Kim; Bioh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Bioh.The latest application filed is for "systems and methods for removing contaminants in electroplating systems".

Company Profile

0.10.22

Kim; Bioh - Andover MA
Kim; Bioh - Milford CT
Kim; Bioh - Kalispell MT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Systems And Methods For Removing Contaminants In Electroplating Systems App 20190345624 - Roh; Kwan Wook ; et al.	2019-11-14
Method Of Forming Metal And Metal Alloy Features App 20160355941 - Kim; Bioh ; et al.	2016-12-08
Method of forming metal and metal alloy features Grant 9,359,683 - Kim , et al. June 7, 2	2016-06-07
Electrolytic copper process using anion permeable barrier Grant 9,234,293 - Baskaran , et al. January 12, 2	2016-01-12
Electrolytic Copper Process Using Anion Permeable Barrier App 20150083600 - Baskaran; Rajesh ; et al.	2015-03-26
Electrolytic process using cation permeable barrier Grant 8,961,771 - Baskaran , et al. February 24, 2	2015-02-24
Electrolytic process using anion permeable barrier Grant 8,852,417 - Baskaran , et al. October 7, 2	2014-10-07
Methods For Electrochemical Deposition Of Multi-component Solder Using Cation Permeable Barrier App 20140246324 - Baskaran; Rajesh ; et al.	2014-09-04
Electrolytic Process Using Cation Permeable Barrier App 20140209472 - Baskaran; Rajesh ; et al.	2014-07-31
Electrolytic Process Using Cation Permeable Barrier App 20120292194 - Baskaran; Rajesh ; et al.	2012-11-22
Electrolytic process using cation permeable barrier Grant 8,236,159 - Baskaran , et al. August 7, 2	2012-08-07
Electrolytic Copper Process Using Anion Permeable Barrier App 20120152751 - Baskaran; Rajesh ; et al.	2012-06-21
Electrolytic copper process using anion permeable barrier Grant 8,123,926 - Baskaran , et al. February 28, 2	2012-02-28
Method And System For Depositing Alloy Composition App 20080067072 - Kim; Bioh ; et al.	2008-03-20
Method and system for depositing alloy composition App 20080041727 - Kim; Bioh ; et al.	2008-02-21
Electrolytic copper process using anion permeable barrier App 20070068820 - Baskaran; Rajesh ; et al.	2007-03-29
Copper electrolytic process using cation permeable barrier App 20060260946 - Baskaran; Rajesh ; et al.	2006-11-23
Method for applying metal features onto barrier layers using electrochemical deposition Grant 7,135,404 - Baskaran , et al. November 14, 2	2006-11-14
Electrolytic process using cation permeable barrier App 20060237323 - Baskaran; Rajesh ; et al.	2006-10-26
Method for applying metal features onto barrier layers using ion permeable barriers App 20060189129 - Baskaran; Rajesh ; et al.	2006-08-24
Electrolytic process using anion permeable barrier App 20060163072 - Baskaran; Rajesh ; et al.	2006-07-27
Electrolytic process using anion permeable barrier App 20060157355 - Baskaran; Rajesh ; et al.	2006-07-20
Method for applying metal features onto metallized layers using electrochemical deposition and alloy treatment App 20060084264 - Baskaran; Rajesh ; et al.	2006-04-20
Method for applying metal features onto metallized layers using electrochemical deposition using acid treatment App 20060079083 - Baskaran; Rajesh ; et al.	2006-04-13
Method for applying metal features onto metallized layers using electrochemical deposition App 20060079085 - Baskaran; Rajesh ; et al.	2006-04-13
Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatment App 20060079084 - Baskaran; Rajesh ; et al.	2006-04-13
Bath and method for high rate copper deposition App 20050092611 - Kim, Bioh ; et al.	2005-05-05
Processes and tools for forming lead-free alloy solder precursors App 20050085062 - Kim, Bioh	2005-04-21
Method for applying metal features onto barrier layers using electrochemical deposition App 20040072419 - Baskaran, Rajesh ; et al.	2004-04-15

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