Patent | Date |
---|
Multi-chip package for imaging systems Grant 8,981,511 - Kinsman , et al. March 17, 2 | 2015-03-17 |
Multi-chip Package For Imaging Systems App 20130221470 - Kinsman; Larry D. ;   et al. | 2013-08-29 |
Electronic device package with an optical device Grant 8,097,895 - Kinsman January 17, 2 | 2012-01-17 |
256 Meg dynamic random access memory App 20110261628 - Keeth; Brent ;   et al. | 2011-10-27 |
256 Meg dynamic random access memory Grant 7,969,810 - Keeth , et al. June 28, 2 | 2011-06-28 |
Vertical Surface Mount Assembly And Methods App 20110101514 - Kinsman; Larry D. ;   et al. | 2011-05-05 |
Vertical surface mount assembly and methods Grant 7,871,859 - Kinsman , et al. January 18, 2 | 2011-01-18 |
Stackable ceramic FBGA for high thermal applications Grant 7,829,991 - Moden , et al. November 9, 2 | 2010-11-09 |
Method for fabricating a chip scale package using wafer level processing Grant 7,727,858 - Kinsman , et al. June 1, 2 | 2010-06-01 |
Electronic Device Packages And Methods Of Fabricating Electronic Device Packages App 20100052086 - Kinsman; Larry D. | 2010-03-04 |
Methods of fabrication for flip-chip image sensor packages Grant 7,638,813 - Kinsman December 29, 2 | 2009-12-29 |
Bumped die and wire bonded board-on-chip package Grant 7,629,686 - Kinsman December 8, 2 | 2009-12-08 |
256 Meg dynamic random access memory App 20090245009 - Keeth; Brent ;   et al. | 2009-10-01 |
Methods for securing packaged semiconductor devices to carrier substrates Grant 7,569,418 - Kinsman , et al. August 4, 2 | 2009-08-04 |
Optically interactive device package array Grant 7,541,658 - Kinsman June 2, 2 | 2009-06-02 |
Reduced-dimension Microelectronic Component Assemblies With Wire Bonds And Methods Of Making Same App 20080296781 - Kinsman; Larry D. | 2008-12-04 |
Flip-chip image sensor packages Grant 7,443,038 - Kinsman October 28, 2 | 2008-10-28 |
Assembly for stacked BGA packages Grant 7,408,255 - Corisis , et al. August 5, 2 | 2008-08-05 |
Module assembly for stacked BGA packages Grant 7,400,032 - Corisis , et al. July 15, 2 | 2008-07-15 |
Module assembly and method for stacked BGA packages Grant 7,396,702 - Corisis , et al. July 8, 2 | 2008-07-08 |
Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same Grant 7,385,298 - Kinsman June 10, 2 | 2008-06-10 |
Stackable Ceramic Fbga For High Thermal Applications App 20080042252 - Moden; Walter L. ;   et al. | 2008-02-21 |
Microelectronic devices and methods for packaging microelectronic devices Grant 7,321,455 - Kinsman January 22, 2 | 2008-01-22 |
Stackable ceramic FBGA for high thermal applications Grant 7,285,442 - Moden , et al. October 23, 2 | 2007-10-23 |
Back-to-back semiconductor device assemblies Grant 7,282,789 - Kinsman October 16, 2 | 2007-10-16 |
Module assembly and method for stacked BGA packages Grant 7,279,797 - Corisis , et al. October 9, 2 | 2007-10-09 |
Double-packaged multi-chip semiconductor module Grant 7,259,450 - Wood , et al. August 21, 2 | 2007-08-21 |
Method for fabricating a chip scale package using wafer level processing App 20070148918 - Kinsman; Larry D. ;   et al. | 2007-06-28 |
Vertical surface mount assembly and methods Grant 7,227,261 - Kinsman , et al. June 5, 2 | 2007-06-05 |
Semiconductor device package and method Grant 7,214,566 - Wood , et al. May 8, 2 | 2007-05-08 |
Method for fabricating a chip scale package using wafer level processing Grant 7,183,191 - Kinsman , et al. February 27, 2 | 2007-02-27 |
Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same App 20070029681 - Kinsman; Larry D. | 2007-02-08 |
Bumped die and wire bonded board-on-chip package App 20070013084 - Kinsman; Larry D. | 2007-01-18 |
Assembly method for semiconductor die and lead frame App 20070000599 - Kinsman; Larry D. ;   et al. | 2007-01-04 |
Methods of flip-chip image sensor package fabrication App 20060292732 - Kinsman; Larry D. | 2006-12-28 |
Semiconductor package having exposed heat dissipating surface and method of fabrication Grant 7,151,013 - Corisis , et al. December 19, 2 | 2006-12-19 |
Varied-thickness heat sink for integrated circuit (IC) package App 20060267184 - Kinsman; Larry D. ;   et al. | 2006-11-30 |
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages Grant 7,125,749 - Kinsman , et al. October 24, 2 | 2006-10-24 |
Methods of fabrication for flip-chip image sensor packages Grant 7,122,390 - Kinsman October 17, 2 | 2006-10-17 |
Bumped die and wire bonded board-on-chip package Grant 7,116,001 - Kinsman October 3, 2 | 2006-10-03 |
Bumped die and wire bonded board-on-chip package Grant 7,115,990 - Kinsman October 3, 2 | 2006-10-03 |
Assembly method for semiconductor die and lead frame Grant 7,112,252 - Kinsman , et al. September 26, 2 | 2006-09-26 |
Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same Grant 7,095,122 - Kinsman August 22, 2 | 2006-08-22 |
Semiconductor device, ball grid array connection system, and method of making Grant 7,091,622 - Kinsman , et al. August 15, 2 | 2006-08-15 |
Methods for modifying a vertical surface mount package Grant 7,082,681 - Kinsman , et al. August 1, 2 | 2006-08-01 |
Methods of fabrication for flip-chip image sensor packages App 20060154405 - Kinsman; Larry D. | 2006-07-13 |
Methods for securing vertically mountable semiconductor devices in back-to back relation Grant 7,057,291 - Kinsman June 6, 2 | 2006-06-06 |
Module assembly and method for stacked BGA packages App 20060060957 - Corisis; David J. ;   et al. | 2006-03-23 |
Methods of utilizing a back to back semiconductor device module Grant 7,015,063 - Kinsman March 21, 2 | 2006-03-21 |
Module assembly and method for stacked BGA packages App 20060051953 - Corisis; David J. ;   et al. | 2006-03-09 |
Module assembly and method for stacked BGA packages App 20060049504 - Corisis; David J. ;   et al. | 2006-03-09 |
Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same App 20060043611 - Kinsman; Larry D. | 2006-03-02 |
Vertically mountable and alignable semiconductor device packages and assemblies including the same App 20060033190 - Kinsman; Larry D. ;   et al. | 2006-02-16 |
Method for burn-in testing semiconductor dice Grant 6,998,860 - Wood , et al. February 14, 2 | 2006-02-14 |
Methods for securing packaged semiconductor devices to carrier substrates App 20060030072 - Kinsman; Larry D. ;   et al. | 2006-02-09 |
Semiconductor device packages including leads with substantially planar exposed portions extending from bottom edges of the packages, and assemblies including the packages App 20060001155 - Kinsman; Larry D. ;   et al. | 2006-01-05 |
Alignment devices for securing semiconductor devices to carrier substrates, and assemblies including the alignment devices App 20060001150 - Kinsman; Larry D. ;   et al. | 2006-01-05 |
Chip size image sensor camera module Grant 6,979,902 - Kinsman December 27, 2 | 2005-12-27 |
Method of fabricating a tape having apertures under a lead frame for conventional IC packages Grant 6,979,596 - Corisis , et al. December 27, 2 | 2005-12-27 |
Interconnections for a semiconductor device Grant 6,974,725 - Moden , et al. December 13, 2 | 2005-12-13 |
Microelectronic devices and methods for packaging microelectronic devices App 20050255628 - Kinsman, Larry D. | 2005-11-17 |
Methods of fabrication for flip-chip image sensor packages Grant 6,964,886 - Kinsman November 15, 2 | 2005-11-15 |
Vertically mountable and alignable semiconductor device assembly Grant 6,963,128 - Kinsman , et al. November 8, 2 | 2005-11-08 |
Flip-chip image sensor packages and methods of fabrication App 20050230844 - Kinsman, Larry D. | 2005-10-20 |
Methods of fabrication for flip-chip image sensor packages App 20050233502 - Kinsman, Larry D. | 2005-10-20 |
Flip-chip image sensor packages Grant 6,956,295 - Kinsman October 18, 2 | 2005-10-18 |
Chip Size Image Sensor Camera Module App 20050200012 - Kinsman, Larry D. | 2005-09-15 |
Flip-chip image sensor packages and methods of fabrication Grant 6,940,141 - Kinsman September 6, 2 | 2005-09-06 |
Microelectronic devices and methods for packaging microelectronic devices Grant 6,934,065 - Kinsman August 23, 2 | 2005-08-23 |
Optically interactive device package array App 20050173811 - Kinsman, Larry D. | 2005-08-11 |
Method for fabricating a chip scale package using wafer level processing App 20050164429 - Kinsman, Larry D. ;   et al. | 2005-07-28 |
Tape under frame for lead frame IC package assembly Grant 6,921,966 - Corisis , et al. July 26, 2 | 2005-07-26 |
Stackable ceramic FBGA for high thermal applications App 20050146010 - Moden, Walter L. ;   et al. | 2005-07-07 |
Semiconductor device package and method Grant 6,911,737 - Wood , et al. June 28, 2 | 2005-06-28 |
Semiconductor package and method producing same Grant 6,906,424 - Kinsman June 14, 2 | 2005-06-14 |
Method for fabricating a chip scale package using wafer level processing Grant 6,900,079 - Kinsman , et al. May 31, 2 | 2005-05-31 |
Module assembly and method for stacked BGA packages App 20050110135 - Corisis, David J. ;   et al. | 2005-05-26 |
Tape under frame for lead frame IC package assembly Grant 6,894,372 - Corisis , et al. May 17, 2 | 2005-05-17 |
Flip-chip image sensor packages and methods of fabrication Grant 6,885,107 - Kinsman April 26, 2 | 2005-04-26 |
Vertical surface mount package utilizing a back-to-back semiconductor device module Grant 6,873,037 - Kinsman March 29, 2 | 2005-03-29 |
Microelectronic devices and methods for packaging microelectronic devices App 20050063033 - Kinsman, Larry D. | 2005-03-24 |
Back-to-back semiconductor device assemblies App 20050040511 - Kinsman, Larry D. | 2005-02-24 |
Stackable ceramic FBGA for high thermal applications Grant 6,858,926 - Moden , et al. February 22, 2 | 2005-02-22 |
Methods for securing vertically mountable semiconductor devices in back-to back relation App 20050032274 - Kinsman, Larry D. | 2005-02-10 |
Module assembly for stacked BGA packages Grant 6,838,768 - Corisis , et al. January 4, 2 | 2005-01-04 |
Semiconductor device, ball grid array connection system, and method of making App 20040262757 - Kinsman, Larry D. ;   et al. | 2004-12-30 |
Flip-chip image sensor packages Grant 6,833,612 - Kinsman December 21, 2 | 2004-12-21 |
Semiconductor device including edge bond pads and methods Grant 6,828,173 - Farnworth , et al. December 7, 2 | 2004-12-07 |
Semiconductor device including edge bond pads Grant 6,825,547 - Farnworth , et al. November 30, 2 | 2004-11-30 |
Semiconductor device including combed bond pad opening Grant 6,803,656 - Farnworth , et al. October 12, 2 | 2004-10-12 |
Semiconductor device including edge bond pads and related methods Grant 6,800,505 - Farnworth , et al. October 5, 2 | 2004-10-05 |
Vertically mountable semiconductor device and methods Grant 6,800,942 - Kinsman October 5, 2 | 2004-10-05 |
Low profile ball grid array package Grant 6,798,063 - Kinsman September 28, 2 | 2004-09-28 |
Circuit boards containing vias and methods for producing same Grant 6,797,616 - Kinsman September 28, 2 | 2004-09-28 |
Interconnections for a semiconductor device App 20040178512 - Moden, Walter L. ;   et al. | 2004-09-16 |
Bumped die and wire bonded board-on-chip package App 20040169278 - Kinsman, Larry D. | 2004-09-02 |
Bumped die and wire bonded board-on-chip package App 20040169203 - Kinsman, Larry D. | 2004-09-02 |
Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom Grant 6,780,746 - Kinsman , et al. August 24, 2 | 2004-08-24 |
Vertical surface mount apparatus with thermal carrier and method Grant 6,781,839 - Kinsman , et al. August 24, 2 | 2004-08-24 |
Semiconductor package and method producing same App 20040159942 - Kinsman, Larry D. | 2004-08-19 |
Semiconductor device, ball grid array connection system, and method of making Grant 6,773,965 - Kinsman , et al. August 10, 2 | 2004-08-10 |
Circuit boards containing vias and methods for producing same Grant 6,774,486 - Kinsman August 10, 2 | 2004-08-10 |
Semiconductor device socket Grant 6,765,803 - Farnworth , et al. July 20, 2 | 2004-07-20 |
Heat sink with alignment and retaining features Grant 6,760,224 - Moden , et al. July 6, 2 | 2004-07-06 |
Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom App 20040126928 - Kinsman, Larry D. ;   et al. | 2004-07-01 |
Stackable ceramic FBGA for high thermal applications App 20040104408 - Moden, Walter L. ;   et al. | 2004-06-03 |
Bumped die and wire bonded board-on-chip package Grant 6,744,137 - Kinsman June 1, 2 | 2004-06-01 |
Structure and method for securing bussing leads Grant 6,737,734 - Brooks , et al. May 18, 2 | 2004-05-18 |
256 Meg dynamic random access memory Grant 6,735,102 - Keeth , et al. May 11, 2 | 2004-05-11 |
Vertically mountable interposer and assembly Grant 6,734,529 - Kinsman , et al. May 11, 2 | 2004-05-11 |
Interdigitated capacitor design for integrated circuit lead frames and methods Grant 6,730,994 - Kinsman May 4, 2 | 2004-05-04 |
Chip scale packages performed by wafer level processing Grant 6,717,245 - Kinsman , et al. April 6, 2 | 2004-04-06 |
Methods for stress reduction feature for LOC lead frame App 20040056336 - Kinsman, Larry D. ;   et al. | 2004-03-25 |
Flip-chip image sensor packages and methods of fabrication App 20040056365 - Kinsman, Larry D. | 2004-03-25 |
Interconnections for a semiconductor device and method for forming same Grant 6,709,893 - Moden , et al. March 23, 2 | 2004-03-23 |
Flip-chip image sensor packages and methods of fabrication App 20040041247 - Kinsman, Larry D. | 2004-03-04 |
Flip-chip image sensor packages and methods of fabrication App 20040041282 - Kinsman, Larry D. | 2004-03-04 |
Flip-chip Image Sensor Packages And Methods Of Fabrication App 20040041261 - Kinsman, Larry D. | 2004-03-04 |
Methods of fabrication for flip-chip image sensor packages App 20040043540 - Kinsman, Larry D. | 2004-03-04 |
Stacked semiconductor package and method producing same Grant 6,700,206 - Kinsman March 2, 2 | 2004-03-02 |
Method and apparatus for coupling a semiconductor die to die terminals Grant 6,699,734 - Schoenfeld , et al. March 2, 2 | 2004-03-02 |
Vertical surface mount assembly and methods App 20040034997 - Kinsman, Larry D. ;   et al. | 2004-02-26 |
Optically interactive device packages and methods of assembly App 20040038442 - Kinsman, Larry D. | 2004-02-26 |
Stacked Semiconductor Package And Method Producing Same App 20040021229 - Kinsman, Larry D. | 2004-02-05 |
Vertically mountable interposer, assembly and method Grant 6,684,493 - Kinsman , et al. February 3, 2 | 2004-02-03 |
Methods for bumped die and wire bonded board-on-chip package Grant 6,682,998 - Kinsman January 27, 2 | 2004-01-27 |
Stackable ceramic fbga for high thermal applications Grant 6,650,007 - Moden , et al. November 18, 2 | 2003-11-18 |
Structure and method for securing bussing leads App 20030205789 - Brooks, Jerry M. ;   et al. | 2003-11-06 |
Vertical surface mount apparatus with thermal carrier and method App 20030198020 - Kinsman, Larry D. ;   et al. | 2003-10-23 |
Module assembly for stacked BGA packages App 20030197271 - Corisis, David J. ;   et al. | 2003-10-23 |
Methods for modifying a vertical surface mount package App 20030196323 - Kinsman, Larry D. ;   et al. | 2003-10-23 |
Methods for assembling, modifying and manufacturing a vertical surface mount package Grant 6,634,098 - Kinsman , et al. October 21, 2 | 2003-10-21 |
Stress reduction feature for LOC lead frame Grant 6,635,954 - Kinsman , et al. October 21, 2 | 2003-10-21 |
Method and apparatus for testing a semiconductor package Grant 6,628,136 - Roberts , et al. September 30, 2 | 2003-09-30 |
Methods for stress reduction feature for LOC lead frame Grant 6,610,162 - Kinsman , et al. August 26, 2 | 2003-08-26 |
Vertical surface mount assembly and methods Grant 6,611,058 - Kinsman , et al. August 26, 2 | 2003-08-26 |
Double-packaged multi-chip semiconductor module App 20030155649 - Wood, Alan G. ;   et al. | 2003-08-21 |
Low profile ball grid array package Grant 6,607,943 - Kinsman August 19, 2 | 2003-08-19 |
Method for bumped die and wire bonded board-on-chip package App 20030148599 - Kinsman, Larry D. | 2003-08-07 |
256 Meg dynamic random access memory App 20030142559 - Keeth, Brent ;   et al. | 2003-07-31 |
Method and apparatus for coupling a semiconductor die to die terminals Grant 6,600,215 - Schoenfeld , et al. July 29, 2 | 2003-07-29 |
Heat sink with alignment and retaining features App 20030128523 - Moden, Walter L. ;   et al. | 2003-07-10 |
Method and apparatus for coupling a semiconductor die to die terminals App 20030113953 - Schoenfeld, Aaron ;   et al. | 2003-06-19 |
Vertically mountable and alignable semiconductor device assembly App 20030111718 - Kinsman, Larry D. ;   et al. | 2003-06-19 |
Tape under frame for lead frame IC package assembly App 20030107115 - Corisis, David J. ;   et al. | 2003-06-12 |
Tape under frame for lead frame IC package assembly App 20030102539 - Corisis, David J. ;   et al. | 2003-06-05 |
Vertical surface mount package utilizing a back-to-back semiconductor device module App 20030102558 - Kinsman, Larry D. | 2003-06-05 |
Apparatus and methods of packaging and testing die Grant 6,558,966 - Mess , et al. May 6, 2 | 2003-05-06 |
Vertical surface mount assembly App 20030076667 - Kinsman, Larry D. ;   et al. | 2003-04-24 |
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages App 20030077853 - Kinsman, Larry D. ;   et al. | 2003-04-24 |
Circuit boards containing vias and methods for producing same App 20030068877 - Kinsman, Larry D. | 2003-04-10 |
Circuit boards containing vias and methods for producing same App 20030067074 - Kinsman, Larry D. | 2003-04-10 |
Interdigitated capacitor design for integrated circuit lead frames and method Grant 6,531,765 - Kinsman March 11, 2 | 2003-03-11 |
Heat sink with alignment and retaining features Grant 6,525,943 - Moden , et al. February 25, 2 | 2003-02-25 |
Thermally enhanced high density semiconductor package App 20030030152 - Corisis, David J. ;   et al. | 2003-02-13 |
Tape under frame for lead frame IC package assembly Grant 6,518,650 - Corisis , et al. February 11, 2 | 2003-02-11 |
256 Meg dynamic random access memory App 20030021136 - Keeth, Brent ;   et al. | 2003-01-30 |
Apparatus and methods of packaging and testing die Grant 6,512,302 - Mess , et al. January 28, 2 | 2003-01-28 |
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages Grant 6,506,629 - Kinsman , et al. January 14, 2 | 2003-01-14 |
Vertical surface mount package utilizing a back-to-back semiconductor device module Grant 6,507,109 - Kinsman January 14, 2 | 2003-01-14 |
Semiconductor device including edge bond pads assemblies including the same and related methods App 20030003689 - Farnworth, Warren M. ;   et al. | 2003-01-02 |
Interdigitated capacitor design for integrated circuit lead frames App 20030001245 - Kinsman, Larry D. | 2003-01-02 |
Thermally enhanced high density semiconductor package App 20020185729 - Corisis, David J. ;   et al. | 2002-12-12 |
Vertical surface mount assembly and methods App 20020187626 - Kinsman, Larry D. ;   et al. | 2002-12-12 |
Semiconductor device socket, assembly and methods App 20020182920 - Farnworth, Warren M. ;   et al. | 2002-12-05 |
Vertical surface mount apparatus with thermal carrier App 20020176230 - Kinsman, Larry D. ;   et al. | 2002-11-28 |
Bumped Die And Wire Bonded Board-on-chip Package App 20020171142 - Kinsman, Larry D. | 2002-11-21 |
Bumped die and wire bonded board-on-chip package App 20020171143 - Kinsman, Larry D. | 2002-11-21 |
Semiconductor package having metal foil die mounting plate Grant 6,482,674 - Kinsman November 19, 2 | 2002-11-19 |
256 meg dynamic random access memory Grant 6,477,073 - Keeth , et al. November 5, 2 | 2002-11-05 |
Vertically mountable interposer, assembly and method App 20020149100 - Kinsman, Larry D. ;   et al. | 2002-10-17 |
256 meg dynamic random access memeory App 20020149957 - Keeth, Brent ;   et al. | 2002-10-17 |
Back-to-back semiconductor device module, assemblies including the same and methods App 20020146860 - Kinsman, Larry D. | 2002-10-10 |
Vertical surface mount assembly and methods Grant 6,455,351 - Kinsman , et al. September 24, 2 | 2002-09-24 |
Module assembly for stacked BGA packages App 20020125571 - Corisis, David J. ;   et al. | 2002-09-12 |
Semiconductor device, ball grid array connection system, and method of making App 20020121688 - Kinsman, Larry D. ;   et al. | 2002-09-05 |
Semiconductor device including edge bond pads and methods App 20020121677 - Farnworth, Warren M. ;   et al. | 2002-09-05 |
Semiconductor device including edge bond pads and methods App 20020123171 - Farnworth, Warren M. ;   et al. | 2002-09-05 |
Semiconductor device including edge bond pads and methods App 20020119596 - Farnworth, Warren M. ;   et al. | 2002-08-29 |
Semiconductor device socket, assembly and methods Grant 6,442,044 - Farnworth , et al. August 27, 2 | 2002-08-27 |
Stress reduction feature for LOC lead frame App 20020113299 - Kinsman, Larry D. ;   et al. | 2002-08-22 |
Vertically mountable interposer, assembly and method App 20020095786 - Kinsman, Larry D. ;   et al. | 2002-07-25 |
Tape under frame for conventional-type IC package assembly App 20020098624 - Corisis, David J. ;   et al. | 2002-07-25 |
Semiconductor device including edge bond pads and methods Grant 6,414,374 - Farnworth , et al. July 2, 2 | 2002-07-02 |
Module assembly for stacked BGA packages with a common bus bar in the assembly Grant 6,414,391 - Corisis , et al. July 2, 2 | 2002-07-02 |
Semiconductor device including edge bond pads and methods Grant 6,410,406 - Farnworth , et al. June 25, 2 | 2002-06-25 |
Interdigitated capacitor design for integrated circuit lead frames App 20020074632 - Kinsman, Larry D. | 2002-06-20 |
Vertical surface mount package utilizing a back-to-back semiconductor device module App 20020070447 - Kinsman, Larry D. | 2002-06-13 |
Vertical surface mount package utilizing a back-to-back semiconductor device module Grant 6,380,630 - Kinsman April 30, 2 | 2002-04-30 |
Apparatus and methods of packaging and testing die Grant 6,380,631 - Mess , et al. April 30, 2 | 2002-04-30 |
Apparatus and methods of packaging and testing die App 20020043658 - Mess, Leonard E. ;   et al. | 2002-04-18 |
Semiconductor device, ball grid array connection system, and method of making Grant 6,372,552 - Kinsman , et al. April 16, 2 | 2002-04-16 |
Interconnections for a semiconductor device and method for forming same App 20020041034 - Moden, Walter L. ;   et al. | 2002-04-11 |
Vertically mountable semiconductor device and methods App 20020031857 - Kinsman, Larry D. | 2002-03-14 |
Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom App 20020027257 - Kinsman, Larry D. ;   et al. | 2002-03-07 |
Low profile ball grid array package App 20020024123 - Kinsman, Larry D. | 2002-02-28 |
Heat sink with alignment and retaining features App 20020024798 - Moden, Walter L. ;   et al. | 2002-02-28 |
Method And Apparatus For Testing A Semiconductor Package App 20020024350 - ROBERTS, STUART L. ;   et al. | 2002-02-28 |
Vertically mountable semiconductor device, assembly, and methods App 20020008310 - Kinsman, Larry D. ;   et al. | 2002-01-24 |
Vertical surface mount apparatus with thermal carrier App 20020003694 - Kinsman, Larry D. ;   et al. | 2002-01-10 |
Method Of Connecting A Die In An Integrated Circuit Module App 20020003301 - FARNWORTH, WARREN M. ;   et al. | 2002-01-10 |
Method and apparatus for coupling a semiconductor die to die terminals App 20010052638 - Schoenfeld, Aaron ;   et al. | 2001-12-20 |
Semiconductor device package and method App 20010052642 - Wood, Alan G. ;   et al. | 2001-12-20 |
Semiconductor device including combed bond pad opening, assemblies and methods App 20010050845 - Farnworth, Warren M. ;   et al. | 2001-12-13 |
Stackable ceramic fbga for high thermal applications App 20010048152 - Moden, Walter L. ;   et al. | 2001-12-06 |
Interdigitated capacitor design for integrated circuit lead frames App 20010045631 - Kinsman, Larry D. | 2001-11-29 |
Apparatus and methods of packaging and testing die App 20010040279 - Mess, Leonard E. ;   et al. | 2001-11-15 |
256 Meg dynamic random access memory Grant 6,314,011 - Keeth , et al. November 6, 2 | 2001-11-06 |
Apparatus and methods of packaging and testing die App 20010026013 - Mess, Leonard E. ;   et al. | 2001-10-04 |
Vertically mountable and alignable semiconductor device, assembly, and methods App 20010026023 - Kinsman, Larry D. ;   et al. | 2001-10-04 |
Stackable ceramic FBGA for high thermal applications Grant 6,297,548 - Moden , et al. October 2, 2 | 2001-10-02 |
Heat sink with alignment and retaining features Grant 6,297,960 - Moden , et al. October 2, 2 | 2001-10-02 |
Apparatus and methods of packaging and testing die Grant 6,294,839 - Mess , et al. September 25, 2 | 2001-09-25 |
Semiconductor device including combed bond pad opening, assemblies and methods Grant 6,295,209 - Farnworth , et al. September 25, 2 | 2001-09-25 |
Semiconductor device including edge bond pads and methods App 20010022393 - Farnworth, Warren M. ;   et al. | 2001-09-20 |
Tape under frame for conventional-type IC package assembly App 20010015479 - Corisis, David J. ;   et al. | 2001-08-23 |
Hybrid frame with lead-lock tape App 20010016373 - Brooks, Jerry M. ;   et al. | 2001-08-23 |
Back-to-back Semiconductor Device Module, Assemblies Including The Same And Methods App 20010014489 - KINSMAN, LARRY D. | 2001-08-16 |
Vertically mountable semiconductor device and methods App 20010012638 - Kinsman, Larry D. | 2001-08-09 |
Vertical surface mount assembly and methods App 20010011769 - Kinsman, Larry D. ;   et al. | 2001-08-09 |
Vertical surface mount assembly and methods App 20010010399 - Kinsman, Larry D. ;   et al. | 2001-08-02 |
Vertical surface mount assembly and methods App 20010009781 - Kinsman, Larry D. ;   et al. | 2001-07-26 |
Vertically mountable and alignable semiconductor device, assembly, and methods Grant 6,265,773 - Kinsman , et al. July 24, 2 | 2001-07-24 |
Downset lead frame for semiconductor packages Grant 6,246,110 - Kinsman , et al. June 12, 2 | 2001-06-12 |
Vertically mountable semiconductor device and methods Grant 6,239,012 - Kinsman May 29, 2 | 2001-05-29 |
Semiconductor device including edge bond pads and methods Grant 6,235,551 - Farnworth , et al. May 22, 2 | 2001-05-22 |
Semiconductor device socket, assembly and methods App 20010000304 - Farnworth, Warren M. ;   et al. | 2001-04-19 |
Tape under frame for conventional-type IC package assembly Grant 6,215,177 - Corisis , et al. April 10, 2 | 2001-04-10 |
Semiconductor package having metal foil die mounting plate Grant 6,215,175 - Kinsman April 10, 2 | 2001-04-10 |
Vertically mountable interposer assembly and method Grant 6,191,474 - Kinsman , et al. February 20, 2 | 2001-02-20 |
Low profile ball grid array package Grant 6,172,419 - Kinsman January 9, 2 | 2001-01-09 |
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages Grant 6,159,764 - Kinsman , et al. December 12, 2 | 2000-12-12 |
Multilayered lead frame for semiconductor package Grant 6,153,924 - Kinsman November 28, 2 | 2000-11-28 |
Vertical surface mount package utilizing a back-to-back semiconductor device module Grant 6,147,411 - Kinsman November 14, 2 | 2000-11-14 |
Vertically mountable semiconductor device and methods Grant 6,140,696 - Kinsman October 31, 2 | 2000-10-31 |
Increasing the gap between a lead frame and a semiconductor die Grant 6,133,068 - Kinsman October 17, 2 | 2000-10-17 |
Leadframe finger support Grant 6,121,673 - Kinsman September 19, 2 | 2000-09-19 |
Discrete die burn-in for nonpackaged die Grant 6,091,250 - Wood , et al. July 18, 2 | 2000-07-18 |
Discrete die burn-in for nonpackaged die Grant 6,091,251 - Wood , et al. July 18, 2 | 2000-07-18 |
Semiconductor device socket, assembly and methods Grant 6,088,237 - Farnworth , et al. July 11, 2 | 2000-07-11 |
Vertical surface mount assembly and methods Grant 6,087,723 - Kinsman , et al. July 11, 2 | 2000-07-11 |
Downset lead frame for semiconductor packages Grant 6,075,283 - Kinsman , et al. June 13, 2 | 2000-06-13 |
Hybrid frame with lead-lock tape Grant 6,008,531 - Brooks , et al. December 28, 1 | 1999-12-28 |
Multilayered lead frame for semiconductor packages Grant 6,002,165 - Kinsman December 14, 1 | 1999-12-14 |
Method for evacuating and sealing field emission displays Grant 5,997,378 - Dynka , et al. December 7, 1 | 1999-12-07 |
Semiconductor device socket, assembly and methods Grant 5,995,378 - Farnworth , et al. November 30, 1 | 1999-11-30 |
Leadframe finger support Grant 5,930,602 - Kinsman July 27, 1 | 1999-07-27 |
Reduced stress LOC assembly including cantilevered leads Grant 5,872,398 - King , et al. February 16, 1 | 1999-02-16 |
Field emission display package and method of fabrication Grant 5,788,551 - Dynka , et al. August 4, 1 | 1998-08-04 |
Semiconductor package Grant 5,789,803 - Kinsman August 4, 1 | 1998-08-04 |
Tape under frame for conventional-type IC package assembly Grant 5,729,049 - Corisis , et al. March 17, 1 | 1998-03-17 |
Method for evacuating and sealing field emission displays Grant 5,697,825 - Dynka , et al. December 16, 1 | 1997-12-16 |
Method for packaging a semiconductor die Grant 5,696,033 - Kinsman December 9, 1 | 1997-12-09 |
Method of forming "J" leads on a semiconductor device Grant 5,375,320 - Kinsman , et al. December 27, 1 | 1994-12-27 |
Soft bond for semiconductor dies Grant 5,342,807 - Kinsman , et al. * August 30, 1 | 1994-08-30 |
Discrete die burn-in for non-packaged die Grant 5,302,891 - Wood , et al. April 12, 1 | 1994-04-12 |
Soft bond for semiconductor dies Grant 5,173,451 - Kinsman , et al. December 22, 1 | 1992-12-22 |
Packaging for a semiconductor die Grant 5,155,067 - Wood , et al. October 13, 1 | 1992-10-13 |
Method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser Grant 4,914,269 - Kinsman , et al. April 3, 1 | 1990-04-03 |