kinsman, Larry D. ; et al.	2002-01-24
Vertical surface mount apparatus with thermal carrier App 20020003694 - Kinsman, Larry D. ; et al.	2002-01-10
Method Of Connecting A Die In An Integrated Circuit Module App 20020003301 - FARNWORTH, WARREN M. ; et al.	2002-01-10
Method and apparatus for coupling a semiconductor die to die terminals App 20010052638 - Schoenfeld, Aaron ; et al.	2001-12-20
Semiconductor device package and method App 20010052642 - Wood, Alan G. ; et al.	2001-12-20
Semiconductor device including combed bond pad opening, assemblies and methods App 20010050845 - Farnworth, Warren M. ; et al.	2001-12-13
Stackable ceramic fbga for high thermal applications App 20010048152 - Moden, Walter L. ; et al.	2001-12-06
Interdigitated capacitor design for integrated circuit lead frames App 20010045631 - Kinsman, Larry D.	2001-11-29
Apparatus and methods of packaging and testing die App 20010040279 - Mess, Leonard E. ; et al.	2001-11-15
256 Meg dynamic random access memory Grant 6,314,011 - Keeth , et al. November 6, 2	2001-11-06
Apparatus and methods of packaging and testing die App 20010026013 - Mess, Leonard E. ; et al.	2001-10-04
Vertically mountable and alignable semiconductor device, assembly, and methods App 20010026023 - Kinsman, Larry D. ; et al.	2001-10-04
Stackable ceramic FBGA for high thermal applications Grant 6,297,548 - Moden , et al. October 2, 2	2001-10-02
Heat sink with alignment and retaining features Grant 6,297,960 - Moden , et al. October 2, 2	2001-10-02
Apparatus and methods of packaging and testing die Grant 6,294,839 - Mess , et al. September 25, 2	2001-09-25
Semiconductor device including combed bond pad opening, assemblies and methods Grant 6,295,209 - Farnworth , et al. September 25, 2	2001-09-25
Semiconductor device including edge bond pads and methods App 20010022393 - Farnworth, Warren M. ; et al.	2001-09-20
Tape under frame for conventional-type IC package assembly App 20010015479 - Corisis, David J. ; et al.	2001-08-23
Hybrid frame with lead-lock tape App 20010016373 - Brooks, Jerry M. ; et al.	2001-08-23
Back-to-back Semiconductor Device Module, Assemblies Including The Same And Methods App 20010014489 - KINSMAN, LARRY D.	2001-08-16
Vertically mountable semiconductor device and methods App 20010012638 - Kinsman, Larry D.	2001-08-09
Vertical surface mount assembly and methods App 20010011769 - Kinsman, Larry D. ; et al.	2001-08-09
Vertical surface mount assembly and methods App 20010010399 - Kinsman, Larry D. ; et al.	2001-08-02
Vertical surface mount assembly and methods App 20010009781 - Kinsman, Larry D. ; et al.	2001-07-26
Vertically mountable and alignable semiconductor device, assembly, and methods Grant 6,265,773 - Kinsman , et al. July 24, 2	2001-07-24
Downset lead frame for semiconductor packages Grant 6,246,110 - Kinsman , et al. June 12, 2	2001-06-12
Vertically mountable semiconductor device and methods Grant 6,239,012 - Kinsman May 29, 2	2001-05-29
Semiconductor device including edge bond pads and methods Grant 6,235,551 - Farnworth , et al. May 22, 2	2001-05-22
Semiconductor device socket, assembly and methods App 20010000304 - Farnworth, Warren M. ; et al.	2001-04-19
Tape under frame for conventional-type IC package assembly Grant 6,215,177 - Corisis , et al. April 10, 2	2001-04-10
Semiconductor package having metal foil die mounting plate Grant 6,215,175 - Kinsman April 10, 2	2001-04-10
Vertically mountable interposer assembly and method Grant 6,191,474 - Kinsman , et al. February 20, 2	2001-02-20
Low profile ball grid array package Grant 6,172,419 - Kinsman January 9, 2	2001-01-09
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages Grant 6,159,764 - Kinsman , et al. December 12, 2	2000-12-12
Multilayered lead frame for semiconductor package Grant 6,153,924 - Kinsman November 28, 2	2000-11-28
Vertical surface mount package utilizing a back-to-back semiconductor device module Grant 6,147,411 - Kinsman November 14, 2	2000-11-14
Vertically mountable semiconductor device and methods Grant 6,140,696 - Kinsman October 31, 2	2000-10-31
Increasing the gap between a lead frame and a semiconductor die Grant 6,133,068 - Kinsman October 17, 2	2000-10-17
Leadframe finger support Grant 6,121,673 - Kinsman September 19, 2	2000-09-19
Discrete die burn-in for nonpackaged die Grant 6,091,250 - Wood , et al. July 18, 2	2000-07-18
Discrete die burn-in for nonpackaged die Grant 6,091,251 - Wood , et al. July 18, 2	2000-07-18
Semiconductor device socket, assembly and methods Grant 6,088,237 - Farnworth , et al. July 11, 2	2000-07-11
Vertical surface mount assembly and methods Grant 6,087,723 - Kinsman , et al. July 11, 2	2000-07-11
Downset lead frame for semiconductor packages Grant 6,075,283 - Kinsman , et al. June 13, 2	2000-06-13
Hybrid frame with lead-lock tape Grant 6,008,531 - Brooks , et al. December 28, 1	1999-12-28
Multilayered lead frame for semiconductor packages Grant 6,002,165 - Kinsman December 14, 1	1999-12-14
Method for evacuating and sealing field emission displays Grant 5,997,378 - Dynka , et al. December 7, 1	1999-12-07
Semiconductor device socket, assembly and methods Grant 5,995,378 - Farnworth , et al. November 30, 1	1999-11-30
Leadframe finger support Grant 5,930,602 - Kinsman July 27, 1	1999-07-27
Reduced stress LOC assembly including cantilevered leads Grant 5,872,398 - King , et al. February 16, 1	1999-02-16
Field emission display package and method of fabrication Grant 5,788,551 - Dynka , et al. August 4, 1	1998-08-04
Semiconductor package Grant 5,789,803 - Kinsman August 4, 1	1998-08-04
Tape under frame for conventional-type IC package assembly Grant 5,729,049 - Corisis , et al. March 17, 1	1998-03-17
Method for evacuating and sealing field emission displays Grant 5,697,825 - Dynka , et al. December 16, 1	1997-12-16
Method for packaging a semiconductor die Grant 5,696,033 - Kinsman December 9, 1	1997-12-09
Method of forming "J" leads on a semiconductor device Grant 5,375,320 - Kinsman , et al. December 27, 1	1994-12-27
Soft bond for semiconductor dies Grant 5,342,807 - Kinsman , et al. * August 30, 1	1994-08-30
Discrete die burn-in for non-packaged die Grant 5,302,891 - Wood , et al. April 12, 1	1994-04-12
Soft bond for semiconductor dies Grant 5,173,451 - Kinsman , et al. December 22, 1	1992-12-22
Packaging for a semiconductor die Grant 5,155,067 - Wood , et al. October 13, 1	1992-10-13
Method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser Grant 4,914,269 - Kinsman , et al. April 3, 1	1990-04-03

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