| Patent | Date |
|---|
Surface Processing Method And Processing System
App 20220301882 - Takatsuki; Koichi ; et al. | 2022-09-22 |
Surface processing method and processing system
Grant 11,387,112 - Takatsuki , et al. July 12, 2 | 2022-07-12 |
Method And Apparatus For Forming Ruthenium Film
App 20220145451 - YAMAKAWA; Shunji ; et al. | 2022-05-12 |
Embedding method and processing system
Grant 11,152,260 - Ishizaka October 19, 2 | 2021-10-19 |
Substrate Processing Method And Substrate Processing Apparatus
App 20210054503 - ARAKI; Masato ; et al. | 2021-02-25 |
TiN-based film and TiN-based film forming method
Grant 10,927,453 - Ishizaka , et al. February 23, 2 | 2021-02-23 |
METHOD FOR FORMING RuSi FILM AND SUBSTRATE PROCESSING SYSTEM
App 20210017642 - ISHIZAKA; Tadahiro ; et al. | 2021-01-21 |
Ruthenium Film Forming Method And Substrate Processing System
App 20210010135 - ISHIZAKA; Tadahiro | 2021-01-14 |
Processing Apparatus
App 20210005493 - FUJISATO; Toshiaki ; et al. | 2021-01-07 |
Hard Mask, Substrate Processing Method, And Substrate Processing Apparatus
App 20200370172 - MORIYA; Tsuyoshi ; et al. | 2020-11-26 |
Etching method and etching apparatus
Grant 10,847,379 - Sakamoto , et al. November 24, 2 | 2020-11-24 |
Method of manufacturing ruthenium wiring
Grant 10,629,433 - Ishizaka | 2020-04-21 |
Surface Processing Method And Processing System
App 20200111675 - TAKATSUKI; Koichi ; et al. | 2020-04-09 |
Embedding Method And Processing System
App 20200098627 - ISHIZAKA; Tadahiro | 2020-03-26 |
Embedding Method and Processing System
App 20200083098 - SATOH; Kohichi ; et al. | 2020-03-12 |
Ruthenium wiring and manufacturing method thereof
Grant 10,522,467 - Ishizaka , et al. Dec | 2019-12-31 |
Selective film forming method and method of manufacturing semiconductor device
Grant 10,490,443 - Kawano , et al. Nov | 2019-11-26 |
Method for forming TiON film
Grant 10,483,100 - Ishizaka , et al. Nov | 2019-11-19 |
Etching Method and Etching Apparatus
App 20190348299 - SAKAMOTO; Masato ; et al. | 2019-11-14 |
Removal method and processing method
Grant 10,460,988 - Itatani , et al. Oc | 2019-10-29 |
Removal Method And Processing Method
App 20190198390 - ITATANI; Takeshi ; et al. | 2019-06-27 |
Selective Film Forming Method and Method of Manufacturing Semiconductor Device
App 20190096750 - KAWANO; Yumiko ; et al. | 2019-03-28 |
Lower electrode of DRAM capacitor and manufacturing method thereof
Grant 10,199,451 - Ishizaka , et al. Fe | 2019-02-05 |
Method of manufacturing Cu wiring
Grant 10,096,548 - Matsumoto , et al. October 9, 2 | 2018-10-09 |
Method Of Manufacturing Ruthenium Wiring
App 20180254181 - Ishizaka; Tadahiro | 2018-09-06 |
Ruthenium metal feature fill for interconnects
Grant 10,056,328 - Yu , et al. August 21, 2 | 2018-08-21 |
TiN-BASED FILM AND TiN-BASED FILM FORMING METHOD
App 20180135169 - ISHIZAKA; Tadahiro ; et al. | 2018-05-17 |
Metal nanodot formation method, metal nanodot formation apparatus and semiconductor device manufacturing method
Grant 9,932,669 - Ishizaka April 3, 2 | 2018-04-03 |
Ruthenium Wiring And Manufacturing Method Thereof
App 20180012844 - ISHIZAKA; Tadahiro ; et al. | 2018-01-11 |
Ruthenium Metal Feature Fill For Interconnects
App 20170317022 - Yu; Kai-Hung ; et al. | 2017-11-02 |
Ruthenium film forming method, film forming apparatus, and semiconductor device manufacturing method
Grant 9,779,950 - Ishizaka October 3, 2 | 2017-10-03 |
Ruthenium Metal Deposition Method For Electrical Connections
App 20170241014 - Yu; Kai-Hung ; et al. | 2017-08-24 |
Ruthenium metal feature fill for interconnects
Grant 9,711,449 - Yu , et al. July 18, 2 | 2017-07-18 |
Lower Electrode Of Dram Capacitor And Manufacturing Method Thereof
App 20170179219 - ISHIZAKA; Tadahiro ; et al. | 2017-06-22 |
METHOD FOR FORMING TiON FILM
App 20170092489 - ISHIZAKA; Tadahiro ; et al. | 2017-03-30 |
Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling
Grant 9,607,888 - Yu , et al. March 28, 2 | 2017-03-28 |
Method for manufacturing semiconductor device
Grant 9,576,850 - Ishizaka , et al. February 21, 2 | 2017-02-21 |
Film forming method, film forming apparatus and recording medium
Grant 9,540,733 - Ishizaka January 10, 2 | 2017-01-10 |
Ruthenium Metal Feature Fill For Interconnects
App 20160358815 - Yu; Kai-Hung ; et al. | 2016-12-08 |
Metal Nanodot Formation Method, Metal Nanodot Formation Apparatus and Semiconductor Device Manufacturing Method
App 20160343817 - ISHIZAKA; Tadahiro | 2016-11-24 |
METHOD OF MANUFACTURING Cu WIRING
App 20160276218 - MATSUMOTO; Kenji ; et al. | 2016-09-22 |
Copper wiring forming method, film forming system, and storage medium
Grant 9,425,093 - Ishizaka , et al. August 23, 2 | 2016-08-23 |
Ruthenium Film Forming Method, Film Forming Apparatus, And Semiconductor Device Manufacturing Method
App 20160240433 - Ishizaka; Tadahiro | 2016-08-18 |
Copper wiring forming method with Ru liner and Cu alloy fill
Grant 9,406,557 - Yokoyama , et al. August 2, 2 | 2016-08-02 |
Cu wiring fabrication method and storage medium
Grant 9,406,558 - Ishizaka , et al. August 2, 2 | 2016-08-02 |
Copper wiring structure forming method
Grant 9,368,418 - Ishizaka , et al. June 14, 2 | 2016-06-14 |
Copper Wiring Forming Method, Film Forming System, And Storage Medium
App 20160163591 - ISHIZAKA; Tadahiro ; et al. | 2016-06-09 |
Method of forming copper wiring
Grant 9,362,166 - Ishizaka , et al. June 7, 2 | 2016-06-07 |
Method for forming copper wiring
Grant 9,313,895 - Ishizaka , et al. April 12, 2 | 2016-04-12 |
Cu Wiring Fabrication Method and Storage Medium
App 20150332961 - ISHIZAKA; Tadahiro ; et al. | 2015-11-19 |
Film Forming Method, Film Forming Apparatus And Recording Medium
App 20150325432 - ISHIZAKA; Tadahiro | 2015-11-12 |
Method Of Forming Copper Wiring
App 20150262872 - ISHIZAKA; Tadahiro ; et al. | 2015-09-17 |
Ruthenium Film Forming Method, Ruthenium Film Forming Apparatus, And Semiconductor Device Manufacturing Method
App 20150240344 - ISHIZAKA; Tadahiro ; et al. | 2015-08-27 |
INTEGRATION OF ALD BARRIER LAYER AND CVD Ru LINER FOR VOID-FREE Cu FILLING
App 20150221550 - Yu; Kai-Hung ; et al. | 2015-08-06 |
Method for forming copper wiring
Grant 9,101,067 - Ishizaka , et al. August 4, 2 | 2015-08-04 |
Method for forming Cu wiring
Grant 9,064,690 - Ishizaka , et al. June 23, 2 | 2015-06-23 |
Semiconductor Device Manufacturing Method
App 20150170963 - ISHIZAKA; Tadahiro ; et al. | 2015-06-18 |
Semiconductor device manufacturing method
Grant 8,999,841 - Ishizaka , et al. April 7, 2 | 2015-04-07 |
Post deposition plasma cleaning system and method
Grant 8,974,868 - Ishizaka , et al. March 10, 2 | 2015-03-10 |
Copper Wiring Structure Forming Method
App 20150056385 - ISHIZAKA; Tadahiro ; et al. | 2015-02-26 |
Copper Wiring Forming Method
App 20150004784 - YOKOYAMA; Osamu ; et al. | 2015-01-01 |
Method For Manufacturing Semiconductor Device
App 20140377947 - Ishizaka; Tadahiro ; et al. | 2014-12-25 |
Method of forming copper wiring and method and system for forming copper film
Grant 8,859,422 - Ishizaka , et al. October 14, 2 | 2014-10-14 |
Method Of Forming Copper Wiring And Method And System For Forming Copper Film
App 20140287163 - ISHIZAKA; Tadahiro ; et al. | 2014-09-25 |
Method For Forming Copper Wiring
App 20140175046 - ISHIZAKA; Tadahiro ; et al. | 2014-06-26 |
Method For Forming Copper Wiring
App 20140161992 - ISHIZAKA; Tadahiro ; et al. | 2014-06-12 |
Radiation-assisted selective deposition of metal-containing cap layers
Grant 8,716,132 - Ishizaka , et al. May 6, 2 | 2014-05-06 |
Method For Forming Cu Wiring
App 20140045329 - ISHIZAKA; Tadahiro ; et al. | 2014-02-13 |
Method For Forming Copper Wiring
App 20140030886 - FUKUSHIMA; Takara ; et al. | 2014-01-30 |
Thin Film Forming Method
App 20130252417 - ISHIZAKA; Tadahiro ; et al. | 2013-09-26 |
Film Forming Method And Film Forming Apparatus
App 20130237053 - Ishizaka; Tadahiro ; et al. | 2013-09-12 |
Semiconductor Device Manufacturing Method
App 20130203250 - Ishizaka; Tadahiro ; et al. | 2013-08-08 |
Methods of forming copper wiring and copper film, and film forming system
Grant 8,399,353 - Ishizaka , et al. March 19, 2 | 2013-03-19 |
Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication
Grant 8,372,739 - Ishizaka , et al. February 12, 2 | 2013-02-12 |
Apparatus For Thermal And Plasma Enhanced Vapor Deposition And Method Of Operating
App 20120315404 - LI; Yicheng ; et al. | 2012-12-13 |
Film Forming Method, Resputtering Method, And Film Forming Apparatus
App 20120247949 - SAKUMA; Takashi ; et al. | 2012-10-04 |
METHOD FOR FORMING Cu WIRING
App 20120222782 - Gomi; Atsushi ; et al. | 2012-09-06 |
Selective deposition of metal-containing cap layers for semiconductor devices
Grant 8,242,019 - Ishizaka , et al. August 14, 2 | 2012-08-14 |
Methods Of Forming Copper Wiring And Copper Film, And Film Forming System
App 20120196437 - ISHIZAKA; Tadahiro ; et al. | 2012-08-02 |
Method Of Forming Copper Wiring And Method And System For Forming Copper Film
App 20120196052 - ISHIZAKA; Tadahiro ; et al. | 2012-08-02 |
Substrate processing unit, method of detecting end point of cleaning of substrate processing unit, and method of detecting end point of substrate processing
Grant 8,075,698 - Kannan , et al. December 13, 2 | 2011-12-13 |
Diffusion barrier and adhesion layer for an interconnect structure
Grant 8,058,728 - Ishizaka , et al. November 15, 2 | 2011-11-15 |
Integrated substrate processing in a vacuum processing tool
Grant 8,034,406 - Ishizaka , et al. October 11, 2 | 2011-10-11 |
Semiconductor device containing an aluminum tantalum carbonitride barrier film and method of forming
Grant 8,026,168 - Ishizaka , et al. September 27, 2 | 2011-09-27 |
Method for in-situ refurbishing a ceramic substrate holder
Grant 7,989,353 - Ishizaka , et al. August 2, 2 | 2011-08-02 |
Method for manufacturing a semiconductor device with metal-containing cap layers
Grant 7,977,235 - Ishizaka July 12, 2 | 2011-07-12 |
Method of integrating PEALD Ta-containing films into Cu metallization
Grant 7,959,985 - Ishizaka , et al. June 14, 2 | 2011-06-14 |
Void-free copper filling of recessed features for semiconductor devices
Grant 7,884,012 - Suzuki , et al. February 8, 2 | 2011-02-08 |
Method for forming cobalt nitride cap layers
Grant 7,846,841 - Ishizaka , et al. December 7, 2 | 2010-12-07 |
Method for depositing a barrier layer on a low dielectric constant material
Grant 7,829,158 - Ishizaka November 9, 2 | 2010-11-09 |
Selective Deposition Of Metal-containing Cap Layers For Semiconductor Devices
App 20100248473 - Ishizaka; Tadahiro ; et al. | 2010-09-30 |
Method for forming a ruthenium metal cap layer
Grant 7,799,681 - Suzuki , et al. September 21, 2 | 2010-09-21 |
Radiation-assisted Selective Deposition Of Metal-containing Cap Layers
App 20100210108 - Ishizaka; Tadahiro ; et al. | 2010-08-19 |
Substrate processing method and fabrication process of a semiconductor device
Grant 7,772,111 - Ikeda , et al. August 10, 2 | 2010-08-10 |
Method For Manufacturing A Semiconductor Device With Metal-containing Cap Layers
App 20100197135 - Ishizaka; Tadahiro | 2010-08-05 |
Method of light enhanced atomic layer deposition
Grant 7,727,912 - Ishizaka , et al. June 1, 2 | 2010-06-01 |
Method of forming a diffusion barrier and adhesion layer for an interconnect structure
Grant 7,727,883 - Ishizaka , et al. June 1, 2 | 2010-06-01 |
Method for forming cobalt tungsten cap layers
Grant 7,718,527 - Ishizaka , et al. May 18, 2 | 2010-05-18 |
Gas switching mechanism for plasma processing apparatus
Grant 7,717,061 - Ishizaka , et al. May 18, 2 | 2010-05-18 |
Film precursor tray for use in a film precursor evaporation system and method of using
Grant 7,708,835 - Suzuki , et al. May 4, 2 | 2010-05-04 |
Method For Forming Ruthenium Metal Cap Layers
App 20100081274 - Ishizaka; Tadahiro ; et al. | 2010-04-01 |
Diffusion Barrier And Adhesion Layer For An Interconnect Structure
App 20100078818 - Ishizaka; Tadahiro ; et al. | 2010-04-01 |
Method For Forming Cobalt Nitride Cap Layers
App 20100081275 - Ishizaka; Tadahiro ; et al. | 2010-04-01 |
Method For Forming Cobalt Tungsten Cap Layers
App 20100081276 - Ishizaka; Tadahiro ; et al. | 2010-04-01 |
Method Of Forming A Diffusion Barrier And Adhesion Layer For An Interconnect Structure
App 20100081271 - Ishizaka; Tadahiro ; et al. | 2010-04-01 |
Plasma enhanced atomic layer deposition system
Grant 7,651,568 - Ishizaka , et al. January 26, 2 | 2010-01-26 |
Method For Forming A Ruthenium Metal Cap Layer
App 20100015798 - Suzuki; Kenji ; et al. | 2010-01-21 |
Method of forming a metal carbide or metal carbonitride film having improved adhesion
Grant 7,645,484 - Ishizaka January 12, 2 | 2010-01-12 |
Method Of Forming A Cobalt Metal Nitride Barrier Film
App 20090246952 - ISHIZAKA; Tadahiro ; et al. | 2009-10-01 |
Semiconductor contact structure containing an oxidation-resistant diffusion barrier and method of forming
Grant 7,592,257 - Ishizaka September 22, 2 | 2009-09-22 |
A Processing Method For Processing A Substrate Placed On A Placement Stage In A Process Chamber
App 20090214758 - KANNAN; Hiroshi ; et al. | 2009-08-27 |
Method For In-situ Refurbishing A Ceramic Substrate Holder
App 20090166327 - Ishizaka; Tadahiro ; et al. | 2009-07-02 |
Substrate Treating Apparatus
App 20090165720 - KOJIMA; Yasuhiko ; et al. | 2009-07-02 |
Void-free Copper Filling Of Recessed Features For Semiconductor Devices
App 20090087981 - Suzuki; Kenji ; et al. | 2009-04-02 |
Semiconductor Device Containing An Aluminum Tantalum Carbonitride Barrier Film And Method Of Forming
App 20090045514 - ISHIZAKA; Tadahiro ; et al. | 2009-02-19 |
Deposition method for forming a film including metal, nitrogen and carbon
Grant 7,491,430 - Ishizaka , et al. February 17, 2 | 2009-02-17 |
Semiconductor Contact Structure Containing An Oxidation-resistant Diffusion Barrier And Method Of Forming
App 20080284020 - ISHIZAKA; Tadahiro | 2008-11-20 |
Diffusion Barrier For Integrated Circuits Formed From A Layer Of Reactive Metal And Method Of Fabrication
App 20080237859 - Ishizaka; Tadahiro ; et al. | 2008-10-02 |
Method of Forming Thin Film, Thin Film Forming Apparatus, Program and Computer-Readable Information Recording Medium
App 20080241385 - Oshima; Yasuhiro ; et al. | 2008-10-02 |
Interconnect Structures Containing A Ruthenium Barrier Film And Method Of Forming
App 20080237860 - Ishizaka; Tadahiro ; et al. | 2008-10-02 |
Plasma enhanced atomic layer deposition system having reduced contamination
Grant 7,422,636 - Ishizaka September 9, 2 | 2008-09-09 |
Method of plasma enhanced atomic layer deposition of TaC and TaCN films having good adhesion to copper
Grant 7,407,876 - Ishizaka August 5, 2 | 2008-08-05 |
Film-Forming Method and Recording Medium
App 20080107825 - Ishizaka; Tadahiro ; et al. | 2008-05-08 |
Integrated substrate processing in a vacuum processing tool
App 20080075835 - Ishizaka; Tadahiro ; et al. | 2008-03-27 |
Method of preparing a film layer-by-layer using plasma enhanced atomic layer deposition
Grant 7,338,901 - Ishizaka March 4, 2 | 2008-03-04 |
Substrate processing method and fabrication process of a semiconductor device
Grant 7,332,426 - Ikeda , et al. February 19, 2 | 2008-02-19 |
Plasma enhanced atomic layer deposition system and method
Grant 7,314,835 - Ishizaka , et al. January 1, 2 | 2008-01-01 |
Method for Depositing a Barrier Layer on a Low Dielectric Constant Material
App 20070251445 - Ishizaka; Tadahiro | 2007-11-01 |
Method of forming a metal carbide or metal carbonitride film having improved adhesion
App 20070231487 - Ishizaka; Tadahiro | 2007-10-04 |
Method of integrating PEALD Ta- containing films into Cu metallization
App 20070218683 - Ishizaka; Tadahiro ; et al. | 2007-09-20 |
Method of light enhanced atomic layer deposition
App 20070218704 - Ishizaka; Tadahiro ; et al. | 2007-09-20 |
Method of plasma enhanced atomic layer deposition of TaC and TaCN films having good adhesion to copper
App 20070218670 - Ishizaka; Tadahiro | 2007-09-20 |
Processing method
App 20070160757 - Ishizaka; Tadahiro ; et al. | 2007-07-12 |
Substrate Processing Method And Fabrication Process Of A Semiconductor Device
App 20070134907 - Ikeda; Taro ; et al. | 2007-06-14 |
Apparatus for thermal and plasma enhanced vapor deposition and method of operating
App 20070116873 - Li; Yicheng ; et al. | 2007-05-24 |
Apparatus for thermal and plasma enhanced vapor deposition and method of operating
App 20070116872 - Li; Yicheng ; et al. | 2007-05-24 |
Method of forming a tantalum-containing layer from a metalorganic precursor
App 20070054046 - Ishizaka; Tadahiro ; et al. | 2007-03-08 |
Method of forming a tantalum-containing layer from a metalorganic precursor
App 20070054047 - Ishizaka; Tadahiro ; et al. | 2007-03-08 |
Method of preparing a film layer-by-layer using plasma enhanced atomic layer deposition
App 20070042577 - Ishizaka; Tadahiro | 2007-02-22 |
Plasma enhanced atomic layer deposition system
App 20060213438 - Ishizaka; Tadahiro ; et al. | 2006-09-28 |
Plasma enhanced atomic layer deposition system having reduced contamination
App 20060213439 - Ishizaka; Tadahiro | 2006-09-28 |
Plasma enhanced atomic layer deposition system
App 20060213437 - Ishizaka; Tadahiro ; et al. | 2006-09-28 |
Plasma enhanced atomic layer deposition system and method
App 20060210723 - Ishizaka; Tadahiro | 2006-09-21 |
Plasma enhanced atomic layer deposition system and method
App 20060211246 - Ishizaka; Tadahiro ; et al. | 2006-09-21 |
Deposition system and method
App 20060211243 - Ishizaka; Tadahiro ; et al. | 2006-09-21 |
Film precursor tray for use in a film precursor evaporation system and method of using
App 20060185598 - Suzuki; Kenji ; et al. | 2006-08-24 |
Film precursor evaporation system and method of using
App 20060185597 - Suzuki; Kenji ; et al. | 2006-08-24 |
Processing apparatus and processing method
App 20060154383 - Kannan; Hiroshi ; et al. | 2006-07-13 |
Processing device and processing method
App 20060096531 - Ishizaka; Tadahiro ; et al. | 2006-05-11 |
Thin-film formation in semiconductor device fabrication process and film deposition apparatus
App 20060068104 - Ishizaka; Tadahiro ; et al. | 2006-03-30 |
Processing apparatus and processing method
App 20060027167 - Ishizaka; Tadahiro ; et al. | 2006-02-09 |
Deposition method
App 20060029748 - Ishizaka; Tadahiro ; et al. | 2006-02-09 |
Heat-treating apparatus and heat-treating method
Grant 6,991,684 - Kannan , et al. January 31, 2 | 2006-01-31 |
Film-forming method
App 20060008595 - Ishizaka; Tadahiro ; et al. | 2006-01-12 |
Substrate processing method and fabrication process of a semiconductor device
App 20050272247 - Ikeda, Taro ; et al. | 2005-12-08 |
Substrate processing unit, method of detecting end point of cleaning of substrate processing unit, and method of detecting end point of substrate processing
App 20050241761 - Kannan, Hiroshi ; et al. | 2005-11-03 |
Substrate treating apparatus
App 20050235918 - Kojima, Yasuhiko ; et al. | 2005-10-27 |
Processing device and processing method
App 20050211167 - Gunji, Isao ; et al. | 2005-09-29 |
Processing apparatus
App 20040250765 - Ishizaka, Tadahiro ; et al. | 2004-12-16 |
Thin-film deposition apparatus and method for rapidly switching supply of source gases
App 20040112289 - Moriya, Shuji ; et al. | 2004-06-17 |
Substrate treatment device, substrate treatment method, and cleaning method for substrate treatment device
App 20040081757 - Ishizaka, Tadahiro ; et al. | 2004-04-29 |
Processing apparatus having a support member made of metal matrix composite between a process chamber and a title placement stage
App 20040042152 - Ishizaka, Tadahiro ; et al. | 2004-03-04 |
Heat-treating apparatus and heat-treating method
App 20040035359 - Kannan, Hiroshi ; et al. | 2004-02-26 |
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