Ishizuki; Yoshikatsu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishizuki; Yoshikatsu.The latest application filed is for "inductor apparatus and inductor apparatus manufacturing method".

Company Profile

1.26.22

Ishizuki; Yoshikatsu - Yokohama JP
Ishizuki; Yoshikatsu - Kawasaki N/A JP
Ishizuki; Yoshikatsu - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin board, method of manufacturing resin board, circuit board, and method of manufacturing circuit board Grant 10,483,195 - Kobayashi , et al. Nov	2019-11-19
Electronic device Grant 10,057,995 - Iijima , et al. August 21, 2	2018-08-21
Inductor Apparatus And Inductor Apparatus Manufacturing Method App 20180068787 - NAKAO; Hiroshi ; et al.	2018-03-08
Electronic device and method for manufacturing electronic device Grant 9,888,575 - Ishizuki February 6, 2	2018-02-06
Resin Board, Method Of Manufacturing Resin Board, Circuit Board, And Method Of Manufacturing Circuit Board App 20170365545 - Kobayashi; Yasushi ; et al.	2017-12-21
Inductor apparatus and inductor apparatus manufacturing method Grant 9,837,208 - Nakao , et al. December 5, 2	2017-12-05
Electronic Device And Method For Manufacturing Electronic Device App 20170257948 - ishizuki; yoshikatsu	2017-09-07
Method of manufacturing semiconductor device and method of manufacturing electronic device including an adhesive layer on a support member Grant 9,312,151 - Sasaki , et al. April 12, 2	2016-04-12
Electronic Device And Method Of Manufacturing Electronic Device App 20160088737 - Iijima; Shinya ; et al.	2016-03-24
Semiconductor device manufacturing method and electronic device manufacturing method Grant 9,214,361 - Ishizuki , et al. December 15, 2	2015-12-15
Method of manufacturing semiconductor device and method of manufacturing electronic assembly Grant 9,136,172 - Tani , et al. September 15, 2	2015-09-15
Inductor Apparatus And Inductor Apparatus Manufacturing Method App 20150200050 - NAKAO; Hiroshi ; et al.	2015-07-16
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus Grant 8,962,470 - Mizukoshi , et al. February 24, 2	2015-02-24
Ferroelectric component and manufacturing the same Grant 8,704,106 - Mizukoshi , et al. April 22, 2	2014-04-22
Method Of Manufacturing Semiconductor Device And Method Of Manufacturing Electronic Assembly App 20130217186 - TANI; Motoaki ; et al.	2013-08-22
Semiconductor Device Manufacturing Method And Electronic Device Manufacturing Method App 20130217184 - ISHIZUKI; Yoshikatsu ; et al.	2013-08-22
Method Of Manufacturing Semiconductor Device And Method Of Manufacturing Electronic Device App 20130217189 - SASAKI; Shinya ; et al.	2013-08-22
Electronic Component And Method Of Manufacturing The Same App 20110220397 - Mizukoshi; Masataka ; et al.	2011-09-15
Interposer and electronic device fabrication method Grant 7,937,830 - Shioga , et al. May 10, 2	2011-05-10
Multi-layer display element and manufacturing method for the same Grant 7,852,439 - Yamaguchi , et al. December 14, 2	2010-12-14
Method for processing a base that includes connecting a first base to a second base Grant 7,816,180 - Mizukoshi , et al. October 19, 2	2010-10-19
Method for processing a base that includes connecting a first base to a second base with an insulating film Grant 7,811,835 - Mizukoshi , et al. October 12, 2	2010-10-12
Multi-layer Display Element And Manufacturing Method For The Same App 20100097550 - Yamaguchi; Hisashi ; et al.	2010-04-22
Method for fabricating an interposer Grant 7,614,142 - Shioga , et al. November 10, 2	2009-11-10
Method For Forming Bumps, Semiconductor Device And Method For Manufacturing Same, Substrate Processing Apparatus, And Semiconductor Manufacturing Apparatus App 20090186425 - MIZUKOSHI; Masataka ; et al.	2009-07-23
Method For Processing A Base App 20090181497 - Mizukoshi; Masataka ; et al.	2009-07-16
Method For Processing A Base App 20090176331 - MIZUKOSHI; Masataka ; et al.	2009-07-09
Method for processing a base that includes connecting a first base to a second base with an insulating film Grant 7,514,295 - Mizukoshi , et al. April 7, 2	2009-04-07
Interposer and electronic device fabrication method App 20080257487 - Shioga; Takeshi ; et al.	2008-10-23
Interposer and electronic device fabrication method Grant 7,405,366 - Shioga , et al. July 29, 2	2008-07-29
Interposer and method for fabricating the same App 20080134499 - Shioga; Takeshi ; et al.	2008-06-12
Interposer and method for fabricating the same Grant 7,355,290 - Shioga , et al. April 8, 2	2008-04-08
Interposer and method for fabricating the same App 20070090546 - Shioga; Takeshi ; et al.	2007-04-26
Interposer and electronic device fabrication method App 20070076348 - Shioga; Takeshi ; et al.	2007-04-05
Method for processing base App 20060027936 - Mizukoshi; Masataka ; et al.	2006-02-09
Method for processing base App 20060030071 - Mizukoshi; Masataka ; et al.	2006-02-09
Thin film multi-layer wiring substrate having a coaxial wiring structure in at least one layer Grant 6,943,447 - Ishizuki , et al. September 13, 2	2005-09-13
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus App 20050161814 - Mizukoshi, Masataka ; et al.	2005-07-28
Circuit board and manufacturing method thereof that can easily provide insulating film between projecting electrodes App 20050109533 - Kurashina, Mamoru ; et al.	2005-05-26
Thin film multi-layer wiring substrate and method for manufacturing same App 20040009666 - Ishizuki, Yoshikatsu ; et al.	2004-01-15
Composition of epoxy group-containing cycloolefin resin Grant 6,001,488 - Kataoka , et al. December 14, 1	1999-12-14
Composition of epoxy group-containing cycloolefin resin Grant 5,895,800 - Kataoka , et al. April 20, 1	1999-04-20
Pattern forming process Grant 5,886,136 - Tanaka , et al. March 23, 1	1999-03-23
Composition of epoxy group-containing cycloolefin resin Grant 5,783,639 - Kataoka , et al. July 21, 1	1998-07-21
Method of manufacturing polyimide multilayer printed wiring boards Grant 5,429,709 - Mizutani , et al. July 4, 1	1995-07-04
Excimer laser processing method and apparatus Grant 5,386,430 - Yamagishi , et al. January 31, 1	1995-01-31

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