Jeong; Jung Tae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeong; Jung Tae.The latest application filed is for "semiconductor packages including a shielding part and methods for manufacturing the same".

Company Profile

0.8.11

Jeong; Jung Tae - Icheon-si KR
JEONG; Jung Tae - Icheon-si Gyeonggi-do KR
JEONG; Jung Tae - Icheon KR
JEONG; Jung Tae - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor packages including a shielding part and methods for manufacturing the same Grant 9,721,904 - Kim , et al. August 1, 2	2017-08-01
Semiconductor package modules, memory cards including the same, and electronic systems including the same Grant 9,699,907 - Jeong July 4, 2	2017-07-04
Semiconductor Packages Including A Shielding Part And Methods For Manufacturing The Same App 20170162515 - KIM; Seung Ho ; et al.	2017-06-08
Package-on-package Modules, Electronic Systems Including The Same, And Memory Cards Including The Same App 20170148774 - JEONG; Jung Tae	2017-05-25
Package-on-package type stack package and method for manufacturing the same Grant 9,620,492 - Jeong April 11, 2	2017-04-11
Package-on-package modules, electronic systems including the same, and memory cards including the same Grant 9,601,469 - Jeong March 21, 2	2017-03-21
Semiconductor packages including interconnection members Grant 9,478,515 - Jeong October 25, 2	2016-10-25
Semiconductor Packages Including Interconnection Members App 20160307867 - JEONG; Jung Tae	2016-10-20
Semiconductor Package Modules, Memory Cards Including The Same, And Electronic Systems Including The Same App 20160295698 - JEONG; Jung Tae	2016-10-06
Package-on-package Type Stack Package And Method For Manufacturing The Same App 20160225743 - JEONG; Jung Tae	2016-08-04
Semiconductor Packages Including Through Electrodes And Methods Of Manufacturing The Same App 20160079210 - JEONG; Jung Tae ; et al.	2016-03-17
Flip chip packages having chip fixing structures, electronic systems including the same, and memory cards including the same Grant 9,275,968 - Jeong , et al. March 1, 2	2016-03-01
Semiconductor packages including through electrodes and methods of manufacturing the same Grant 9,230,915 - Jeong , et al. January 5, 2	2016-01-05
Flip Chip Packages Having Chip Fixing Structures, Electronic Systems Including The Same, And Memory Cards Including The Same App 20150348930 - JEONG; Jung Tae ; et al.	2015-12-03
Package-on-package Modules, Electronic Systems Including The Same, And Memory Cards Including The Same App 20150179618 - JEONG; Jung Tae	2015-06-25
Semiconductor Packages Including Through Electrodes And Methods Of Manufacturing The Same App 20140054772 - Jeong; Jung Tae ; et al.	2014-02-27
Spiral Staircase Shaped Stacked Semiconductor Package And Method For Manufacturing The Same App 20130040425 - NAH; Da Un ; et al.	2013-02-14
Spiral staircase shaped stacked semiconductor package and method for manufacturing the same Grant 8,304,879 - Nah , et al. November 6, 2	2012-11-06
Spiral Staircase Shaped Stacked Semiconductor Package And Method For Manufacturing The Same App 20110108995 - NAH; Da Un ; et al.	2011-05-12

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