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Cleaning device for cleaning electroplating substrate holder
Grant 11,433,440 - Wang , et al. September 6, 2 | 2022-09-06 |
Magnetic structure for metal plating control
Grant 11,230,791 - Tsai , et al. January 25, 2 | 2022-01-25 |
Ultra high vacuum cryogenic pumping apparatus with nanostructure material
Grant 11,111,910 - Anantharaman , et al. September 7, 2 | 2021-09-07 |
Magnetic Structure For Metal Plating Control
App 20200131662 - TSAI; Ming-Chin ; et al. | 2020-04-30 |
Magnetic structure for metal plating control
Grant 10,526,719 - Tsai , et al. J | 2020-01-07 |
Cleaning Device For Cleaning Electroplating Substrate Holder
App 20190283087 - WANG; Yu-Young ; et al. | 2019-09-19 |
Cleaning device for cleaning electroplating substrate holder
Grant 10,307,798 - Wang , et al. | 2019-06-04 |
Ultra High Vacuum Cryogenic Pumping Apparatus With Nanostructure Material
App 20190101110 - Anantharaman; Surendra Babu ; et al. | 2019-04-04 |
PVD apparatus and method with deposition chamber having multiple targets and magnets
Grant 10,190,209 - Kao , et al. Ja | 2019-01-29 |
Ultra high vacuum cryogenic pumping apparatus with nanostructure material
Grant 10,145,371 - Anantharaman , et al. De | 2018-12-04 |
Method of manufacturing a semiconductor device
Grant 10,121,698 - Lee , et al. November 6, 2 | 2018-11-06 |
Shower head apparatus and method for controlling plasma or gas distribution
Grant 9,982,340 - Lee , et al. May 29, 2 | 2018-05-29 |
Shielding design for metal gap fill
Grant 9,865,478 - Tsai , et al. January 9, 2 | 2018-01-09 |
Pvd Apparatus And Method With Deposition Chamber Having Multiple Targets And Magnets
App 20170314121 - Kao; Chung-En ; et al. | 2017-11-02 |
PVD apparatus and method with deposition chamber having multiple targets and magnets
Grant 9,708,706 - Kao , et al. July 18, 2 | 2017-07-18 |
Semiconductor Device Metallization Systems and Methods
App 20170125290 - Lee; Hsiang-Huan ; et al. | 2017-05-04 |
Cleaning Device For Cleaning Electroplating Substrate Holder
App 20170056934 - WANG; Yu-Young ; et al. | 2017-03-02 |
Rotation plus vibration magnet for magnetron sputtering apparatus
Grant 9,574,265 - Lin , et al. February 21, 2 | 2017-02-21 |
Semiconductor device metallization systems and methods
Grant 9,548,241 - Lee , et al. January 17, 2 | 2017-01-17 |
Semiconductor Device Metallization Systems and Methods
App 20160181152 - Lee; Hsiang-Huan ; et al. | 2016-06-23 |
Semiconductor device metallization systems and methods
Grant 9,318,364 - Lee , et al. April 19, 2 | 2016-04-19 |
Ultra-high vacuum (UHV) wafer processing
Grant 9,281,221 - Kao , et al. March 8, 2 | 2016-03-08 |
Multi coil target design
Grant 9,279,179 - Tsai , et al. March 8, 2 | 2016-03-08 |
Rotation Plus Vibration Magnet For Magnetron Sputtering Apparatus
App 20150307985 - Lin; Bo-Hung ; et al. | 2015-10-29 |
Rotation plus vibration magnet for magnetron sputtering apparatus
Grant 9,093,252 - Lin , et al. July 28, 2 | 2015-07-28 |
Semiconductor Device Metallization Systems and Methods
App 20150197849 - Lee; Hsiang-Huan ; et al. | 2015-07-16 |
Closed loop control for reliability
Grant 9,026,241 - Yang , et al. May 5, 2 | 2015-05-05 |
Shielding Design For Metal Gap Fill
App 20150118843 - Tsai; Ming-Chin ; et al. | 2015-04-30 |
Ultra High Vacuum Cryogenic Pumping Apparatus with Nanostructure Material
App 20150107273 - Anantharaman; Surendra Babu ; et al. | 2015-04-23 |
Magnetic Structure For Metal Plating Control
App 20150053563 - Tsai; Ming-Chin ; et al. | 2015-02-26 |
Electrostatic chuck robotic system
Grant 8,953,298 - Kao , et al. February 10, 2 | 2015-02-10 |
Shielding design for metal gap fill
Grant 8,926,806 - Tsai , et al. January 6, 2 | 2015-01-06 |
Coherent multiple side electromagnets
Grant 8,884,526 - Lin , et al. November 11, 2 | 2014-11-11 |
Ultra-high Vacuum (uhv) Wafer Processing
App 20140140792 - Kao; Chung-En ; et al. | 2014-05-22 |
Shower Head Apparatus And Method For Controllign Plasma Or Gas Distribution
App 20130267045 - LEE; Chih-Tsung ; et al. | 2013-10-10 |
Novel Closed Loop Control For Reliability
App 20130226327 - Yang; Wen-Cheng ; et al. | 2013-08-29 |
Rotation Plus Vibration Magnet for Magnetron Sputtering Apparatus
App 20130213797 - Lin; Bo-Hung ; et al. | 2013-08-22 |
Novel Multi Coil Target Design
App 20130199926 - Tsai; Ming-Chih ; et al. | 2013-08-08 |
Novel Coherent Multiple Side Electromagnets
App 20130187546 - Lin; Bo-Hung ; et al. | 2013-07-25 |
Shielding Design for Metal Gap Fill
App 20130186338 - Tsai; Ming-Chin ; et al. | 2013-07-25 |
Apparatus And Method With Deposition Chamber Having Multiple Targets And Magnets
App 20130136873 - KAO; Chung-En ; et al. | 2013-05-30 |
Electrostatic Chuck Robotic System
App 20130135784 - Kao; Chung-En ; et al. | 2013-05-30 |
Guest-service-type convenience system for implementation at ticketing activity, touring activity and retail transaction
Grant 7,651,025 - Wu , et al. January 26, 2 | 2010-01-26 |
Tax refund system and method
App 20070162345 - Hung; Pi-Chuan ; et al. | 2007-07-12 |
Guest-service-type convenience system for implementation at ticketing activity, touring activity and retail transaction
App 20070045412 - Wu; Bo-Chen ; et al. | 2007-03-01 |
RFID-enabled personal shopping assistant system and method
App 20060282334 - Kao; Chung-En ; et al. | 2006-12-14 |
Apparatus and method for self-centering a wafer in a sputter chamber
Grant 6,743,296 - Kao June 1, 2 | 2004-06-01 |
Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
Grant 6,660,125 - Wang , et al. December 9, 2 | 2003-12-09 |
Apparatus and method for self-aligning a cover ring in a sputter chamber
Grant 6,652,716 - Kao , et al. November 25, 2 | 2003-11-25 |
Apparatus and method for self-aligning a cover ring in a sputter chamber
App 20030075433 - Kao, Chung-En ; et al. | 2003-04-24 |
Apparatus and method for self-centering a wafer in a sputter chamber
App 20030070915 - Kao, Chung-En | 2003-04-17 |
System and means for supporting transportations and distributions
App 20030061086 - Chen, Hui-Chuan ; et al. | 2003-03-27 |
Novel sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
App 20020127861 - Wang, Ming-Tsong ; et al. | 2002-09-12 |
Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
Grant 6,358,851 - Wang , et al. March 19, 2 | 2002-03-19 |
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