KIM; Hyeong-No
Patent Applications and Registrations
Patent applications and USPTO patent grants for KIM; Hyeong-No.The latest application filed is for "chip package".
- KIM; Hyeong-No - Kyunggi-Do KR
- Kim; Hyeong-No - Paju-Si KR
| Patent | Date |
|---|---|
| Chip Package App 20140346654 - CHOI; Soo-Min ; et al. | 2014-11-27 |
| Chip package Grant 8,866,280 - Choi , et al. October 21, 2 | 2014-10-21 |
| Stacked type chip package structure Grant 7,964,953 - Kim June 21, 2 | 2011-06-21 |
| Hybrid carrier and a method for making the same Grant 7,939,379 - Youn , et al. May 10, 2 | 2011-05-10 |
| Package and fabricating method thereof Grant 7,830,024 - Kim November 9, 2 | 2010-11-09 |
| Stacked Type Chip Package Structure App 20100096740 - Kim; Hyeong-No | 2010-04-22 |
| Stacked type chip package structure Grant 7,701,046 - Kim April 20, 2 | 2010-04-20 |
| Package and fabricating method thereof App 20100084772 - Kim; Hyeong-No | 2010-04-08 |
| Chip Package App 20090261470 - Choi; Soo-Min ; et al. | 2009-10-22 |
| Hybrid Carrier And A Method For Making The Same App 20090194858 - Youn; Sung-Ho ; et al. | 2009-08-06 |
| Stacked Type Chip Package Structure App 20080158844 - Kim; Hyeong-No | 2008-07-03 |
| Chip Package And Fabricating Process Thereof App 20080128890 - CHOI; SOO-MIN ; et al. | 2008-06-05 |
| Singulation method used in leadless packaging process Grant 7,205,658 - Lee , et al. April 17, 2 | 2007-04-17 |
| Process and lead frame for making leadless semiconductor packages App 20060033184 - Park; Hyung Jun ; et al. | 2006-02-16 |
| Singulation method used in leadless packaging process App 20050037618 - Lee, Jun Hong ; et al. | 2005-02-17 |
| Singulation method used in leadless packaging process Grant 6,773,961 - Lee , et al. August 10, 2 | 2004-08-10 |
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