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KAWASHIMA; Naoki Patent Filings

KAWASHIMA; Naoki

Patent Applications and Registrations

Patent applications and USPTO patent grants for KAWASHIMA; Naoki.The latest application filed is for "thermal barrier coating material and article".

Company Profile
2.14.22
  • KAWASHIMA; Naoki - Aichi JP
  • KAWASHIMA; Naoki - Tokyo JP
  • Kawashima; Naoki - Okazaki JP
  • Kawashima; Naoki - Okazaki-shi JP
  • Kawashima; Naoki - Nagoya-shi JP
  • Kawashima; Naoki - Nagoya JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thermal Barrier Coating Material And Article
App 20210199054 - MATSUDAIRA; Tsuneaki ;   et al.
2021-07-01
Rare Earth Magnets
App 20210065973 - YOKOTA; Kazuya ;   et al.
2021-03-04
Thermal Barrier Coating
App 20210047968 - MATSUDAIRA; Tsuneaki ;   et al.
2021-02-18
Vehicle door control device
Grant 10,311,663 - Yamagishi , et al.
2019-06-04
Vehicle Door Control Device
App 20180253921 - YAMAGISHI; Takashi ;   et al.
2018-09-06
Environmental barrier coating
Grant 10,011,724 - Nakamura , et al. July 3, 2
2018-07-03
Environmental Barrier Coating
App 20170190920 - NAKAMURA; Takeshi ;   et al.
2017-07-06
Vehicle
Grant 9,168,834 - Yashiro , et al. October 27, 2
2015-10-27
Power switching apparatus
Grant 9,162,576 - Yagura , et al. October 20, 2
2015-10-20
Remote control system for in-vehicle device
Grant 9,076,324 - Yashiro , et al. July 7, 2
2015-07-07
Vehicle
App 20140163777 - YASHIRO; Hiroyuki ;   et al.
2014-06-12
In-vehicle Device Controller
App 20140088827 - YASHIRO; Hiroyuki ;   et al.
2014-03-27
Remote Control System For In-vehicle Device
App 20140088794 - YASHIRO; Hiroyuki ;   et al.
2014-03-27
Power Switching Apparatus
App 20130076124 - Yagura; Hirofumi ;   et al.
2013-03-28
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin
App 20120076886 - KUNO; Takaki ;   et al.
2012-03-29
Low-adhesion material, resin molding die, and soil resistant material
Grant 7,901,797 - Kuno , et al. March 8, 2
2011-03-08
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin
App 20110042857 - KUNO; Takaki ;   et al.
2011-02-24
Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material
Grant 7,784,764 - Kuno , et al. August 31, 2
2010-08-31
Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material
Grant 7,732,037 - Kuno , et al. June 8, 2
2010-06-08
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin
App 20100012816 - Kuno; Takaki ;   et al.
2010-01-21
Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
Grant 7,614,293 - Kuno , et al. November 10, 2
2009-11-10
Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material
App 20090107361 - Kuno; Takaki ;   et al.
2009-04-30
Low Adhesion Material, Resin Molding Die, and Soil Resistant Material
App 20080296532 - Kuno; Takaki ;   et al.
2008-12-04
Method of Evaluating Adhesion Property, Low-Adhesion Material, and Mold for Molding Resin
App 20080254286 - Kuno; Takaki ;   et al.
2008-10-16
Composite material and resin mold
Grant 7,407,146 - Kuno , et al. August 5, 2
2008-08-05
Resin mold material and resin mold
Grant 7,287,975 - Bandoh , et al. October 30, 2
2007-10-30
Multiplex communication apparatus for vehicle
Grant 7,245,631 - Sano , et al. July 17, 2
2007-07-17
Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material
App 20060286346 - Kuno; Takaki ;   et al.
2006-12-21
Low-adhesion material and mold for molding resin using the same
App 20060093693 - Kuno; Takaki ;   et al.
2006-05-04
Composite material and resin mold
App 20050154113 - Kuno, Takaki ;   et al.
2005-07-14
Resin mold material and resin mold
App 20040253334 - Bandoh, Kazuhiko ;   et al.
2004-12-16
Platen for electrostatic wafer clamping apparatus
Grant 6,660,665 - Yanagida , et al. December 9, 2
2003-12-09
Platen For Electrostatic Wafer Clamping Apparatus
App 20030207596 - Yanagida, Hiroaki ;   et al.
2003-11-06
Multiplex communication apparatus for vehicle
App 20030128111 - Sano, Yoshiaki ;   et al.
2003-07-10

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