Kee; Cheng Sim
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kee; Cheng Sim.The latest application filed is for "multi-chip module and method of manufacture".
- Kee; Cheng Sim - Bayan Lepas MY
- Kee; Cheng Sim - Bayan Lepas Penang MY
- Kee; Cheng Sim - Penang MY
| Patent | Date |
|---|---|
| Multi-Chip Module and Method of Manufacture App 20140061895 - FOONG; Yin Lye ; et al. | 2014-03-06 |
| Multi-chip module having a support structure and method of manufacture Grant 8,586,413 - Foong , et al. November 19, 2 | 2013-11-19 |
| Die offset die to die bonding Grant 7,750,481 - Lai , et al. July 6, 2 | 2010-07-06 |
| Die offset die to bonding Grant 7,674,653 - Lai , et al. March 9, 2 | 2010-03-09 |
| Die offset die to die bonding Grant 7,554,204 - Lai , et al. June 30, 2 | 2009-06-30 |
| Die offset die to die bonding App 20090091043 - Lai; Nguk Chin ; et al. | 2009-04-09 |
| Die offset die to bonding App 20090093084 - Lai; Nguk Chin ; et al. | 2009-04-09 |
| Die Stacking In Multi-die Stacks Using Die Support Mechanisms App 20090051043 - Wong; Wai Loon ; et al. | 2009-02-26 |
| Die Attachment, Die Stacking, And Wire Embedding Using Film App 20090001599 - Foong; Sally ; et al. | 2009-01-01 |
| Process Applying Die Attach Film To Singulated Die App 20080318364 - Foong; Sally ; et al. | 2008-12-25 |
| Die offset die to die bonding App 20080308947 - Lai; Nguk Chin ; et al. | 2008-12-18 |
| Multi-chip module and method of manufacture App 20060249826 - Foong; Yin Lye ; et al. | 2006-11-09 |
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