Ishiwata; Shinichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ishiwata; Shinichi.The latest application filed is for "wafer processing tape".
- Ishiwata; Shinichi - Tokyo JP
- Ishiwata; Shinichi - Isehara-shi JP
- Ishiwata; Shinichi - Hiratsuka JP
| Patent | Date |
|---|---|
| Wafer processing tape Grant 9,324,592 - Maruyama , et al. April 26, 2 | 2016-04-26 |
| Wafer processing tape Grant 9,324,593 - Maruyama , et al. April 26, 2 | 2016-04-26 |
| Wafer-adhering adhesive tape Grant 8,722,184 - Morishima , et al. May 13, 2 | 2014-05-13 |
| Wafer-processing tape and method of producing the same Grant 8,545,979 - Kita , et al. October 1, 2 | 2013-10-01 |
| Wafer Processing Tape App 20120100325 - MARUYAMA; Hiromitsu ; et al. | 2012-04-26 |
| Method of producing a semiconductor device, and wafer-processing tape Grant 8,043,698 - Morishima , et al. October 25, 2 | 2011-10-25 |
| Adhesive Tape For Electronic Component Fabrication App 20110014443 - Yokoi; Hirotoki ; et al. | 2011-01-20 |
| Semiconductor wafer processing tape Grant D628,170 - Maruyama , et al. November 30, 2 | 2010-11-30 |
| Wafer Processing Tape App 20100227165 - Maruyama; Hiromitsu ; et al. | 2010-09-09 |
| Semiconductor wafer processing tape Grant D621,803 - Maruyama , et al. August 17, 2 | 2010-08-17 |
| Wafer-adhering Adhesive Tape App 20080299345 - MORISHIMA; Yasumasa ; et al. | 2008-12-04 |
| Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape Grant 7,413,965 - Ishiwata , et al. August 19, 2 | 2008-08-19 |
| Method of producing a semiconductor device, and wafer-processing tape App 20070141330 - Morishima; Yasumasa ; et al. | 2007-06-21 |
| Wafer-processing tape App 20060204749 - Kita; Kenji ; et al. | 2006-09-14 |
| Wafer-processing tape and method of producing the same App 20060154066 - Kita; Kenji ; et al. | 2006-07-13 |
| Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape App 20060115989 - Ishiwata; Shinichi ; et al. | 2006-06-01 |
| Wafer-adhering adhesive tape App 20050249909 - Morishima, Yasumasa ; et al. | 2005-11-10 |
| Semiconductor wafer-securing adhesive tape Grant 5,538,771 - Nakayama , et al. July 23, 1 | 1996-07-23 |
| Radiation-curable adhesive tape Grant 5,281,473 - Ishiwata , et al. * January 25, 1 | 1994-01-25 |
| Radiation-curable adhesive tape Grant 5,149,586 - Ishiwata , et al. September 22, 1 | 1992-09-22 |
| Radiation-curable adhesive tape Grant 4,999,242 - Ishiwata , et al. March 12, 1 | 1991-03-12 |
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