Kim; Kyung Moon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Kyung Moon.The latest application filed is for "apparatus and method for managing application".

Company Profile

2.22.20

Kim; Kyung Moon - Suwon-si KR
Kim; Kyung Moon - Seongnam KR
Kim; Kyung-Moon - Kyoung ki-do N/A KR
Kim; Kyung Moon - Youngin-si N/A KR
Kim; Kyung-Moon - Ichon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for managing application Grant 11,256,496 - Oh , et al. February 22, 2	2022-02-22
Apparatus And Method For Managing Application App 20200301697 - OH; Myeong Jin ; et al.	2020-09-24
Apparatus and method for managing application Grant 10,678,527 - Oh , et al.	2020-06-09
Integrated circuit packaging system with substrate and method of manufacture thereof Grant 10,109,587 - Cuong , et al. October 23, 2	2018-10-23
Integrated circuit packaging system with under bump metallization and method of manufacture thereof Grant 9,865,554 - Shim , et al. January 9, 2	2018-01-09
Integrated circuit packaging system with joint assembly and method of manufacture thereof Grant 9,748,157 - Chi , et al. August 29, 2	2017-08-29
Apparatus And Method For Managing Application App 20170115981 - OH; Myeong Jin ; et al.	2017-04-27
Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package Grant 9,312,150 - Ahmad , et al. April 12, 2	2016-04-12
Integrated Circuit Packaging System With Under Bump Metallization And Method Of Manufacture Thereof App 20160099222 - Shim; Il Kwon ; et al.	2016-04-07
Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof Grant 9,299,650 - Chi , et al. March 29, 2	2016-03-29
Integrated circuit packaging system with under bump metallization and method of manufacture thereof Grant 9,202,793 - Shim , et al. December 1, 2	2015-12-01
Methods of forming solder balls in semiconductor packages Grant 8,951,834 - Kim , et al. February 10, 2	2015-02-10
Flip chip interconnection system having solder position control mechanism Grant 8,604,624 - Kim , et al. December 10, 2	2013-12-10
Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package App 20130113093 - Ahmad; Nazir ; et al.	2013-05-09
Packaging Structure and Method App 20120217635 - Ahmad; Nazir ; et al.	2012-08-30
Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package App 20120049357 - Ahmad; Nazir ; et al.	2012-03-01
Integrated circuit mount system with solder mask pad Grant 8,124,520 - Kim , et al. February 28, 2	2012-02-28
Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots Grant 8,119,450 - Ahmad , et al. February 21, 2	2012-02-21
Packaging Structure and Method App 20120013005 - Ahmad; Nazir ; et al.	2012-01-19
Flip chip interconnection Grant 7,736,950 - Pendse , et al. June 15, 2	2010-06-15
Flip Chip Interconnection System App 20090236756 - Kim; Oh Han ; et al.	2009-09-24
Packaging Structure and Method App 20090227072 - Ahmad; Nazir ; et al.	2009-09-10
Flip chip interconnection App 20090045507 - Pendse; Rajendra D. ; et al.	2009-02-19
Self-coplanarity bumping shape for flip-chip Grant 7,407,877 - Kweon , et al. August 5, 2	2008-08-05
Integrated Circuit Mount System With Solder Mask Pad App 20080014738 - Kim; KyungOe ; et al.	2008-01-17
Self-coplanarity bumping shape for flip chip Grant 7,211,901 - Kweon , et al. May 1, 2	2007-05-01
Packaging structure and method App 20060255474 - Ahmad; Nazir ; et al.	2006-11-16
Self-coplanarity bumping shape for flip chip App 20050218515 - Kweon, Young-Do ; et al.	2005-10-06
Method for making self-coplanarity bumping shape for flip chip App 20050221535 - Kweon, Young-Do ; et al.	2005-10-06
Self-coplanarity bumping shape for flip chip Grant 6,940,178 - Kweon , et al. September 6, 2	2005-09-06
Chip scale package with flip chip interconnect App 20040222440 - Pendse, Rajendra ; et al.	2004-11-11
Chip scale package with flip chip interconnect Grant 6,737,295 - Pendse , et al. May 18, 2	2004-05-18
Self-coplanarity bumping shape for flip chip App 20020151228 - Kweon, Young-Do ; et al.	2002-10-17
Chip scale package with flip chip interconnect App 20020151189 - Pendse, Rajendra ; et al.	2002-10-17
Packaging structure and method App 20020014702 - Ahmad, Nazir ; et al.	2002-02-07

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