KAWASAKI; Hiroyoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for KAWASAKI; Hiroyoshi.The latest application filed is for "solder alloy, solder powder, solder paste, and solder joint obtained using these".
Company Profile
37.38.62
- KAWASAKI; Hiroyoshi - Tokyo JP
- KAWASAKI; Hiroyoshi - Adachi-ku Tokyo
- Kawasaki; Hiroyoshi - Tochigi JP
- Kawasaki; Hiroyoshi - Tochigi-ken JP
Patent Activity
| Patent | Date |
|---|---|
| Solder Alloy, Solder Powder, Solder Paste, And Solder Joint Obtained Using These App 20220258288 - KAWASAKI; Hiroyoshi ; et al. | 2022-08-18 |
| Flux, resin flux cored solder, and flux coated pellet Grant 11,413,711 - Onitsuka , et al. August 16, 2 | 2022-08-16 |
| Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, On-board Electronic Circuit, Ecu Electronic Circuit, On-board Electronic Circuit Device, And Ecu Electronic Circuit Device App 20220250194 - KAWASAKI; Hiroyoshi ; et al. | 2022-08-11 |
| Flux composition, solder paste, solder joint and solder joining method Grant 11,407,068 - Kajikawa , et al. August 9, 2 | 2022-08-09 |
| Flux and solder paste Grant 11,376,694 - Kawanago , et al. July 5, 2 | 2022-07-05 |
| Solder alloy, solder paste, solder ball, solder preform, solder joint, and circuit Grant 11,377,715 - Kawasaki , et al. July 5, 2 | 2022-07-05 |
| Solder material, solder paste, and solder joint Grant 11,344,976 - Kawasaki , et al. May 31, 2 | 2022-05-31 |
| Resin Composition For Soldering Use, Solder Composition, Flux Cored Solder, Flux, And Solder Paste App 20220127445 - KAWASAKI; Hiroyoshi ; et al. | 2022-04-28 |
| Flux Grant 11,305,385 - Kawanago , et al. April 19, 2 | 2022-04-19 |
| Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux Grant 11,292,089 - Onitsuka , et al. April 5, 2 | 2022-04-05 |
| Solder Alloy, Solder Power, And Solder Joint App 20220088722 - KAWASAKI; Hiroyoshi ; et al. | 2022-03-24 |
| Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, And Circuit App 20220090232 - KAWASAKI; Hiroyoshi ; et al. | 2022-03-24 |
| Solder Alloy, Solder Paste, Solder Ball, Solder Preform, And Solder Joint App 20220088721 - KAWASAKI; Hiroyoshi ; et al. | 2022-03-24 |
| Solder Paste App 20220088725 - KAWASAKI; Hiroyoshi ; et al. | 2022-03-24 |
| Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, And Substrate App 20220088723 - KAWASAKI; Hiroyoshi ; et al. | 2022-03-24 |
| Flux, Method For Applying Flux, And Method For Mounting Solder Ball App 20220009041 - NISHIZAKI; Takahiro ; et al. | 2022-01-13 |
| Flux and solder paste Grant 11,203,087 - Kawasaki , et al. December 21, 2 | 2021-12-21 |
| Flux And Solder Paste App 20210387292 - Shirakawa; Ayaka ; et al. | 2021-12-16 |
| Cu ball, Osp-treated Cu ball, Cu core ball, solder joint, solder paste, formed solder, and method for manufacturing Cu ball Grant 11,185,950 - Kawasaki , et al. November 30, 2 | 2021-11-30 |
| Flux and solder paste Grant 11,179,813 - Kajikawa , et al. November 23, 2 | 2021-11-23 |
| Solder Alloy, Solder Powder, Solder Paste, And A Solder Joint Using These App 20210308808 - Kawasaki; Hiroyoshi ; et al. | 2021-10-07 |
| Flux, and solder paste Grant 11,130,202 - Kawasaki , et al. September 28, 2 | 2021-09-28 |
| Flux for Resin Flux Cored Solder, Resin Flux Cored Solder, Flux for Flux-Coated Solder, Flux-Coated Solder, and Soldering Method App 20210268610 - Kurasawa; Yoko ; et al. | 2021-09-02 |
| Solder Alloy, Solder Powder, Solder Paste, And A Solder Joint Using These App 20210245305 - Kawasaki; Hiroyoshi ; et al. | 2021-08-12 |
| Flux Composition, Solder Paste, Solder Joint and Solder Joining Method App 20210245306 - Kajikawa; Yasuhiro ; et al. | 2021-08-12 |
| Flux, Resin Flux Cored Solder Using the Flux, and Soldering Method App 20210197323 - Kurasawa; Yoko ; et al. | 2021-07-01 |
| Flux and solder paste Grant 10,987,764 - Kawasaki , et al. April 27, 2 | 2021-04-27 |
| Flux and Solder Paste App 20210069837 - Kajikawa; Yasuhiro ; et al. | 2021-03-11 |
| Flux And Solder Paste App 20210060715 - HASHIMOTO; Yutaka ; et al. | 2021-03-04 |
| Flux App 20210060713 - KAWANAGO; Tomohisa ; et al. | 2021-03-04 |
| Resin Composition and Soldering Flux App 20210060714 - Kawasaki; Hiroyoshi ; et al. | 2021-03-04 |
| Flux And Solder Paste App 20210031311 - KAWASAKI; Hiroyoshi ; et al. | 2021-02-04 |
| Soldering material Grant 10,888,957 - Kawasaki , et al. January 12, 2 | 2021-01-12 |
| Cu core ball, solder joint, solder paste and formed solder Grant 10,888,959 - Kawasaki , et al. January 12, 2 | 2021-01-12 |
| Resin Composition For Soldering, Resin Flux Cored Solder, Flux Coated Solder, And Liquid Flux App 20200391329 - ONITSUKA; Motohiro ; et al. | 2020-12-17 |
| Flux, and Solder Paste App 20200384581 - Kawasaki; Hiroyoshi ; et al. | 2020-12-10 |
| Flux and solder paste Grant 10,857,630 - Takagi , et al. December 8, 2 | 2020-12-08 |
| Flux, Resin Flux Cored Solder, and Flux Coated Pellet App 20200376609 - Onitsuka; Motohiro ; et al. | 2020-12-03 |
| Solder Material, Solder Paste, And Solder Joint App 20200376607 - Kawasaki; Hiroyoshi ; et al. | 2020-12-03 |
| Flux and solder paste Grant 10,843,298 - Kawasaki , et al. November 24, 2 | 2020-11-24 |
| Flux and Solder Paste App 20200361039 - Kawanago; Tomohisa ; et al. | 2020-11-19 |
| Flux and Solder Paste App 20200346308 - Kawasaki; Hiroyoshi ; et al. | 2020-11-05 |
| Cu column, Cu core column, solder joint, and through-silicon via Grant 10,811,376 - Kawasaki , et al. October 20, 2 | 2020-10-20 |
| Flux And Solder Paste App 20200316725 - TAKAGI; Yoshinori ; et al. | 2020-10-08 |
| Cu Ball, Osp-Treated Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, Formed Solder, and Method for Manufacturing Cu Ball App 20200298349 - Kawasaki; Hiroyoshi ; et al. | 2020-09-24 |
| Solder ball, solder joint, and joining method Grant 10,780,531 - Kawasaki , et al. Sept | 2020-09-22 |
| Solder material, solder paste, solder preform, solder joint and method of managing the solder material Grant 10,717,157 - Hattori , et al. | 2020-07-21 |
| Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder, and flux coated solder Grant 10,688,603 - Onitsuka , et al. | 2020-06-23 |
| Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint Grant 10,675,719 - Kawasaki , et al. | 2020-06-09 |
| Flux App 20200156192 - Nishizaki; Takahiro ; et al. | 2020-05-21 |
| Solder Ball, Solder Joint, and Joining Method App 20200147732 - Kawasaki; Hiroyoshi ; et al. | 2020-05-14 |
| Cu core ball, solder joint, solder paste and formed solder Grant 10,639,749 - Kawasaki , et al. | 2020-05-05 |
| Flux composition for solder applications Grant 10,610,979 - Maruko , et al. | 2020-04-07 |
| Flux Grant 10,583,533 - Maruko , et al. | 2020-03-10 |
| Solder Material, Solder Paste, Formed Solder And Solder Joint App 20200061757 - NISHINO; Tomoaki ; et al. | 2020-02-27 |
| Flux and Solder Paste App 20200047291 - Shiratori; Masato ; et al. | 2020-02-13 |
| Flux and resin composition for flux Grant 10,556,299 - Yamasaki , et al. Feb | 2020-02-11 |
| Cu Core Ball, Solder Joint, Solder Paste and Formed Solder App 20190375053 - Kawasaki; Hiroyoshi ; et al. | 2019-12-12 |
| Cu Core Ball, Solder Joint, Solder Paste and Formed Solder App 20190375054 - Kawasaki; Hiroyoshi ; et al. | 2019-12-12 |
| Cu Core Ball, Solder Joint, Solder Paste and Formed Solder App 20190376161 - Kawasaki; Hiroyoshi ; et al. | 2019-12-12 |
| Flux And Solder Paste App 20190366487 - KAWASAKI; Hiroyoshi ; et al. | 2019-12-05 |
| Flux For Resin Flux Cored Solder, Flux For Flux Coated Solder, Resin Flux Cored Solder, And Flux Coated Solder App 20190358753 - ONITSUKA; Motohiro ; et al. | 2019-11-28 |
| Flux And Resin Composition For Flux App 20190358754 - YAMASAKI; Hiroyuki ; et al. | 2019-11-28 |
| Core material, semiconductor package, and forming method of bump electrode Grant 10,381,319 - Nishino , et al. A | 2019-08-13 |
| Method of manufacturing cu core ball Grant 10,370,771 - Kawasaki , et al. | 2019-08-06 |
| Flux with dibasic acid mixture Grant 10,357,852 - Kajikawa , et al. July 23, 2 | 2019-07-23 |
| Flux App 20190210167 - Maruko; Daisuke ; et al. | 2019-07-11 |
| Flux App 20190091809 - Kawasaki; Hiroyoshi ; et al. | 2019-03-28 |
| Flux App 20190030656 - NISHIZAKI; Takahiro ; et al. | 2019-01-31 |
| Solder material, solder joint, and method of manufacturing the solder material Grant 10,173,287 - Kawasaki , et al. J | 2019-01-08 |
| Method for producing metal ball, joining material, and metal ball Grant 10,150,185 - Kawasaki , et al. Dec | 2018-12-11 |
| Cu core ball Grant 10,147,695 - Kawasaki , et al. De | 2018-12-04 |
| Flux App 20180339375 - Maruko; Daisuke ; et al. | 2018-11-29 |
| Cu ball, Cu core ball, solder joint, solder paste, and solder foam Grant 10,137,535 - Kawasaki , et al. November 27, 2 | 2018-11-27 |
| Soldering Material, Solder Joint, and Method for Inspecting Soldering Material App 20180281118 - Kawasaki; Hiroyoshi ; et al. | 2018-10-04 |
| Flux App 20180257182 - Kajikawa; Yasuhiro ; et al. | 2018-09-13 |
| Flux App 20180200845 - Kawanago; Tomohisa ; et al. | 2018-07-19 |
| Core Material, Semiconductor Package, and Forming Method of Bump Electrode App 20180174991 - Nishino; Tomoaki ; et al. | 2018-06-21 |
| Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint App 20180015572 - Kawasaki; Hiroyoshi ; et al. | 2018-01-18 |
| Ni ball, Ni nuclear ball, solder joint, foam solder and solder paste Grant 9,816,160 - Kurata , et al. November 14, 2 | 2017-11-14 |
| Solder Material, Solder Paste, Solder Preform, Solder Joint and Method of Managing the Solder Material App 20170312860 - Hattori; Takahiro ; et al. | 2017-11-02 |
| Ni ball, Ni core ball, solder joint, solder paste, and solder foam Grant 9,802,251 - Kawasaki , et al. October 31, 2 | 2017-10-31 |
| Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via App 20170287862 - Kawasaki; Hiroyoshi ; et al. | 2017-10-05 |
| Solder Material, Solder Joint, and Method of Manufacturing the Solder Material App 20170252871 - Kawasaki; Hiroyoshi ; et al. | 2017-09-07 |
| Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, and Solder Foam App 20170246711 - Kawasaki; Hiroyoshi ; et al. | 2017-08-31 |
| Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT App 20170233884 - KAWASAKI; Hiroyoshi ; et al. | 2017-08-17 |
| Method for Producing Metal Ball, Joining Material, and Metal Ball App 20170182600 - Kawasaki; Hiroyoshi ; et al. | 2017-06-29 |
| Flux-Coated Ball and Method of Manufacturing the Same App 20170182601 - Kawasaki; Hiroyoshi ; et al. | 2017-06-29 |
| Cu ball Grant 9,668,358 - Kawasaki , et al. May 30, 2 | 2017-05-30 |
| Ni Ball, Ni Core Ball, Solder Joint, Solder Paste, and Solder Foam App 20170080491 - Kawasaki; Hiroyoshi ; et al. | 2017-03-23 |
| Ni Ball, Ni Nuclear Ball, Solder Joint, Foam Solder and Solder Paste App 20160304992 - KURATA; Ryoichi ; et al. | 2016-10-20 |
| Cu Core Ball App 20160148885 - Kawasaki; Hiroyoshi ; et al. | 2016-05-26 |
| Core ball, solder paste, formed-solder, flux-coated core ball and solder joint Grant 9,278,409 - Kawasaki , et al. March 8, 2 | 2016-03-08 |
| Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core ball, solder joint, formed solder, solder paste and ag paste Grant 9,266,196 - Akagawa , et al. February 23, 2 | 2016-02-23 |
| Cu BALL App 20150336216 - HATTORI; Takahiro ; et al. | 2015-11-26 |
| Cu BALL App 20150313025 - KAWASAKI; Hiroyoshi ; et al. | 2015-10-29 |
| Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BALL, SOLDER JOINT, FORMED SOLDER, SOLDER PASTE AND Ag PASTE App 20150217409 - AKAGAWA; Takashi ; et al. | 2015-08-06 |
| Core Ball, Solder Paste, Formed-solder, Flux-coated Core Ball And Solder Joint App 20150217408 - KAWASAKI; Hiroyoshi ; et al. | 2015-08-06 |
| Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT App 20150209912 - KAWASAKI; Hiroyoshi ; et al. | 2015-07-30 |
| Connector for connecting boards Grant 4,645,277 - Kikuchi , et al. February 24, 1 | 1987-02-24 |
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