loadpatents
Patent applications and USPTO patent grants for KAWASHIMA; Naoki.The latest application filed is for "thermal barrier coating material and article".
Patent | Date |
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Thermal Barrier Coating Material And Article App 20210199054 - MATSUDAIRA; Tsuneaki ;   et al. | 2021-07-01 |
Rare Earth Magnets App 20210065973 - YOKOTA; Kazuya ;   et al. | 2021-03-04 |
Thermal Barrier Coating App 20210047968 - MATSUDAIRA; Tsuneaki ;   et al. | 2021-02-18 |
Vehicle door control device Grant 10,311,663 - Yamagishi , et al. | 2019-06-04 |
Vehicle Door Control Device App 20180253921 - YAMAGISHI; Takashi ;   et al. | 2018-09-06 |
Environmental barrier coating Grant 10,011,724 - Nakamura , et al. July 3, 2 | 2018-07-03 |
Environmental Barrier Coating App 20170190920 - NAKAMURA; Takeshi ;   et al. | 2017-07-06 |
Vehicle Grant 9,168,834 - Yashiro , et al. October 27, 2 | 2015-10-27 |
Power switching apparatus Grant 9,162,576 - Yagura , et al. October 20, 2 | 2015-10-20 |
Remote control system for in-vehicle device Grant 9,076,324 - Yashiro , et al. July 7, 2 | 2015-07-07 |
Vehicle App 20140163777 - YASHIRO; Hiroyuki ;   et al. | 2014-06-12 |
In-vehicle Device Controller App 20140088827 - YASHIRO; Hiroyuki ;   et al. | 2014-03-27 |
Remote Control System For In-vehicle Device App 20140088794 - YASHIRO; Hiroyuki ;   et al. | 2014-03-27 |
Power Switching Apparatus App 20130076124 - Yagura; Hirofumi ;   et al. | 2013-03-28 |
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin App 20120076886 - KUNO; Takaki ;   et al. | 2012-03-29 |
Low-adhesion material, resin molding die, and soil resistant material Grant 7,901,797 - Kuno , et al. March 8, 2 | 2011-03-08 |
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin App 20110042857 - KUNO; Takaki ;   et al. | 2011-02-24 |
Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material Grant 7,784,764 - Kuno , et al. August 31, 2 | 2010-08-31 |
Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material Grant 7,732,037 - Kuno , et al. June 8, 2 | 2010-06-08 |
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin App 20100012816 - Kuno; Takaki ;   et al. | 2010-01-21 |
Method of evaluating adhesion property, low-adhesion material, and mold for molding resin Grant 7,614,293 - Kuno , et al. November 10, 2 | 2009-11-10 |
Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material App 20090107361 - Kuno; Takaki ;   et al. | 2009-04-30 |
Low Adhesion Material, Resin Molding Die, and Soil Resistant Material App 20080296532 - Kuno; Takaki ;   et al. | 2008-12-04 |
Method of Evaluating Adhesion Property, Low-Adhesion Material, and Mold for Molding Resin App 20080254286 - Kuno; Takaki ;   et al. | 2008-10-16 |
Composite material and resin mold Grant 7,407,146 - Kuno , et al. August 5, 2 | 2008-08-05 |
Resin mold material and resin mold Grant 7,287,975 - Bandoh , et al. October 30, 2 | 2007-10-30 |
Multiplex communication apparatus for vehicle Grant 7,245,631 - Sano , et al. July 17, 2 | 2007-07-17 |
Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material App 20060286346 - Kuno; Takaki ;   et al. | 2006-12-21 |
Low-adhesion material and mold for molding resin using the same App 20060093693 - Kuno; Takaki ;   et al. | 2006-05-04 |
Composite material and resin mold App 20050154113 - Kuno, Takaki ;   et al. | 2005-07-14 |
Resin mold material and resin mold App 20040253334 - Bandoh, Kazuhiko ;   et al. | 2004-12-16 |
Platen for electrostatic wafer clamping apparatus Grant 6,660,665 - Yanagida , et al. December 9, 2 | 2003-12-09 |
Platen For Electrostatic Wafer Clamping Apparatus App 20030207596 - Yanagida, Hiroaki ;   et al. | 2003-11-06 |
Multiplex communication apparatus for vehicle App 20030128111 - Sano, Yoshiaki ;   et al. | 2003-07-10 |
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