Kaminaga; Kengo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kaminaga; Kengo.The latest application filed is for "sputtering target product and method for producing recycled sputtering target product".

Company Profile

2.9.17

Kaminaga; Kengo - Ibaraki JP
Kaminaga; Kengo - Hitashi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sputtering Target Product And Method For Producing Recycled Sputtering Target Product App 20220098723 - Kaminaga; Kengo ; et al.	2022-03-31
Co Anode, And Co Electroplating Method Using Co Anode App 20210010149 - Murata; Shuhei ; et al.	2021-01-14
Tungsten Sintered Compact Sputtering Target and Tungsten Film Formed Using Said Target App 20180261438 - Kaminaga; Kengo ; et al.	2018-09-13
Tungsten Sintered Compact Sputtering Target and Tungsten Film Formed Using Said Target App 20150303040 - Kaminaga; Kengo ; et al.	2015-10-22
Liquid crystal polymer copper-clad laminate and copper foil used for said laminate Grant 9,060,431 - Arai , et al. June 16, 2	2015-06-16
Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used For Said Laminate App 20140093743 - Arai; Hideta ; et al.	2014-04-03
Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same Grant 8,668,994 - Yamanishi , et al. March 11, 2	2014-03-11
Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same Grant 8,580,390 - Yamanishi , et al. November 12, 2	2013-11-12
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same App 20130270218 - Yamanishi; Keisuke ; et al.	2013-10-17
Method of forming electronic circuit Grant 8,357,307 - Yamanishi , et al. January 22, 2	2013-01-22
Copper Foil For Negative Electrode Current Collector Of Secondary Battery App 20130011734 - Arai; Hideta ; et al.	2013-01-10
Electronic Circuit, Method For Forming Same, And Copper Clad Laminate For Forming Electronic Circuit App 20120318568 - Yamanishi; Keisuke ; et al.	2012-12-20
Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board App 20120148862 - Moriyama; Terumasa ; et al.	2012-06-14
Copper Foil and Method for Producing Same App 20120135266 - Kaminaga; Kengo	2012-05-31
Copper foil for printed circuit board and copper clad laminate for printed circuit board Grant 8,142,905 - Moriyama , et al. March 27, 2	2012-03-27
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same App 20110297641 - Yamanishi; Keisuke ; et al.	2011-12-08
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same App 20110300401 - Yamanishi; Keisuke ; et al.	2011-12-08
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using same App 20110293960 - Yamanishi; Keisuke ; et al.	2011-12-01
Method of Forming Electronic Circuit App 20110284496 - Yamanishi; Keisuke ; et al.	2011-11-24
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same App 20110259848 - Yamanishi; Keisuke ; et al.	2011-10-27
Copper Foil for Printed Circuit Board and Copper Clad Laminate for Printed Circuit Board App 20100261033 - Moriyama; Terumasa ; et al.	2010-10-14

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