Ivers; Thomas H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ivers; Thomas H..The latest application filed is for "conductor contacts with enhanced reliability".

Company Profile

0.7.7

Ivers; Thomas H. - Hopewell Junction NY
Ivers; Thomas H. - Hopewel Jct NY
Ivers; Thomas H. - Wappingers Falls NY
Ivers, Thomas H. - Hopewell Jct NY
IVERS, THOMAS H - WAPPINGERS FALLS NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of making conductor contacts having enhanced reliability Grant 7,480,990 - Fitzsimmons , et al. January 27, 2	2009-01-27
Conductor Contacts With Enhanced Reliability App 20070161290 - Fitzsimmons; John A. ; et al.	2007-07-12
Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors Grant 7,034,400 - Barth , et al. April 25, 2	2006-04-25
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Grant 6,939,797 - Barth , et al. September 6, 2	2005-09-06
Method for improving adhesion to copper Grant 6,821,890 - McGahay , et al. November 23, 2	2004-11-23
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof App 20040173908 - Barth, Edward ; et al.	2004-09-09
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Grant 6,737,747 - Barth , et al. May 18, 2	2004-05-18
Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors App 20040061235 - Barth, Edward P. ; et al.	2004-04-01
Method for cleaning and preconditioning a chemical vapor deposition chamber dome Grant 6,626,188 - Fitzsimmons , et al. September 30, 2	2003-09-30
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof App 20030132510 - Barth, Edward ; et al.	2003-07-17
Method for cleaning and preconditioning a chemical vapor deposition chamber dome App 20030000545 - Fitzsimmons, John A. ; et al.	2003-01-02
Dual Damascene Interconnect Structure Using Low Stress Flourosilicate Insulator With Copper Conductors App 20020076917 - BARTH, EDWARD P ; et al.	2002-06-20
Method for improving adhesion to copper App 20010023987 - Mcgahay, Vincent J. ; et al.	2001-09-27
Adhesion of silicon carbide films Grant 6,252,295 - Cote , et al. June 26, 2	2001-06-26

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