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Method for manufacturing semiconductor integrated circuit devices using a conductive layer to prevent peeling between a bonding pad and an underlying insulating film Grant 6,696,357 - Imai , et al. February 24, 2 | 2004-02-24 |
Semiconductor device and method for manufacturing the same Grant 6,638,854 - Homma , et al. October 28, 2 | 2003-10-28 |
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Semiconductor device App 20030109129 - Saito, Tatsuyuki ;   et al. | 2003-06-12 |
Semiconductor device App 20030089928 - Saito, Tatsuyuki ;   et al. | 2003-05-15 |
Apparatus and method for producing substrate with electrical wire thereon Grant 6,561,875 - Homma , et al. May 13, 2 | 2003-05-13 |
Method of manufacturing a semiconductor device and a semiconductor device App 20030073317 - Hara, Kazusato ;   et al. | 2003-04-17 |
Method for manufacturing semiconductor integrated circuit device App 20030045088 - Imai, Toshinori ;   et al. | 2003-03-06 |
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Process for manufacturing semiconductor integrated circuit device App 20020058363 - Ohashi, Naofumi ;   et al. | 2002-05-16 |
Process for manufacturing semiconductor integrated circuit device Grant 6,376,345 - Ohashi , et al. April 23, 2 | 2002-04-23 |
Semiconductor device and method for manufacturing the same App 20020025605 - Homma, Yoshio ;   et al. | 2002-02-28 |
Method for manufacturing a semiconductor device Grant 6,326,299 - Homma , et al. December 4, 2 | 2001-12-04 |
Semiconductor integrated circuit device and a method of manufacturing the same App 20010045651 - Saito, Tatsuyuki ;   et al. | 2001-11-29 |
Method of manufacturing a semiconductor device and a semicondustor device App 20010034132 - Hara, Kazusato ;   et al. | 2001-10-25 |