Irsigler; Roland

Patent Applications and Registrations

Patent applications and USPTO patent grants for Irsigler; Roland.The latest application filed is for "integrated circuit device and method for fabricating same with an interposer substrate".

Company Profile

0.29.42

Irsigler; Roland - Munich DE
Irsigler; Roland - Munchen DE
Irsigler; Roland - Muenchen DE
Irsigler; Roland - Deutschland DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor apparatus having stacked semiconductor components Grant 8,598,716 - Hedler , et al. December 3, 2	2013-12-03
Electrical through contact Grant 8,124,521 - Hedler , et al. February 28, 2	2012-02-28
Reduced-stress through-chip feature and method of making the same Grant 8,106,511 - Hedler , et al. January 31, 2	2012-01-31
Integrated circuit, circuit system, and method of manufacturing Grant 8,072,084 - Irsigler , et al. December 6, 2	2011-12-06
Method for placing material onto a target board by means of a transfer board Grant 8,048,479 - Hedler , et al. November 1, 2	2011-11-01
Semiconductor device with an interconnect element and method for manufacture Grant 8,049,310 - Wolter , et al. November 1, 2	2011-11-01
Integrated Circuit Device And Method For Fabricating Same With An Interposer Substrate App 20110217812 - Hedler; Harry ; et al.	2011-09-08
Chip arrangement and method of manufacturing a chip arrangement Grant 7,960,843 - Hedler , et al. June 14, 2	2011-06-14
Method for manufacturing a multichip module assembly Grant 7,847,415 - Hedler , et al. December 7, 2	2010-12-07
Electric device, stack of electric devices, and method of manufacturing a stack of electric devices Grant 7,834,462 - Dobritz , et al. November 16, 2	2010-11-16
Solder pillar bumping and a method of making the same Grant 7,829,380 - Irsigler , et al. November 9, 2	2010-11-09
Stacked Semiconductor Chips with Through Substrate Vias App 20100065949 - Thies; Andreas ; et al.	2010-03-18
Method for Manufacturing a Multichip Module Assembly App 20100013101 - Hedler; Harry ; et al.	2010-01-21
Semiconductor module for making electrical contact with a connection device via a rewiring device Grant 7,646,090 - Hedler , et al. January 12, 2	2010-01-12
Chip Arrangement and Method of Manufacturing a Chip Arrangement App 20090321959 - Hedler; Harry ; et al.	2009-12-31
Semiconductor device Grant 7,638,869 - Irsigler , et al. December 29, 2	2009-12-29
Semiconductor Device With an Interconnect Element and Method for Manufacture App 20090243047 - Wolter; Andreas ; et al.	2009-10-01
Reduced-Stress Through-Chip Feature and Method of Making the Same App 20090218690 - Hedler; Harry ; et al.	2009-09-03
Integrated Circuit Device And Method For Fabricating Same App 20090212420 - Hedler; Harry ; et al.	2009-08-27
Integrated Circuit, Circuit System, And Method Of Manufacturing App 20090072398 - Irsigler; Roland ; et al.	2009-03-19
Electric Device, Stack of Electric Devices, and Method of Manufacturing a Stack of Electric Devices App 20090072374 - Dobritz; Stephan ; et al.	2009-03-19
Semiconductor Device App 20080237891 - Irsigler; Roland ; et al.	2008-10-02
Method For Making An Integrated Circuit Having A Via Hole App 20080164611 - Hedler; Harry ; et al.	2008-07-10
Method For Fabricating A Circuit App 20080150154 - Hedler; Harry ; et al.	2008-06-26
Solder pillar bumping and a method of making the same App 20080099925 - Irsigler; Roland ; et al.	2008-05-01
Method for producing an electronic component, especially a memory chip Grant 7,338,843 - Hedler , et al. March 4, 2	2008-03-04
Method for placing material onto a target board by means of a transfer board App 20080029849 - Hedler; Harry ; et al.	2008-02-07
Method For Fabricating A Module Having An Electrical Contact-connection App 20070273011 - Singleton; Laurence Edward ; et al.	2007-11-29
Semiconductor and method for producing a semiconductor Grant 7,265,451 - Hedler , et al. September 4, 2	2007-09-04
Semiconductor device and method for fabricating the semiconductor device Grant 7,247,948 - Hedler , et al. July 24, 2	2007-07-24
Intermediate connection for flip chip in packages App 20070120268 - Irsigler; Roland ; et al.	2007-05-31
Process for producing a component module Grant 7,211,451 - Meyer , et al. May 1, 2	2007-05-01
Method for producing a multichip module and multichip module Grant 7,211,472 - Hedler , et al. May 1, 2	2007-05-01
Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stacking App 20070084944 - Hedler; Harry ; et al.	2007-04-19
Method of manufacturing a semiconductor structure having a wafer through-contact and a corresponding semiconductor structure App 20070032059 - Hedler; Harry ; et al.	2007-02-08
Method For Producing A Chip Arrangement, A Chip Arrangement And A Multichip Device App 20070023886 - Hedler; Harry ; et al.	2007-02-01
Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions App 20060244109 - Hedler; Harry ; et al.	2006-11-02
Semiconductor module and method for producing a semiconductor module App 20060177964 - Hedler; Harry ; et al.	2006-08-10
Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions Grant 7,087,512 - Hedler , et al. August 8, 2	2006-08-08
Flexible contact-connection device Grant 7,080,988 - Hedler , et al. July 25, 2	2006-07-25
Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit Grant 7,074,649 - Hedler , et al. July 11, 2	2006-07-11
Electronic component comprising external surface contacts and a method for producing the same App 20060091561 - Dangelmaier; Jochen ; et al.	2006-05-04
Method for connecting an integrated circuit to a substrate and corresponding arrangement Grant 7,022,549 - Hedler , et al. April 4, 2	2006-04-04
Semiconductor apparatus having stacked semiconductor components App 20060043561 - Hedler; Harry ; et al.	2006-03-02
Semiconductor and method for producing a semiconductor App 20060043573 - Hedler; Harry ; et al.	2006-03-02
Connection of integrated circuits Grant 6,979,591 - Hedler , et al. December 27, 2	2005-12-27
Flexible contact-connection device App 20050282410 - Hedler, Harry ; et al.	2005-12-22
Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions App 20050250304 - Hedler, Harry ; et al.	2005-11-10
Process for producing a semiconductor chip Grant 6,919,232 - Hedler , et al. July 19, 2	2005-07-19
Method for connecting circuit devices Grant 6,897,088 - Hedler , et al. May 24, 2	2005-05-24
Method for producing a multichip module and multichip module App 20050077632 - Hedler, Harry ; et al.	2005-04-14
Semiconductor module and method for producing a semiconductor module App 20050067689 - Hedler, Harry ; et al.	2005-03-31
Method for producing an electronic component, especially a memory chip App 20050048676 - Hedler, Harry ; et al.	2005-03-03
Method producing a contact connection between a semiconductor chip and a substrate and the contact connection Grant 6,861,291 - Hedler , et al. March 1, 2	2005-03-01
Method for connection of circuit units Grant 6,845,554 - Frankowsky , et al. January 25, 2	2005-01-25
Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit App 20050014309 - Hedler, Harry ; et al.	2005-01-20
Contact-connection device for electronic circuit units and production method App 20050014394 - Hedler, Harry ; et al.	2005-01-20
Semiconductor device and method for fabricating the semiconductor device App 20040217483 - Hedler, Harry ; et al.	2004-11-04
Method for connecting an integrated circuit to a substrate and corresponding arrangement App 20040191958 - Hedler, Harry ; et al.	2004-09-30
Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another Grant 6,714,418 - Frankowsky , et al. March 30, 2	2004-03-30
Connection of integrated circuits App 20040012080 - Hedler, Harry ; et al.	2004-01-22
Connecting circuit devices and assemblies thereof App 20040007782 - Hedler, Harry ; et al.	2004-01-15
Method producing a contact connection between a semiconductor chip and a substrate and the contact connection App 20030201452 - Hedler, Harry ; et al.	2003-10-30
Laser programming of integrated circuits Grant 6,630,723 - Hedler , et al. October 7, 2	2003-10-07
Method of producing semiconductor chips with a chip edge guard, in particular for wafer level packaging chips App 20030143819 - Hedler, Harry ; et al.	2003-07-31
Method for connection of circuit units App 20030110628 - Frankowsky, Gerd ; et al.	2003-06-19
Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another App 20030112610 - Frankowsky, Gerd ; et al.	2003-06-19
Process for producing a component module App 20030109072 - Meyer, Thorsten ; et al.	2003-06-12
Process for producing a semiconductor chip App 20030094695 - Hedler, Harry ; et al.	2003-05-22
Laser programming of integrated circuits App 20030006479 - Hedler, Harry ; et al.	2003-01-09

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