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name:-0.073530912399292
name:-0.053332090377808
name:-0.0085558891296387
Kaneko; Kentaro Patent Filings

Kaneko; Kentaro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kaneko; Kentaro.The latest application filed is for "lead frame, semiconductor device, and manufacturing method of lead frame".

Company Profile
18.57.64
  • Kaneko; Kentaro - Kyoto JP
  • Kaneko; Kentaro - Nagano JP
  • Kaneko; Kentaro - Nagano-shi JP
  • KANEKO; Kentaro - Uji-shi JP
  • Kaneko; Kentaro - Kawachinagano JP
  • Kaneko; Kentaro - Kanagawa JP
  • Kaneko; Kentaro - Kawachinagano-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
P-type oxide semiconductor and method for manufacturing same
Grant 11,424,320 - Fujita , et al. August 23, 2
2022-08-23
Lead Frame, Semiconductor Device, And Manufacturing Method Of Lead Frame
App 20220077028 - Kaneko; Kentaro ;   et al.
2022-03-10
Electrically-conductive member and method of manufacturing the same
Grant 11,189,846 - Fujita , et al. November 30, 2
2021-11-30
Semiconductor film, method of forming semiconductor film, complex compound for doping, and method of doping
Grant 11,152,208 - Fujita , et al. October 19, 2
2021-10-19
Lead Frame, Semiconductor Package, And Method For Manufacturing Lead Frame
App 20210249340 - Watanabe; Koji ;   et al.
2021-08-12
P-type oxide semiconductor and method for manufacturing same
Grant 11,087,977 - Fujita , et al. August 10, 2
2021-08-10
Substrate with multi-layer resin structure and semiconductor device including the substrate
Grant 10,943,857 - Kaneko , et al. March 9, 2
2021-03-09
Semiconductor Film, Method Of Forming Semiconductor Film, Complex Compound For Doping, And Method Of Doping
App 20210013035 - FUJITA; Shizuo ;   et al.
2021-01-14
Lead frame and electronic component device
Grant 10,818,579 - Hayashi , et al. October 27, 2
2020-10-27
Electrically-conductive Member And Method Of Manufacturing The Same
App 20200127302 - FUJITA; Shizuo ;   et al.
2020-04-23
Semiconductor device and method of manufacturing semiconductor device
Grant 10,580,648 - Jinno , et al.
2020-03-03
Crystalline film, semiconductor device including crystalline film, and method for producing crystalline film
Grant 10,460,934 - Oshima , et al. Oc
2019-10-29
Lead frame and method of manufacturing lead frame
Grant 10,381,292 - Watanabe , et al. A
2019-08-13
P-type Oxide Semiconductor And Method For Manufacturing Same
App 20190189441 - FUJITA; Shizuo ;   et al.
2019-06-20
Layered Structure, Electronic Device Including Layered Structure, System Including Electronic Device, And Method Of Manufacturin
App 20190165383 - FUJITA; Shizuo ;   et al.
2019-05-30
P-type Oxide Semiconductor And Method For Manufacturing Same
App 20190157380 - FUJITA; Shizuo ;   et al.
2019-05-23
Lead frame
Grant 10,276,478 - Kaneko , et al.
2019-04-30
Lead Frame And Electronic Component Device
App 20190115288 - Hayashi; Shintaro ;   et al.
2019-04-18
Substrate For Semiconductor Elements And Semiconductor Device
App 20190088578 - KANEKO; Kentaro ;   et al.
2019-03-21
Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20190074178 - JINNO; Riena ;   et al.
2019-03-07
Lead Frame And Method Of Manufacturing Lead Frame
App 20190074242 - WATANABE; Koji ;   et al.
2019-03-07
Method For Producing Crystalline Film
App 20190055667 - OSHIMA; Yuichi ;   et al.
2019-02-21
Crystal, Crystalline Film, Semiconductor Device Including Crystalline Film, And Method For Producing Crystalline Film
App 20190057866 - OSHIMA; Yuichi ;   et al.
2019-02-21
Crystalline Film, Semiconductor Device Including Crystalline Film, And Method For Producing Crystalline Film
App 20190057865 - OSHIMA; Yuichi ;   et al.
2019-02-21
Lead frame
Grant 10,201,917 - Kaneko , et al. Feb
2019-02-12
Method of manufacturing a wiring substrate
Grant 10,117,336 - Kaneko , et al. October 30, 2
2018-10-30
Lead Frame
App 20180236696 - Kaneko; Kentaro ;   et al.
2018-08-23
Lead Frame
App 20180240739 - Kaneko; Kentaro ;   et al.
2018-08-23
Enhancer For Eating Activity And/or Gastrointestinal Activity
App 20170281582 - OHINATA; Kousaku ;   et al.
2017-10-05
Semiconductor device, or crystal
Grant 9,711,590 - Kaneko , et al. July 18, 2
2017-07-18
Wiring board
Grant 9,699,912 - Sakai , et al. July 4, 2
2017-07-04
Lead Frame, Electronic Component Device, And Methods Of Manufacturing Them
App 20170162520 - Kaneko; Kentaro ;   et al.
2017-06-08
Wiring substrate
Grant 9,538,664 - Yanagisawa , et al. January 3, 2
2017-01-03
Wiring Board
App 20160316560 - SAKAI; Toyoaki ;   et al.
2016-10-27
Wiring substrate and semiconductor package
Grant 9,433,109 - Kaneko , et al. August 30, 2
2016-08-30
Method of fabricating a wiring board
Grant 9,345,143 - Kodani , et al. May 17, 2
2016-05-17
Wiring board and method of manufacturing wiring board
Grant 9,313,904 - Kaneko , et al. April 12, 2
2016-04-12
Wiring Substrate And Method Of Manufacturing The Same
App 20160044792 - KANEKO; Kentaro ;   et al.
2016-02-11
Method of fabricating a wiring board
Grant 9,258,899 - Kaneko February 9, 2
2016-02-09
Wiring substrate and method for manufacturing the same
Grant 9,253,897 - Kaneko , et al. February 2, 2
2016-02-02
Product storage apparatus, processing system, and product storage method
Grant 9,248,968 - Kaneko , et al. February 2, 2
2016-02-02
Wiring board and method for manufacturing the same
Grant 9,247,644 - Kaneko , et al. January 26, 2
2016-01-26
Wiring substrate and method for manufacturing wiring substrates
Grant 9,236,334 - Kaneko , et al. January 12, 2
2016-01-12
Wiring substrate and method of manufacturing the same
Grant 9,210,808 - Kaneko , et al. December 8, 2
2015-12-08
Wiring Board And Method Of Fabricating The Same
App 20150289380 - KODANI; Kotaro ;   et al.
2015-10-08
Wiring substrate
Grant 9,137,896 - Kobayashi , et al. September 15, 2
2015-09-15
Method of fabricating a wiring board
Grant 9,089,041 - Kodani , et al. July 21, 2
2015-07-21
Semiconductor Device, Or Crystal
App 20150194479 - Kaneko; Kentaro ;   et al.
2015-07-09
Method of manufacturing a wiring board having pads highly resistant to peeling
Grant 9,024,207 - Ogawa , et al. May 5, 2
2015-05-05
Method of manufacturing wiring substrate
Grant 9,006,103 - Kobayashi , et al. April 14, 2
2015-04-14
Enhancer For Eating Activity And/or Gastrointestinal Activity
App 20150025147 - Ohinata; Kousaku ;   et al.
2015-01-22
Wiring Board And Method For Manufacturing The Same
App 20150014027 - Kaneko; Kentaro ;   et al.
2015-01-15
Wiring Substrate And Method For Manufacturing The Same
App 20150014020 - Kaneko; Kentaro ;   et al.
2015-01-15
Wiring Board and Method of Manufacturing Wiring Board
App 20150008020 - KANEKO; Kentaro ;   et al.
2015-01-08
Wiring Substrate And Semiconductor Package
App 20150009645 - KANEKO; Kentaro ;   et al.
2015-01-08
Product Storage Apparatus, Processing System, And Product Storage Method
App 20140326578 - Kaneko; Kentaro ;   et al.
2014-11-06
Wiring substrate including projecting part having electrode pad formed thereon
Grant 8,810,040 - Kaneko , et al. August 19, 2
2014-08-19
Wiring substrate and manufacturing method thereof
Grant 8,797,757 - Kaneko , et al. August 5, 2
2014-08-05
Wiring board, semiconductor apparatus and method of manufacturing them
Grant 8,779,602 - Kaneko July 15, 2
2014-07-15
Wiring Substrate
App 20140182920 - YANAGISAWA; Hiroharu ;   et al.
2014-07-03
Wiring board and method of producing the same
Grant 8,754,336 - Kaneko June 17, 2
2014-06-17
Wiring board, method of manufacturing the same, and semiconductor device
Grant 8,749,073 - Nakamura , et al. June 10, 2
2014-06-10
Wiring Substrate
App 20140097009 - KANEKO; Kentaro ;   et al.
2014-04-10
Method Of Manufacturing Wiring Substrate
App 20140087556 - KOBAYASHI; Kazuhiro ;   et al.
2014-03-27
Wiring Substrate
App 20140076614 - KOBAYASHI; Kazuhiro ;   et al.
2014-03-20
Wiring substrate and method of manufacturing the same
Grant 8,610,287 - Kaneko , et al. December 17, 2
2013-12-17
Wiring board, semiconductor apparatus and method of manufacturing them
Grant 8,502,398 - Kaneko August 6, 2
2013-08-06
Wiring Board And Method Of Manufacturing The Same
App 20130185936 - Ogawa; Michiro ;   et al.
2013-07-25
Wiring substrate and method for manufacturing the same
Grant 8,476,536 - Kaneko , et al. July 2, 2
2013-07-02
Wiring Board And Method Of Manufacturing The Same
App 20130153271 - Ogawa; Michiro ;   et al.
2013-06-20
Method And Support Member For Manufacturing Wiring Substrate, And Structure Member For Wiring Substrate
App 20130143062 - KANEKO; Kentaro ;   et al.
2013-06-06
Wiring Substrate, Manufacturing Method Of Wiring Substrate, And Semiconductor Package Including Wiring Substrate
App 20130140692 - Kaneko; Kentaro ;   et al.
2013-06-06
Wiring Board And Method Of Fabricating The Same
App 20130134127 - KODANI; Kotaro ;   et al.
2013-05-30
Method Of Fabricating A Wiring Board
App 20130097856 - Kaneko; Kentaro
2013-04-25
Wiring Substrate And Method Of Manufacturing The Same
App 20130075145 - KANEKO; Kentaro ;   et al.
2013-03-28
Wiring board and method of manufacturing the same
Grant 8,399,779 - Ogawa , et al. March 19, 2
2013-03-19
Wiring board having a connecting pad area which is smaller than a surface plating layer area
Grant 8,357,860 - Kaneko January 22, 2
2013-01-22
Wiring board and method of manufacturing the same
Grant 8,338,718 - Kaneko , et al. December 25, 2
2012-12-25
Wiring Board Manufacturing Method, Semiconductor Device Manufacturing Method And Wiring Board
App 20120256320 - Kaneko; Kentaro
2012-10-11
Wiring Substrate And Method For Manufacturing Wiring Substrates
App 20120222894 - KANEKO; KENTARO ;   et al.
2012-09-06
Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
Grant 8,237,270 - Kobayashi , et al. August 7, 2
2012-08-07
Wiring board manufacturing method
Grant 8,225,502 - Kaneko July 24, 2
2012-07-24
Wiring Board And Method Of Producing The Same
App 20120175157 - Kaneko; Kentaro
2012-07-12
Wiring Substrate And Manufacturing Method Thereof
App 20120175153 - KANEKO; Kentaro ;   et al.
2012-07-12
Wiring Board, Semiconductor Apparatus And Method Of Manufacturing Them
App 20120155048 - KANEKO; Kentaro
2012-06-21
Wiring board and method of producing the same
Grant 8,183,467 - Kaneko May 22, 2
2012-05-22
Wiring Substrate and Method for Manufacturing Wiring Substrate
App 20120006591 - Kaneko; Kentaro ;   et al.
2012-01-12
Wiring Board, Method Of Manufacturing The Same, And Semiconductor Device
App 20110304016 - NAKAMURA; Junichi ;   et al.
2011-12-15
Wiring Substrate
App 20110290536 - Kaneko; Kentaro ;   et al.
2011-12-01
Wiring board and method of manufacturing the same
Grant 8,067,695 - Kaneko November 29, 2
2011-11-29
Wiring Substrate And Method Of Manufacturing The Same
App 20110147924 - KANEKO; Kentaro ;   et al.
2011-06-23
Wiring Board Manufacturing Method, Semiconductor Device Manufacturing Method And Wiring Board
App 20110139502 - Kobayashi; Kazuhiro ;   et al.
2011-06-16
Method of manufacturing a wiring board
Grant 7,954,234 - Kodani , et al. June 7, 2
2011-06-07
Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
Grant 7,915,088 - Kobayashi , et al. March 29, 2
2011-03-29
Wiring Board And Method Of Manufacturing The Same
App 20100147560 - KANEKO; Kentaro
2010-06-17
Wiring Board And Method Of Manufacturing The Same
App 20100147574 - KANEKO; Kentaro ;   et al.
2010-06-17
Wiring Board And Method Of Manufacturing The Same
App 20100139962 - KANEKO; Kentaro
2010-06-10
Wiring Board And Method Of Producing The Same
App 20100132995 - Kaneko; Kentaro
2010-06-03
Wiring Board And Method Of Fabricating The Same
App 20100084163 - KODANI; Kotaro ;   et al.
2010-04-08
Wiring Board And Method Of Manufacturing The Same
App 20100065322 - Ogawa; Michiro ;   et al.
2010-03-18
Multilayer Wiring Board, Semiconductor Package And Method Of Manufacturing The Same
App 20100032196 - KANEKO; Kentaro ;   et al.
2010-02-11
Wiring substrate and wiring substrate manufacturing method
Grant 7,582,551 - Kodani , et al. September 1, 2
2009-09-01
Wiring Board, Semiconductor Apparatus And Method Of Manufacturing Them
App 20090095514 - KANEKO; Kentaro
2009-04-16
Wiring Board And Its Fabricating Method
App 20080298038 - Kaneko; Kentaro
2008-12-04
Wiring Board Manufacturing Method, Semiconductor Device Manufacturing Method And Wiring Board
App 20080258300 - Kobayashi; Kazuhiro ;   et al.
2008-10-23
Wiring Board Manufacturing Method, Semiconductor Device Manufacturing Method And Wiring Board
App 20080257596 - Kaneko; Kentaro
2008-10-23
Wiring Board And Method Of Manufacturing The Same
App 20080245549 - Kodani; Kotaro ;   et al.
2008-10-09
Wiring Substrate And Wiring Substrate Manufacturing Method
App 20080246146 - Kodani; Kotaro ;   et al.
2008-10-09
Wiring substrate and method for manufacturing the same
App 20080149383 - Kaneko; Kentaro ;   et al.
2008-06-26

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