Jandzinski; David
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jandzinski; David.The latest application filed is for "contact pads for electronic substrates and related methods".
- Jandzinski; David - Kernersville NC
- Jandzinski; David - Summerfield NC
- - Summerfield NC US
| Patent | Date |
|---|---|
| Contact Pads For Electronic Substrates And Related Methods App 20210144853 - Orlowski; John August ; et al. | 2021-05-13 |
| Contact pads for electronic substrates and related methods Grant 10,905,007 - Orlowski , et al. January 26, 2 | 2021-01-26 |
| Contact Pads For Electronic Substrates And Related Methods App 20210007224 - Orlowski; John August ; et al. | 2021-01-07 |
| Wafer-level package with enhanced performance and manufacturing method thereof Grant 10,882,740 - Costa , et al. January 5, 2 | 2021-01-05 |
| Double-sided module with electromagnetic shielding Grant 10,888,040 - Jandzinski , et al. January 5, 2 | 2021-01-05 |
| Double-sided module with electromagnetic shielding Grant 10,856,456 - Jandzinski , et al. December 1, 2 | 2020-12-01 |
| Wafer-level package with enhanced performance Grant 10,773,952 - Costa , et al. Sept | 2020-09-15 |
| Wafer-level package with enhanced performance Grant 10676348 - | 2020-06-09 |
| Wafer-level Package With Enhanced Performance App 20200102217 - Costa; Julio C. ; et al. | 2020-04-02 |
| Wafer-level package with enhanced performance Grant 10589993 - | 2020-03-17 |
| Wafer-level package with enhanced performance Grant 10549988 - | 2020-02-04 |
| Double-sided Module With Electromagnetic Shielding App 20190104653 - Jandzinski; David ; et al. | 2019-04-04 |
| Additive conductor redistribution layer (ACRL) Grant 10,043,707 - Orlowski , et al. August 7, 2 | 2018-08-07 |
| Encapsulated dies with enhanced thermal performance Grant 10,020,206 - Morris , et al. July 10, 2 | 2018-07-10 |
| Flip chip module with enhanced properties Grant 9,960,145 - Costa , et al. May 1, 2 | 2018-05-01 |
| Wafer-level Package With Enhanced Performance App 20170334710 - Costa; Julio C. ; et al. | 2017-11-23 |
| Encapsulated dies with enhanced thermal performance Grant 9,613,831 - Morris , et al. April 4, 2 | 2017-04-04 |
| Flip Chip Module With Enhanced Properties App 20160343592 - Costa; Julio C. ; et al. | 2016-11-24 |
| Encapsulated Dies With Enhanced Thermal Performance App 20160284568 - Morris; Thomas Scott ; et al. | 2016-09-29 |
| Encapsulated Dies With Enhanced Thermal Performance App 20160284570 - Morris; Thomas Scott ; et al. | 2016-09-29 |
| Surface Finish For Conductive Features On Substrates App 20140146489 - Orlowski; John August ; et al. | 2014-05-29 |
| Additive Conductor Redistribution Layer (acrl) App 20140106564 - Orlowski; John August ; et al. | 2014-04-17 |
| Conformal shielding process using flush structures Grant 8,409,658 - Hiner , et al. April 2, 2 | 2013-04-02 |
| Conformal shielding employing segment buildup Grant 8,296,941 - Hiner , et al. October 30, 2 | 2012-10-30 |
| Conformal Shielding Employing Segment Buildup App 20110225803 - Hiner; David J. ; et al. | 2011-09-22 |
| Conformal Shielding Employing Segment Buildup App 20100199492 - Hiner; David J. ; et al. | 2010-08-12 |
| Conformal Shielding Employing Segment Buildup App 20090000815 - Hiner; David J. ; et al. | 2009-01-01 |
| Conformal Shielding Process Using Flush Structures App 20090000816 - Hiner; David J. ; et al. | 2009-01-01 |
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