JEONG; Se Young

Patent Applications and Registrations

Patent applications and USPTO patent grants for JEONG; Se Young.The latest application filed is for "pharmaceutical composition for co-administration of acidosis-inducing drug".

Company Profile

7.30.49

JEONG; Se Young - Seoul KR
JEONG; Se Young - Hwaseong-si KR
Jeong; Se Young - Suwon KR
Jeong; Se-young - Busan KR
Jeong; Se-Young - Suwon-si KR
Jeong; Se Young - Gyeongsangnam-do KR
Jeong; Se-Young - Chungcheongnam-do KR
Jeong; Se-young - Suwon-City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pharmaceutical Composition For Co-administration Of Acidosis-inducing Drug App 20220125745 - KIM; Yong Bae ; et al.	2022-04-28
Pharmaceutical Composition For Prevention Or Treatment Of Acidosis App 20220105053 - KIM; Yong Bae ; et al.	2022-04-07
Semiconductor Package And Method For Manufacturing The Same App 20210327824 - JEONG; Se Young ; et al.	2021-10-21
Electronic component package for electromagnetic interference shielding and method for manufacturing the same Grant 10,849,258 - Jeong , et al. November 24, 2	2020-11-24
Method for manufacturing single-crystalline metal ultrafine wire Grant 10,512,959 - Jeong , et al. Dec	2019-12-24
Electrode having nano mesh multi-layer structure, using single crystal copper, and manufacturing method therefor Grant 10,460,852 - Jeong , et al. Oc	2019-10-29
Electronic Component Package For Electromagnetic Interference Shielding And Method For Manufacturing The Same App 20180235116 - JEONG; Se Young ; et al.	2018-08-16
Electronic component package for electromagnetic interference shielding and method for manufacturing the same Grant 9,974,215 - Jeong , et al. May 15, 2	2018-05-15
Electronic Component Package For Electromagnetic Interference Shielding And Method For Manufacturing The Same App 20180132390 - Jeong; Se Young ; et al.	2018-05-10
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Grant 9,941,196 - Lee , et al. April 10, 2	2018-04-10
Method For Preparing Copper Thin Film By Using Single Crystal Copper Target App 20170369986 - Jeong; Se-young ; et al.	2017-12-28
Electrode Having Nano Mesh Multi-layer Structure, Using Single Crystal Copper, And Manufacturing Method Therefor App 20170186511 - Jeong; Se-young ; et al.	2017-06-29
Method For Manufacturing Single-crystalline Metal Ultrafine Wire App 20170151595 - Jeong; Se-young ; et al.	2017-06-01
Semiconductor Device, Fabricating Method Thereof And Semiconductor Package Including The Semiconductor Device App 20160233155 - LEE; Ho-Jin ; et al.	2016-08-11
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Grant 9,343,361 - Lee , et al. May 17, 2	2016-05-17
Metal Single Crystal In Which Metal Element Is Substituted App 20150292113 - Jeong; Se-young ; et al.	2015-10-15
Heat Transfer Structure And Manufacturing Method Thereof App 20150194366 - JEONG; Se Young	2015-07-09
Method of manufacturing single crystal wire and other single crystal metallic articles Grant 8,663,388 - Jeong , et al. March 4, 2	2014-03-04
Semiconductor Device, Fabricating Method Thereof And Semiconductor Package Including The Semiconductor Device App 20140057430 - LEE; Ho-Jin ; et al.	2014-02-27
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Grant 8,592,991 - Lee , et al. November 26, 2	2013-11-26
Semiconductor device Grant 8,592,988 - Lee , et al. November 26, 2	2013-11-26
Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor package Grant 8,586,477 - Jeong , et al. November 19, 2	2013-11-19
Stacked Semiconductor Device App 20120326307 - JEONG; Se-young ; et al.	2012-12-27
Semiconductor Device And Method Of Fabricating The Semiconductor Device App 20120199981 - Jeong; Se-young ; et al.	2012-08-09
Semiconductor Device, Fabricating Method Thereof And Semiconductor Package Including The Semiconductor Device App 20120133048 - LEE; Ho-Jin ; et al.	2012-05-31
Semiconductor Device App 20120056330 - Lee; Ho-Jin ; et al.	2012-03-08
Semiconductor Apparatus, Method Of Manufacturing The Same, And Method Of Manufacturing Semiconductor Package App 20120028412 - Jeong; Se-young ; et al.	2012-02-02
Flip Chip Package App 20110115078 - JEONG; Se-Young ; et al.	2011-05-19
Tunable Diffraction Grating Apparatus App 20100149640 - Paek; Mun Cheol ; et al.	2010-06-17
Interconnection structure of integrated circuit chip Grant 7,732,319 - Jeong , et al. June 8, 2	2010-06-08
System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack Grant 7,666,690 - Lee , et al. February 23, 2	2010-02-23
Stacked chip package and method for forming the same Grant 7,638,365 - Jeong , et al. December 29, 2	2009-12-29
Method Of Manufacturing Single Crystal Wire App 20090211516 - Jeong; Se Young ; et al.	2009-08-27
Method of forming solder bump with reduced surface defects Grant 7,553,751 - Jeong , et al. June 30, 2	2009-06-30
Fabrication method of wafer level chip scale packages Grant 7,524,763 - Kim , et al. April 28, 2	2009-04-28
System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack App 20080315242 - Lee; Kang-Wook ; et al.	2008-12-25
Stacked Chip Package And Method For Forming The Same App 20080096315 - JEONG; Se-Young ; et al.	2008-04-24
Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof Grant 7,338,891 - Jeong March 4, 2	2008-03-04
Interconnection Structure Of Integrated Circuit Chip App 20080036081 - JEONG; Se-Young ; et al.	2008-02-14
Interconnection structure of integrated circuit chip Grant 7,307,342 - Jeong , et al. December 11, 2	2007-12-11
Method for forming solder bump structure Grant 7,300,864 - Ma , et al. November 27, 2	2007-11-27
Reinforced solder bump structure and method for forming a reinforced solder bump Grant 7,271,084 - Jeong , et al. September 18, 2	2007-09-18
Solder bump structure for flip chip package and method for manufacturing the same App 20070205512 - Lee; In-Young ; et al.	2007-09-06
Chip stack package App 20070200216 - Kim; Soon-Bum ; et al.	2007-08-30
Method Of Fabricating Ultra Thin Flip-chip Package App 20070200251 - KIM; Soon-Bum ; et al.	2007-08-30
Single crystal wire and manufacturing method of the same App 20070169857 - Jeong; Se Young ; et al.	2007-07-26
Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof App 20070145603 - Jeong; Se-Young	2007-06-28
Method of fabricating ultra thin flip-chip package Grant 7,214,604 - Kim , et al. May 8, 2	2007-05-08
Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof Grant 7,208,842 - Jeong April 24, 2	2007-04-24
Method of forming solder bump with reduced surface defects App 20070020913 - Jeong; Se-Young ; et al.	2007-01-25
Selective copper alloy interconnections in semiconductor devices and methods of forming the same App 20060289999 - Lee; Hyo-Jong ; et al.	2006-12-28
Method for manufacturing wafer level chip stack package Grant 7,151,009 - Kim , et al. December 19, 2	2006-12-19
Method of forming solder bump with reduced surface defects Grant 7,132,358 - Jeong , et al. November 7, 2	2006-11-07
Stacked multi-chip semiconductor package improving connection reliability of stacked chips Grant 7,119,425 - Jeong , et al. October 10, 2	2006-10-10
Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package App 20060202332 - Jeong; Se-Young ; et al.	2006-09-14
Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package App 20060151878 - Jeong; Se-Young ; et al.	2006-07-13
Reinforced solder bump structure and method for forming a reinforced solder bump App 20060113681 - Jeong; Se-young ; et al.	2006-06-01
Method of forming bump that may reduce possibility of losing contact pad material App 20060073704 - Jeong; Se-young ; et al.	2006-04-06
Interconnection structure of integrated circuit chip App 20060060970 - Jeong; Se-Young ; et al.	2006-03-23
Reinforced solder bump structure and method for forming a reinforced solder bump Grant 7,015,590 - Jeong , et al. March 21, 2	2006-03-21
System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack App 20060033118 - Lee; Kang-Wook ; et al.	2006-02-16
Semiconductor package having protective layer for re-routing lines and method of manufacturing the same App 20060017161 - Chung; Jae-Sik ; et al.	2006-01-26
Stacked multi-chip semiconductor package improving connection reliability of stacked chips App 20050285250 - Jeong, Se-Young ; et al.	2005-12-29
Method for manufacturing wafer level chip stack package App 20050280160 - Kim, Soon-Bum ; et al.	2005-12-22
High-reliability solder joint for printed circuit board and semiconductor package module using the same App 20050282315 - Jeong, Se-Young ; et al.	2005-12-22
Fabrication method of wafer level chip scale packages App 20050277293 - Kim, Soon-Bum ; et al.	2005-12-15
Method of forming solder bump with reduced surface defects App 20050164483 - Jeong, Se-Young ; et al.	2005-07-28
Solder bump structure for flip chip package and method for manufacturing the same App 20050127508 - Lee, In-Young ; et al.	2005-06-16
Flip chip device having supportable bar and mounting structure thereof App 20050104222 - Jeong, Se-Young ; et al.	2005-05-19
Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof App 20050087885 - Jeong, Se-Young	2005-04-28
Method of fabricating ultra thin flip-chip package App 20050090090 - Kim, Soon-Bum ; et al.	2005-04-28
Method for forming solder bump structure App 20050090089 - Ma, Keum-Hee ; et al.	2005-04-28
Reinforced solder bump structure and method for forming a reinforced solder bump App 20040197979 - Jeong, Se-young ; et al.	2004-10-07

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