Jan; Sen-Bor
Patent Applications and Registrations
Patent applications and USPTO patent grants for Jan; Sen-Bor.The latest application filed is for "semiconductor die connection system and method".
Company Profile
18.27.34
- Jan; Sen-Bor - Tainan City TW
- Jan; Sen-Bor - Tainan TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor Die Connection System and Method App 20220302062 - Chen; Ming-Fa ; et al. | 2022-09-22 |
| Semiconductor Device and Method of Manufacturing App 20220278063 - Hu; Chih-Chia ; et al. | 2022-09-01 |
| Semiconductor device and method of manufacture Grant 11,410,929 - Chang , et al. August 9, 2 | 2022-08-09 |
| Package Having Different Metal Densities In Different Regions And Manufacturing Method Thereof App 20220246524 - Chen; Hsien-Wei ; et al. | 2022-08-04 |
| Package Structure And Manufacturing Method Thereof App 20220246573 - Chen; Ming-Fa ; et al. | 2022-08-04 |
| Semiconductor die connection system and method Grant 11,387,205 - Chen , et al. July 12, 2 | 2022-07-12 |
| Package structure and manufacturing method thereof Grant 11,342,297 - Chen , et al. May 24, 2 | 2022-05-24 |
| Semiconductor device and method of manufacturing Grant 11,335,656 - Hu , et al. May 17, 2 | 2022-05-17 |
| Package having different metal densities in different regions and manufacturing method thereof Grant 11,309,243 - Chen , et al. April 19, 2 | 2022-04-19 |
| Method Of Manufacturing Integrated Circuit Having Through-substrate Via App 20220012402 - Hu; Chih-Chia ; et al. | 2022-01-13 |
| Semiconductor Package And Manufacturing Method Thereof App 20210384147 - Chen; Hsien-Wei ; et al. | 2021-12-09 |
| Manufacturing Method Of Semiconductor Structure App 20210327789 - Hu; Chih-Chia ; et al. | 2021-10-21 |
| Semiconductor package and manufacturing method thereof Grant 11,107,779 - Chen , et al. August 31, 2 | 2021-08-31 |
| Semiconductor structure and manufacturing method thereof Grant 11,094,613 - Hu , et al. August 17, 2 | 2021-08-17 |
| Layout design of integrated circuit with through-substrate via Grant 11,080,455 - Hu , et al. August 3, 2 | 2021-08-03 |
| Semiconductor Device and Method of Manufacture App 20210175154 - Hu; Chih-Chia ; et al. | 2021-06-10 |
| Through-Silicon Vias in Integrated Circuit Packaging App 20210173998 - CHANG; Fong-yuan ; et al. | 2021-06-10 |
| Semiconductor Package And Manufacturing Method Thereof App 20210118827 - Chen; Hsien-Wei ; et al. | 2021-04-22 |
| Package Structure And Manufacturing Method Thereof App 20210098409 - Chen; Ming-Fa ; et al. | 2021-04-01 |
| Semiconductor Device and Method of Manufacture App 20210082816 - Chang; Fong-yuan ; et al. | 2021-03-18 |
| Through-silicon vias in integrated circuit packaging Grant 10,949,597 - Chang , et al. March 16, 2 | 2021-03-16 |
| Package And Manufacturing Method Thereof App 20210066192 - Chen; Hsien-Wei ; et al. | 2021-03-04 |
| Semiconductor Structure And Manufacturing Method Thereof App 20210057309 - Hu; Chih-Chia ; et al. | 2021-02-25 |
| Semiconductor device and method of manufacture Grant 10,930,580 - Hu , et al. February 23, 2 | 2021-02-23 |
| Semiconductor Device and Method of Manufacturing App 20210005561 - Hu; Chih-Chia ; et al. | 2021-01-07 |
| Seal Ring for Hybrid-Bond App 20200373253 - Hu; Chih-Chia ; et al. | 2020-11-26 |
| Semiconductor device and method of manufacturing Grant 10,784,219 - Hu , et al. Sept | 2020-09-22 |
| Seal ring for hybrid-bond Grant 10,741,506 - Hu , et al. A | 2020-08-11 |
| Semiconductor Device and Method of Manufacture App 20200144160 - Hu; Chih-Chia ; et al. | 2020-05-07 |
| Semiconductor Die Connection System and Method App 20200118957 - Chen; Ming-Fa ; et al. | 2020-04-16 |
| Through-silicon Vias In Integrated Circuit Packaging App 20200019668 - CHANG; Fong-yuan ; et al. | 2020-01-16 |
| Semiconductor device and method of manufacture Grant 10,515,874 - Hu , et al. Dec | 2019-12-24 |
| Semiconductor die connection system and method Grant 10,510,701 - Chen , et al. Dec | 2019-12-17 |
| Methods for forming through-substrate vias penetrating inter-layer dielectric Grant 10,504,776 - Chen , et al. Dec | 2019-12-10 |
| Seal Ring for Hybrid-Bond App 20190287932 - Hu; Chih-Chia ; et al. | 2019-09-19 |
| Seal ring for hybrid-bond Grant 10,312,201 - Hu , et al. | 2019-06-04 |
| Seal Ring for Hybrid-Bond App 20190164914 - Hu; Chih-Chia ; et al. | 2019-05-30 |
| Semiconductor Device And Method Of Manufacture App 20190164867 - Hu; Chih-Chia ; et al. | 2019-05-30 |
| Semiconductor Device and Method of Manufacturing App 20190164919 - Hu; Chih-Chia ; et al. | 2019-05-30 |
| Through-Substrate Vias and Methods for Forming the Same App 20180337112 - Chen; Ming-Fa ; et al. | 2018-11-22 |
| Through-substrate vias and methods for forming the same Grant 10,049,965 - Chen , et al. August 14, 2 | 2018-08-14 |
| Semiconductor Die Connection System and Method App 20170092624 - Chen; Ming-Fa ; et al. | 2017-03-30 |
| Semiconductor die connection system and method Grant 9,520,340 - Chen , et al. December 13, 2 | 2016-12-13 |
| Connecting through vias to devices Grant 9,355,935 - Chen , et al. May 31, 2 | 2016-05-31 |
| Semiconductor Die Connection System and Method App 20160027719 - Chen; Ming-Fa ; et al. | 2016-01-28 |
| Connecting Through Vias to Devices App 20150371928 - Chen; Ming-Fa ; et al. | 2015-12-24 |
| Semiconductor die connection system and method Grant 9,153,540 - Chen , et al. October 6, 2 | 2015-10-06 |
| Connecting through vias to devices Grant 9,123,702 - Chen , et al. September 1, 2 | 2015-09-01 |
| Through-Substrate Vias and Methods for Forming the Same App 20140319587 - Chen; Ming-Fa ; et al. | 2014-10-30 |
| Through-substrate vias and methods for forming the same Grant 8,803,292 - Chen , et al. August 12, 2 | 2014-08-12 |
| Connecting Through Vias to Devices App 20140117461 - Chen; Ming-Fa ; et al. | 2014-05-01 |
| Connecting through vias to devices Grant 8,624,324 - Chen , et al. January 7, 2 | 2014-01-07 |
| Semiconductor Die Connection System and Method App 20130299976 - Chen; Ming-Fa ; et al. | 2013-11-14 |
| Through-Substrate Vias and Methods for Forming the Same App 20130285125 - Chen; Ming-Fa ; et al. | 2013-10-31 |
| Semiconductor die connection system and method Grant 8,518,796 - Chen , et al. August 27, 2 | 2013-08-27 |
| Semiconductor Die Connection System And Method App 20130175700 - Chen; Ming-Fa ; et al. | 2013-07-11 |
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