Kent; Ian
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kent; Ian.The latest application filed is for "systems and methods for fluid leak detection".
- Kent; Ian - Chippenham GB
- Kent; Ian - Smyrna GA US
- Kent; Ian - Atlanta GA
- KENT; Ian - Nailsea North Somerset
- Kent; Ian - Calne GB
- Kent; Ian - Bristol N/A GB
- Kent; Ian - Thoiry FR
| Patent | Date |
|---|---|
| Very thin embedded trace substrate-system in package (SIP) Grant 11,309,255 - Belonio, Jr. , et al. April 19, 2 | 2022-04-19 |
| Wafer level chip scale package structure Grant 11,114,359 - Belonio, Jr. , et al. September 7, 2 | 2021-09-07 |
| Systems and methods for fluid flow meter integrated leak detection Grant 10,830,664 - Kent , et al. November 10, 2 | 2020-11-10 |
| Systems And Methods For Fluid Leak Detection App 20200264068 - Mess; Francis McCarthy ; et al. | 2020-08-20 |
| Very Thin Embedded Trace Substrate-System in Package (SIP) App 20200227356 - Belonio, JR.; Jesus Mennen ; et al. | 2020-07-16 |
| Systems And Methods For Fluid Flow Meter Integrated Leak Detection App 20200132565 - Kent; Ian ; et al. | 2020-04-30 |
| Very thin embedded trace substrate-system in package (SIP) Grant 10,636,742 - Belonio, Jr. , et al. | 2020-04-28 |
| Wafer Level Chip Scale Package Structure App 20200091026 - Belonio, JR.; Jesus Mennen ; et al. | 2020-03-19 |
| Silicon strip fan out system in package Grant 10,418,342 - Kent Sept | 2019-09-17 |
| Very Thin Embedded Trace Substrate-System in Package (SIP) App 20190096815 - Belonio, JR.; Jesus Mennen ; et al. | 2019-03-28 |
| Stress relief solutions on WLCSP large/bulk copper plane design Grant 10,083,926 - Kent , et al. September 25, 2 | 2018-09-25 |
| Subsea Safety Node App 20180230768 - DALZIEL; Robert ; et al. | 2018-08-16 |
| Chip on chip attach (passive IPD and PMIC) flip chip BGA using new cavity BGA substrate Grant 9,929,130 - Kent March 27, 2 | 2018-03-27 |
| WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded Component on Leadframe and Method Therefor App 20180025965 - Canete, JR.; Baltazar ; et al. | 2018-01-25 |
| Chip on Chip Attach (Passive IPD and PMIC) Flip Chip BGA Using New Cavity BGA Substrate App 20170040309 - Kent; Ian | 2017-02-09 |
| Communications connection in a subsea well Grant 9,097,090 - Davey , et al. August 4, 2 | 2015-08-04 |
| Embedded Heat Slug to Enhance Substrate Thermal Conductivity App 20140355215 - Canete; Baltazar ; et al. | 2014-12-04 |
| Chip on Chip Attach (Passive IPD and PMIC) Flip Chip BGA Using New Cavity BGA Substrate App 20140246773 - Kent; Ian | 2014-09-04 |
| Subsea electronics module and methods of loading software thereon Grant 8,692,686 - Davis , et al. April 8, 2 | 2014-04-08 |
| Shutdown system Grant 8,653,985 - Kent February 18, 2 | 2014-02-18 |
| Communications Connection In A Subsea Well App 20110181436 - Davey; Peter John ; et al. | 2011-07-28 |
| Subsea Well Control System App 20100207783 - Davis; Julian R. ; et al. | 2010-08-19 |
| Shutdown System App 20090079583 - Kent; Ian | 2009-03-26 |
| Electronics card communication App 20090029737 - Davis; Julian ; et al. | 2009-01-29 |
| Electronics Module App 20090031297 - Davis; Julian ; et al. | 2009-01-29 |
| Leadframe strip having enhanced testability Grant 7,008,825 - Bancod , et al. March 7, 2 | 2006-03-07 |
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