KIM; Byeung Ho
Patent Applications and Registrations
Patent applications and USPTO patent grants for KIM; Byeung Ho.The latest application filed is for "method of manufacturing a flip chip package and an apparatus for testing flip chips".
- KIM; Byeung Ho - Cheongju-si Chungcheongbuk-do KR
- Kim; Byeung Ho - Cheongju-si KR
- Kim; Byeung Ho - Chungcheongbuk-do KR
| Patent | Date |
|---|---|
| Method Of Manufacturing A Flip Chip Package And An Apparatus For Testing Flip Chips App 20220037214 - CHUNG; Jee Won ; et al. | 2022-02-03 |
| Method of manufacturing a flip chip package and an apparatus for testing flip chips Grant 11,177,184 - Chung , et al. November 16, 2 | 2021-11-16 |
| Method Of Manufacturing A Flip Chip Package And An Apparatus For Testing Flip Chips App 20200357705 - CHUNG; Jee Won ; et al. | 2020-11-12 |
| Method for manufacturing a substrate for a semiconductor package Grant 8,298,865 - Jung , et al. October 30, 2 | 2012-10-30 |
| Substrate For Semiconductor Package, Method For Manufacturing The Same, And Semiconductor Package Having The Same App 20120118495 - JUNG; Young Berm ; et al. | 2012-05-17 |
| Substrate for semiconductor package Grant 8,125,086 - Jung , et al. February 28, 2 | 2012-02-28 |
| Substrate For Semiconductor Package, Method For Manufacturing The Same, And Semiconductor Package Having The Same App 20090294972 - JUNG; Young Berm ; et al. | 2009-12-03 |
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