Interrante; Mario J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Interrante; Mario J..The latest application filed is for "silicon interposer sandwich structure for esd, emc, and emc shielding and protection".

Company Profile

2.34.33

Interrante; Mario J. - New Paltz NY
Interrante; Mario J. - Armonk NY
Interrante; Mario J. - Hopewell Junction NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shielding and Protection App 20210288022 - BERNIER; William EMMETT ; et al.	2021-09-16
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection Grant 11,049,841 - Bernier , et al. June 29, 2	2021-06-29
Selective area heating for 3D chip stack Grant 10,903,187 - Interrante , et al. January 26, 2	2021-01-26
Selective area heating for 3D chip stack Grant 10,262,970 - Interrante , et al.	2019-04-16
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection App 20180350768 - BERNIER; William E. ; et al.	2018-12-06
Selective Area Heating For 3d Chip Stack App 20180084649 - Interrante; Mario J. ; et al.	2018-03-22
Selective area heating for 3D chip stack Grant 9,860,996 - Interrante , et al. January 2, 2	2018-01-02
Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shielding and Protection App 20170358552 - BREINER; William E. ; et al.	2017-12-14
Selective Area Heating For 3d Chip Stack App 20160330848 - Interrante; Mario J. ; et al.	2016-11-10
Selective Area Heating For 3d Chip Stack App 20160329218 - Interrante; Mario J. ; et al.	2016-11-10
Selective area heating for 3D chip stack Grant 9,431,366 - Interrante , et al. August 30, 2	2016-08-30
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection App 20160233190 - Bernier; William E. ; et al.	2016-08-11
Integrated Circuit Bonding With Interposer Die App 20160190071 - Interrante; Mario J. ; et al.	2016-06-30
Integrated circuit bonding with interposer die Grant 9,373,590 - Interrante , et al. June 21, 2	2016-06-21
3D bond and assembly process for severely bowed interposer die Grant 9,224,712 - Interrante , et al. December 29, 2	2015-12-29
Selective Area Heating For 3d Chip Stack App 20150235986 - Interrante; Mario J. ; et al.	2015-08-20
3d Bond And Assembly Process For Severely Bowed Interposer Die App 20150228614 - INTERRANTE; MARCUS E ; et al.	2015-08-13
Selective area heating for 3D chip stack Grant 9,105,629 - Interrante , et al. August 11, 2	2015-08-11
3D assembly for interposer bow Grant 9,059,241 - Interrante , et al. June 16, 2	2015-06-16
Selective Area Heating For 3d Chip Stack App 20140256090 - Interrante; Mario J. ; et al.	2014-09-11
3d Assembly For Interposer Bow App 20140209666 - Interrante; Mario J. ; et al.	2014-07-31
Solder ball contact susceptible to lower stress Grant 8,614,512 - Guerin , et al. December 24, 2	2013-12-24
Semiconductor structure having offset passivation to reduce electromigration Grant 8,487,447 - Interrante , et al. July 16, 2	2013-07-16
Interposer for ESD, EMI, and EMC App 20130082365 - BERNIER; WILLIAM E. ; et al.	2013-04-04
Solder ball contact susceptible to lower stress Grant 8,383,505 - Guerin , et al. February 26, 2	2013-02-26
Solder Ball Contact Susceptible To Lower Stress App 20130015579 - Guerin; Luc ; et al.	2013-01-17
Semiconductor Structure Having Offset Passivation To Reduce Electromigration App 20120292779 - INTERRANTE; MARIO J. ; et al.	2012-11-22
Solder Ball Contact Susceptible To Lower Stress App 20120256313 - Guerin; Luc ; et al.	2012-10-11
Method to recover underfilled modules by selective removal of discrete components Grant 7,781,232 - Arvin , et al. August 24, 2	2010-08-24
Method To Recover Underfilled Modules By Selective Removal Of Discrete Components App 20090184407 - Arvin; Charles L. ; et al.	2009-07-23
Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si Interposer App 20090085202 - Dang; Bing ; et al.	2009-04-02
Reworkable Chip Stack App 20080206960 - Dang; Bing ; et al.	2008-08-28
Method For Preparing And Assembling A Soldered Substrate App 20070158395 - Fasano; Benjamin V. ; et al.	2007-07-12
Standoff Structures For Surface Mount Components App 20070007323 - Russell; David J. ; et al.	2007-01-11
Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly Grant 6,917,113 - Farooq , et al. July 12, 2	2005-07-12
Optoelectronic package structure and process for planar passive optical and optoelectronic devices Grant 6,827,505 - Shinde , et al. December 7, 2	2004-12-07
Lead-free Alloys For Column/ball Grid Arrays, Organic Interposers And Passive Component Assembly App 20040212094 - Farooq, Mukta G. ; et al.	2004-10-28
Method of preventing solder wetting in an optical device using diffusion of Cr Grant 6,762,119 - Ray , et al. July 13, 2	2004-07-13
Optoelectronic package structure and process for planar passive optical and optoelectronic devices App 20040114884 - Shinde, Subhash L. ; et al.	2004-06-17
EMI shielding for semiconductor chip carriers Grant 6,740,959 - Alcoe , et al. May 25, 2	2004-05-25
Temporary attach article and method for temporary attach of devices to a substrate Grant 6,518,674 - Interrante , et al. February 11, 2	2003-02-11
EMI shielding for semiconductor chip carriers App 20030025180 - Alcoe, David James ; et al.	2003-02-06
Interconnect structure and process for silicon optical bench App 20020196996 - Ray, Sudipta K. ; et al.	2002-12-26
Apparatus and method for removing interconnections Grant 6,497,357 - Jackson , et al. December 24, 2	2002-12-24
Apparatus And Method For Removing Interconnections App 20020162880 - Jackson, Raymond A. ; et al.	2002-11-07
Conductive adhesive interconnection with insulating polymer carrier Grant 6,458,623 - Goldmann , et al. October 1, 2	2002-10-01
High density column grid array connections and method thereof Grant 6,429,388 - Interrante , et al. August 6, 2	2002-08-06
Conductive adhesive interconnection with insulating polymer carrier App 20020093104 - Goldmann, Lewis S. ; et al.	2002-07-18
Method of forming an electrical connector App 20020092164 - Guerin, Luc Gilbert ; et al.	2002-07-18
Mechanical attachment means used as electrical connection Grant 6,287,126 - Berger , et al. September 11, 2	2001-09-11
Method for enhancing fatigue life of ball grid arrays Grant 6,283,359 - Brofman , et al. September 4, 2	2001-09-04
Temporary attach article and method for temporary attach of devices to a substrate App 20010008778 - Interrante, Mario J. ; et al.	2001-07-19
Process and apparatus to remove closely spaced chips on a multi-chip module App 20010006188 - DeLaurentis, Stephen A. ; et al.	2001-07-05
Interconnection process for module assembly and rework App 20010005314 - Farooq, Shaji ; et al.	2001-06-28
Interconnection structure and process module assembly and rework Grant 6,235,996 - Farooq , et al. May 22, 2	2001-05-22
Process and apparatus to remove closely spaced chips on a multi-chip module Grant 6,216,937 - DeLaurentis , et al. April 17, 2	2001-04-17
Method for enhancing fatigue life of ball grid arrays Grant 6,158,644 - Brofman , et al. December 12, 2	2000-12-12
Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity Grant 6,037,193 - Interrante , et al. March 14, 2	2000-03-14
Hermetic CBGA/CCGA structure with thermal paste cooling Grant 5,990,418 - Bivona , et al. November 23, 1	1999-11-23
Apparatus and methods for making simultaneous electrical connections Grant 5,288,007 - Interrante , et al. February 22, 1	1994-02-22
Method and structure for repairing electrical lines Grant 5,153,408 - Handford , et al. October 6, 1	1992-10-06
High melting point copper-gold-tin brazing alloy for chip carriers Grant 4,634,638 - Ainslie , et al. * January 6, 1	1987-01-06