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name:-0.012382984161377
name:-0.0050477981567383
Kao; Chia-Ling Patent Filings

Kao; Chia-Ling

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kao; Chia-Ling.The latest application filed is for "integration processes utilizing boron-doped silicon materials".

Company Profile
5.12.15
  • Kao; Chia-Ling - San Jose CA
  • Kao; Chia-Ling - Moutain View CA
  • Kao; Chia-Ling - Mountain View CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Integration Processes Utilizing Boron-doped Silicon Materials
App 20220020599 - Koshizawa; Takehito ;   et al.
2022-01-20
Systems and methods utilizing solid-phase etchants
Grant 10,872,778 - Chen , et al. December 22, 2
2020-12-22
Self-limiting selective etching systems and methods
Grant 10,755,941 - Chen , et al. A
2020-08-25
Self-limiting Selective Etching Systems And Methods
App 20200013628 - Chen; Zhijun ;   et al.
2020-01-09
Systems And Methods Utilizing Solid-phase Etchants
App 20200013632 - Chen; Zhijun ;   et al.
2020-01-09
Methods for anisotropic control of selective silicon removal
Grant 10,170,336 - Li , et al. J
2019-01-01
Methods for barrier layer removal
Grant 9,514,953 - Kao , et al. December 6, 2
2016-12-06
Methods for etching a dielectric barrier layer in a dual damascene structure
Grant 9,299,577 - Ren , et al. March 29, 2
2016-03-29
Methods For Etching A Dielectric Barrier Layer In A Dual Damascene Structure
App 20150214101 - REN; He ;   et al.
2015-07-30
Methods For Barrier Layer Removal
App 20150140827 - KAO; Chia-Ling ;   et al.
2015-05-21
Method of removing a metal hardmask
Grant 9,006,106 - Kao , et al. April 14, 2
2015-04-14
Method of fabricating an ultra low-k dielectric self-aligned via
Grant 8,992,792 - Chang , et al. March 31, 2
2015-03-31
Method of patterning a low-k dielectric film
Grant 8,987,139 - Kao , et al. March 24, 2
2015-03-24
Low Temperature Plasma Anneal Process For Sublimative Etch Processes
App 20150064921 - NEMANI; Srinivas D. ;   et al.
2015-03-05
Delicate dry clean
Grant 8,895,449 - Zhu , et al. November 25, 2
2014-11-25
Delicate Dry Clean
App 20140342532 - Zhu; Lina ;   et al.
2014-11-20
Method Of Removing A Metal Hardmask
App 20140273496 - Kao; Chia-Ling ;   et al.
2014-09-18
Method Of Patterning A Low-k Dielectric Film
App 20140213060 - Kao; Chia-Ling ;   et al.
2014-07-31
Method Of Fabricating An Ultra Low-k Dielectric Self-aligned Via
App 20140024220 - Chang; Chih-Yang ;   et al.
2014-01-23
Methods for forming ultra thin structures on a substrate
Grant 7,981,812 - Chiang , et al. July 19, 2
2011-07-19
Method Of Substrate Polymer Removal
App 20090293907 - Fung; Nancy ;   et al.
2009-12-03
Methods Of For Forming Ultra Thin Structures On A Substrate
App 20090035944 - Chiang; Kang-Lie ;   et al.
2009-02-05

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