loadpatents
Patent applications and USPTO patent grants for Kao; Chia-Ling.The latest application filed is for "integration processes utilizing boron-doped silicon materials".
Patent | Date |
---|---|
Integration Processes Utilizing Boron-doped Silicon Materials App 20220020599 - Koshizawa; Takehito ;   et al. | 2022-01-20 |
Systems and methods utilizing solid-phase etchants Grant 10,872,778 - Chen , et al. December 22, 2 | 2020-12-22 |
Self-limiting selective etching systems and methods Grant 10,755,941 - Chen , et al. A | 2020-08-25 |
Self-limiting Selective Etching Systems And Methods App 20200013628 - Chen; Zhijun ;   et al. | 2020-01-09 |
Systems And Methods Utilizing Solid-phase Etchants App 20200013632 - Chen; Zhijun ;   et al. | 2020-01-09 |
Methods for anisotropic control of selective silicon removal Grant 10,170,336 - Li , et al. J | 2019-01-01 |
Methods for barrier layer removal Grant 9,514,953 - Kao , et al. December 6, 2 | 2016-12-06 |
Methods for etching a dielectric barrier layer in a dual damascene structure Grant 9,299,577 - Ren , et al. March 29, 2 | 2016-03-29 |
Methods For Etching A Dielectric Barrier Layer In A Dual Damascene Structure App 20150214101 - REN; He ;   et al. | 2015-07-30 |
Methods For Barrier Layer Removal App 20150140827 - KAO; Chia-Ling ;   et al. | 2015-05-21 |
Method of removing a metal hardmask Grant 9,006,106 - Kao , et al. April 14, 2 | 2015-04-14 |
Method of fabricating an ultra low-k dielectric self-aligned via Grant 8,992,792 - Chang , et al. March 31, 2 | 2015-03-31 |
Method of patterning a low-k dielectric film Grant 8,987,139 - Kao , et al. March 24, 2 | 2015-03-24 |
Low Temperature Plasma Anneal Process For Sublimative Etch Processes App 20150064921 - NEMANI; Srinivas D. ;   et al. | 2015-03-05 |
Delicate dry clean Grant 8,895,449 - Zhu , et al. November 25, 2 | 2014-11-25 |
Delicate Dry Clean App 20140342532 - Zhu; Lina ;   et al. | 2014-11-20 |
Method Of Removing A Metal Hardmask App 20140273496 - Kao; Chia-Ling ;   et al. | 2014-09-18 |
Method Of Patterning A Low-k Dielectric Film App 20140213060 - Kao; Chia-Ling ;   et al. | 2014-07-31 |
Method Of Fabricating An Ultra Low-k Dielectric Self-aligned Via App 20140024220 - Chang; Chih-Yang ;   et al. | 2014-01-23 |
Methods for forming ultra thin structures on a substrate Grant 7,981,812 - Chiang , et al. July 19, 2 | 2011-07-19 |
Method Of Substrate Polymer Removal App 20090293907 - Fung; Nancy ;   et al. | 2009-12-03 |
Methods Of For Forming Ultra Thin Structures On A Substrate App 20090035944 - Chiang; Kang-Lie ;   et al. | 2009-02-05 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.