Kim; Ung-Kwang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kim; Ung-Kwang.The latest application filed is for "chip stack package".
- Kim; Ung-Kwang - Yongin-si KR
| Patent | Date |
|---|---|
| Fabrication method of wafer level chip scale packages Grant 7,524,763 - Kim , et al. April 28, 2 | 2009-04-28 |
| Chip stack package App 20070200216 - Kim; Soon-Bum ; et al. | 2007-08-30 |
| Method for manufacturing wafer level chip stack package Grant 7,151,009 - Kim , et al. December 19, 2 | 2006-12-19 |
| Method for manufacturing wafer level chip stack package App 20050280160 - Kim, Soon-Bum ; et al. | 2005-12-22 |
| Fabrication method of wafer level chip scale packages App 20050277293 - Kim, Soon-Bum ; et al. | 2005-12-15 |
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