Joshi; Rajeev Dinkar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Joshi; Rajeev Dinkar.The latest application filed is for "power converter having a conductive clip".

Company Profile

4.7.9

Joshi; Rajeev Dinkar - Cupertino CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integration of a passive component in a cavity of an integrated circuit package Grant 11,430,722 - Morroni , et al. August 30, 2	2022-08-30
Integration of a passive component in an integrated circuit package Grant 10,734,313 - Morroni , et al.	2020-08-04
Power Converter Having A Conductive Clip App 20200194359 - Joshi; Rajeev Dinkar ; et al.	2020-06-18
Power converter having a conductive clip Grant 10,573,585 - Joshi , et al. Feb	2020-02-25
Power Converter Having A Conductive Clip App 20190287885 - Joshi; Rajeev Dinkar ; et al.	2019-09-19
Integration Of A Passive Component In An Integrated Circuit Package App 20180301404 - MORRONI; Jeffrey ; et al.	2018-10-18
Integration Of A Passive Component In A Cavity Of An Integrated Circuit Package App 20180301403 - MORRONI; Jeffrey ; et al.	2018-10-18
Integration Of A Passive Component In A Cavity Of An Integrated Circuit Package App 20180301402 - MORRONI; Jeffrey ; et al.	2018-10-18
Power module with improved cooling and method for making Grant 9,468,087 - Joshi October 11, 2	2016-10-11
Converter having partially thinned leadframe with stacked chips and interposer, free of wires and clips Grant 9,355,946 - Joshi May 31, 2	2016-05-31
Converter Having Partially Thinned Leadframe With Stacked Chips And Interposer, Free Of Wires And Clips App 20150348890 - Joshi; Rajeev Dinkar	2015-12-03
Converter having partially thinned leadframe with stacked chips and interposer, free of wires and clips Grant 9,136,256 - Joshi September 15, 2	2015-09-15
Converter Having Partially Thinned Leadframe With Stacked Chips And Interposer, Free Of Wires And Clips App 20150235999 - Joshi; Rajeev Dinkar	2015-08-20
Molded leadless package having a partially exposed lead frame pad Grant 7,315,077 - Choi , et al. January 1, 2	2008-01-01
Package and method for packaging an integrated circuit die App 20050275089 - Joshi, Rajeev Dinkar ; et al.	2005-12-15
Molded leadless package having improved reliability and high thermal transferability, and sawing type molded leadless package and method of manufacturing the same App 20050104168 - Choi, Yoon-hwa ; et al.	2005-05-19

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