Karta; Tjandra Winata
Patent Applications and Registrations
Patent applications and USPTO patent grants for Karta; Tjandra Winata.The latest application filed is for "method for stacking devices and structure thereof".
- Karta; Tjandra Winata - Hsinchu TW
- Karta; Tjandra Winata - Hsin-Chu County N/A TW
- Karta; Tjandra Winata - Chu-Pei TW
- Karta; Tjandra Winata - Hsin-Chu TW
| Patent | Date |
|---|---|
| Silicon-based thin substrate and packaging schemes Grant 8,704,383 - Lu , et al. April 22, 2 | 2014-04-22 |
| Wafer level IC assembly method Grant 8,551,813 - Lee , et al. October 8, 2 | 2013-10-08 |
| Method for Stacking Devices and Structure Thereof App 20130127049 - Wang; Dean ; et al. | 2013-05-23 |
| Method for stacking devices Grant 8,334,170 - Wang , et al. December 18, 2 | 2012-12-18 |
| Wafer Level Ic Assembly Method App 20120288998 - Lee; Chien Hsiun ; et al. | 2012-11-15 |
| Wafer level IC assembly method Grant 8,247,267 - Lee , et al. August 21, 2 | 2012-08-21 |
| Silicon-Based Thin Substrate and Packaging Schemes App 20120199974 - Lu; Szu Wei ; et al. | 2012-08-09 |
| Process and apparatus for wafer-level flip-chip assembly Grant 8,232,183 - Lee , et al. July 31, 2 | 2012-07-31 |
| Silicon-based thin substrate and packaging schemes Grant 8,174,129 - Lu , et al. May 8, 2 | 2012-05-08 |
| Chip holder with wafer level redistribution layer Grant 8,049,323 - Chen , et al. November 1, 2 | 2011-11-01 |
| Wafer-level flip-chip assembly methods Grant 7,977,155 - Lee , et al. July 12, 2 | 2011-07-12 |
| Back end integrated WLCSP structure without aluminum pads Grant 7,863,742 - Yu , et al. January 4, 2 | 2011-01-04 |
| Stratified underfill method for an IC package Grant 7,846,769 - Lii , et al. December 7, 2 | 2010-12-07 |
| Silicon-Based Thin Substrate and Packaging Schemes App 20100301477 - Lu; Szu Wei ; et al. | 2010-12-02 |
| Fixture for P-through silicon via assembly Grant 7,842,548 - Lee , et al. November 30, 2 | 2010-11-30 |
| Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching Grant 7,838,424 - Karta , et al. November 23, 2 | 2010-11-23 |
| Silicon-based thin substrate and packaging schemes Grant 7,804,177 - Lu , et al. September 28, 2 | 2010-09-28 |
| Stratified Underfill Method For An Ic Package App 20100093135 - Lii; Mirng-Ji ; et al. | 2010-04-15 |
| Stratified underfill in an IC package Grant 7,656,042 - Lii , et al. February 2, 2 | 2010-02-02 |
| Method For Stacking Devices App 20090321948 - Wang; Dean ; et al. | 2009-12-31 |
| Fixture For P-through Silicon Via Assembly App 20090263214 - Lee; Chien-Hsiun ; et al. | 2009-10-22 |
| Wafer Level Ic Assembly Method App 20090233402 - Lee; Chien Hsiun ; et al. | 2009-09-17 |
| Semiconductor device including electrically conductive bump and method of manufacturing the same App 20090174071 - Chao; Clinton ; et al. | 2009-07-09 |
| Back End Integrated WLCSP Structure without Aluminum Pads App 20090115058 - Yu; Hsiu-Mei ; et al. | 2009-05-07 |
| Stacked structures and methods of fabricating stacked structures Grant 7,514,775 - Chao , et al. April 7, 2 | 2009-04-07 |
| Enhanced Reliability of Wafer-Level Chip-Scale Packaging (WLCSP) Die Separation Using Dry Etching App 20090011543 - Karta; Tjandra Winata ; et al. | 2009-01-08 |
| Wafer-level flip-chip assembly methods App 20080274589 - Lee; Chien-Hsiun ; et al. | 2008-11-06 |
| Process and apparatus for wafer-level flip-chip assembly App 20080274592 - Lee; Chien-Hsiun ; et al. | 2008-11-06 |
| Electromagnetic shielding using through-silicon vias Grant 7,427,803 - Chao , et al. September 23, 2 | 2008-09-23 |
| Chip Holder With Wafer Level Redistribution Layer App 20080197473 - Chen; Chen-Shien ; et al. | 2008-08-21 |
| Stacked Structures And Methods Of Fabricating Stacked Structures App 20080083975 - Chao; Clinton ; et al. | 2008-04-10 |
| Electromagnetic shielding using through-silicon vias App 20080073747 - Chao; Clinton ; et al. | 2008-03-27 |
| Silicon-based thin substrate and packaging schemes App 20080023850 - Lu; Szu Wei ; et al. | 2008-01-31 |
| Semiconductor device including electrically conductive bump and method of manufacturing the same App 20070267745 - Chao; Clinton ; et al. | 2007-11-22 |
| Utra-thin substrate package technology App 20070246821 - Lu; Szu Wei ; et al. | 2007-10-25 |
| Stratified underfill in an IC package App 20070238220 - Lii; Mirng-Ji ; et al. | 2007-10-11 |
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