name:-0.13279700279236
name:-0.047470092773438
name:-0.017445802688599
J-Devices Corporation Patent Filings

J-Devices Corporation

Patent Applications and Registrations

Patent applications and USPTO patent grants for J-Devices Corporation.The latest application filed is for "semiconductor devices with shield".

Company Profile
26.66.55
  • J-Devices Corporation - Usuki N/A JP
  • J-Devices Corporation - Oita JP
  • J-Devices Corporation - Usuki-shi JP
  • J-DEVICES CORPORATION - Usuki, Oita N/A JP
  • J-DEVICES CORPORATION - Usuki-shi, Oita N/A JP
  • J-DEVICES CORPORATION - Usuki-City JP
  • J-DEVICES CORPORATION - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Semiconductor device having outer terminal portions with conductive layer on outer end surfaces and method of manufacturing a semiconductor device
Grant 11,322,431 - Suzuhara May 3, 2
2022-05-03
Wiring substrate, semiconductor package having the wiring substrate, and manufacturing method thereof
Grant 11,189,553 - Hayashi November 30, 2
2021-11-30
Semiconductor device and method of manufacturing semiconductor device
Grant 10,910,294 - Nishikawa February 2, 2
2021-02-02
Semiconductor Devices With Shield
App 20200402919 - Matsuda; Yoshio ;   et al.
2020-12-24
Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20200388562 - NISHIKAWA; Kenji
2020-12-10
Semiconductor Package And A Method For Manufacturing A Semiconductor Device
App 20200152555 - SUZUHARA; Masafumi
2020-05-14
Wiring Substrate, Semiconductor Package Having The Wiring Substrate, And Manufacturing Method Thereof
App 20200066623 - HAYASHI; Naoki
2020-02-27
Semiconductor package and a method for manufacturing a semiconductor device
Grant 10,559,523 - Suzuhara Feb
2020-02-11
Semiconductor package and manufacturing method of semiconductor package
Grant 10,553,456 - Takehara , et al. Fe
2020-02-04
Semiconductor Device
App 20200035582 - HIROBE; Masao
2020-01-30
Manufacturing method of semiconductor package including laser processing
Grant 10,529,635 - Marutani , et al. J
2020-01-07
Press fitting head and semiconductor manufacturing apparatus using the same
Grant 10,388,625 - Kai A
2019-08-20
Semiconductor device and method for manufacturing same
Grant 10,256,196 - Ishido , et al.
2019-04-09
Semiconductor device
Grant 10,236,231 - Miyakoshi , et al.
2019-03-19
Manufacturing method of semiconductor package
Grant 10,224,256 - Machida , et al.
2019-03-05
Semiconductor manufacturing apparatus having a pickup unit simultaneously picking up a plurality of semiconductor chips
Grant 10,157,760 - Kai Dec
2018-12-18
Semiconductor Package And A Method For Manufacturing A Semiconductor Device
App 20180342443 - Suzuhara; Masafumi
2018-11-29
Semiconductor package
Grant 10,134,710 - Miyakoshi , et al. November 20, 2
2018-11-20
Manufacturing method of semiconductor package
Grant 10,096,564 - Inaoka , et al. October 9, 2
2018-10-09
Semiconductor package to reduce warping
Grant 10,090,276 - Hashimoto October 2, 2
2018-10-02
Method for producing a semiconductor package
Grant 10,079,161 - Inaoka , et al. September 18, 2
2018-09-18
Semiconductor package and a method for manufacturing a semiconductor device
Grant 10,062,638 - Suzuhara August 28, 2
2018-08-28
Semiconductor Package And Method For Producing Same
App 20180174975 - INAOKA; Toshiyuki ;   et al.
2018-06-21
Interconnect structure, printed circuit board, semiconductor device, and manufacturing method for interconnect structure
Grant 9,922,931 - Matsubara , et al. March 20, 2
2018-03-20
Semiconductor device
Grant 9,905,536 - Moda February 27, 2
2018-02-27
Semiconductor Package And Method For Producing Same
App 20170373012 - INAOKA; Toshiyuki ;   et al.
2017-12-28
Manufacturing Method Of Semiconductor Package
App 20170365534 - MACHIDA; Hirokazu ;   et al.
2017-12-21
Manufacturing Method Of Semiconductor Package
App 20170358462 - ARAKI; Seita ;   et al.
2017-12-14
Semiconductor package and manufacturing method thereof
Grant 9,837,382 - Watanabe , et al. December 5, 2
2017-12-05
Semiconductor Manufacturing Apparatus And Semiconductor Manufacturing Method
App 20170338136 - KAI; Minoru
2017-11-23
Semiconductor Package And Manufacturing Method Of Semiconductor Package
App 20170316996 - TAKEHARA; Yasuyuki ;   et al.
2017-11-02
Semiconductor Package And Manufacturing Method Of Semiconductor Package
App 20170316998 - MARUTANI; Hisakazu ;   et al.
2017-11-02
Manufacturing Method Of Semiconductor Package
App 20170317045 - INAOKA; Toshiyuki ;   et al.
2017-11-02
Semiconductor Device
App 20170301599 - MIYAKOSHI; Takeshi ;   et al.
2017-10-19
Method for manufacturing a semiconductor package
Grant 9,786,611 - Hashimoto , et al. October 10, 2
2017-10-10
Interconnect Structure, Printed Circuit Board, Semiconductor Device, and Manufacturing Method for Interconnect Structure
App 20170263560 - MATSUBARA; Hiroaki ;   et al.
2017-09-14
Semiconductor Package And A Method For Manufacturing A Semiconductor Device
App 20170263537 - Suzuhara; Masafumi
2017-09-14
Method Of Manufacturing Semiconductor Package And Semiconductor Package
App 20170256453 - YADA; Takahiro ;   et al.
2017-09-07
Semiconductor package and its manufacturing method
Grant 9,721,900 - Hayashi August 1, 2
2017-08-01
Method For Manufacturing Semiconductor Package, And Semiconductor Package
App 20170207157 - HASHIMOTO; Kiyoaki ;   et al.
2017-07-20
Semiconductor device and method of manufacturing semiconductor device
Grant 9,685,376 - Ikemoto , et al. June 20, 2
2017-06-20
Wiring Substrate, Semiconductor Package Having The Wiring Substrate, And Manufacturing Method Thereof
App 20170170106 - HAYASHI; Naoki
2017-06-15
Semiconductor Package And Its Manufacturing Method
App 20170170123 - HAYASHI; Naoki
2017-06-15
Semiconductor Package
App 20170148766 - MIYAKOSHI; Takeshi ;   et al.
2017-05-25
Semiconductor package
Grant 9,635,762 - Watanabe , et al. April 25, 2
2017-04-25
Press Fitting Head And Semiconductor Manufacturing Apparatus Using The Same
App 20170110432 - KAI; Minoru
2017-04-20
Semiconductor device
Grant 9,627,289 - Ikemoto , et al. April 18, 2
2017-04-18
Semiconductor package
Grant 9,601,450 - Miyakoshi , et al. March 21, 2
2017-03-21
Semiconductor device
Grant 9,595,488 - Tanaka March 14, 2
2017-03-14
Magnetic shielding package of non-volatile magnetic memory element
Grant 9,553,052 - Matsubara , et al. January 24, 2
2017-01-24
Semiconductor Device And Method For Manufacturing Same
App 20170005044 - ISHIDO; Kiminori ;   et al.
2017-01-05
Semiconductor Package
App 20160351511 - HASHIMOTO; Kiyoaki ;   et al.
2016-12-01
Semiconductor package
Grant 9,418,944 - Hashimoto , et al. August 16, 2
2016-08-16
Semiconductor Device
App 20160233141 - HIROBE; Masao
2016-08-11
Semiconductor Device
App 20160225701 - TANAKA; Yoshihiro
2016-08-04
Semiconductor Device
App 20160218086 - MODA; Makoto
2016-07-28
Semiconductor Device
App 20160181194 - IKEMOTO; Yoshihiko ;   et al.
2016-06-23
Magnetic Shielding Package Of Non-volatile Magnetic Memory Element
App 20160172580 - MATSUBARA; Hiroaki ;   et al.
2016-06-16
Semiconductor Package
App 20160172265 - HASHIMOTO; Kiyoaki
2016-06-16
Manufacturing method for semiconductor device
Grant 9,368,474 - Matsubara , et al. June 14, 2
2016-06-14
Heat sink in the aperture of substrate
Grant 9,362,200 - Honda , et al. June 7, 2
2016-06-07
Manufacturing Method For Semiconductor Device
App 20160079204 - Matsubara; Hiroaki ;   et al.
2016-03-17
Semiconductor Package
App 20160027715 - WATANABE; Shinji ;   et al.
2016-01-28
Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20160027695 - IKEMOTO; Yoshihiko ;   et al.
2016-01-28
Semiconductor Package And Method Of Manufacturing The Same
App 20150371934 - HONDA; Hirokazu ;   et al.
2015-12-24
Semiconductor Package
App 20150371915 - HASHIMOTO; Kiyoaki ;   et al.
2015-12-24
Semiconductor device, semiconductor stacked module structure, stacked module structure and method of manufacturing same
Grant 9,196,507 - Inoue , et al. November 24, 2
2015-11-24
Semiconductor Package
App 20150279759 - Miyakoshi; Takeshi ;   et al.
2015-10-01
Semiconductor device, semiconductor stacked module structure, stacked module structure and method of manufacturing same
Grant 9,147,671 - Inoue , et al. September 29, 2
2015-09-29
Semiconductor Device
App 20150243576 - MIYAKOSHI; Takeshi ;   et al.
2015-08-27
Semiconductor device and method for producing the same
Grant 9,093,393 - Suda July 28, 2
2015-07-28
Semiconductor device
Grant 9,059,143 - Imaizumi , et al. June 16, 2
2015-06-16
Semiconductor device and manufacturing method thereof
Grant 8,901,754 - Yamagata December 2, 2
2014-12-02
Semiconductor storage device and method for producing the same
Grant 8,897,051 - Itakura , et al. November 25, 2
2014-11-25
Semiconductor device and manufacturing method thereof
Grant 8,872,350 - Sawachi , et al. October 28, 2
2014-10-28
Semiconductor device and manufacturing method thereof
Grant 8,786,110 - Marutani , et al. July 22, 2
2014-07-22
Semiconductor Device And Method Of Manufacturing The Same
App 20140159215 - Tomonaga; Yoshiyuki ;   et al.
2014-06-12
Semiconductor Device And Method For Producing The Same
App 20140138852 - SUDA; Toru
2014-05-22
Semiconductor Storage Device And Method For Producing The Same
App 20140104953 - ITAKURA; Satoru ;   et al.
2014-04-17
Semiconductor Device And Manufacturing Method Thereof
App 20120074594 - MARUTANI; Hisakazu ;   et al.
2012-03-29
Semiconductor Device And Manufacturing Method Thereof
App 20110309503 - YAMAGATA; Osamu
2011-12-22

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