Im; Yun Hyeok

Patent Applications and Registrations

Patent applications and USPTO patent grants for Im; Yun Hyeok.The latest application filed is for "method of dynamic thermal management of electronic device".

Company Profile

5.28.43

Im; Yun Hyeok - Hwaseong-si KR
Im; Yun-hyeok - Gyeonggi-do KR
Im; Yun-Hyeok - Yongin-si KR
Im; Yun-Hyeok - Seoul KR
Im; Yun-hyeok - Kyungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device package and apparatus comprising the same Grant 11,244,936 - Im , et al. February 8, 2	2022-02-08
Method Of Dynamic Thermal Management Of Electronic Device App 20210405670 - Im; Yun-Hyeok ; et al.	2021-12-30
Semiconductor package Grant 11,171,128 - Im , et al. November 9, 2	2021-11-09
Method of dynamic thermal management of electronic device Grant 11,119,517 - Im , et al. September 14, 2	2021-09-14
Semiconductor Package App 20210257275 - PARK; Soo Jeoung ; et al.	2021-08-19
Controllers, apparatuses, and methods for thermal management using adaptive thermal resistance and thermal capacity Grant 10,852,080 - Im , et al. December 1, 2	2020-12-01
Semiconductor Package App 20200219860 - Im; Yun Hyeok ; et al.	2020-07-09
Semiconductor package Grant 10,607,971 - Im , et al.	2020-03-31
Semiconductor Device Package And Apparatus Comprising The Same App 20190295998 - IM; Yun Hyeok ; et al.	2019-09-26
Semiconductor Package App 20190115325 - IM; Yun Hyeok ; et al.	2019-04-18
Semiconductor Device Package And Method For Fabricating The Same App 20180315740 - IM; Yun Hyeok ; et al.	2018-11-01
Method Of Dynamic Thermal Management Of Electronic Device App 20180259985 - Im; Yun-Hyeok ; et al.	2018-09-13
Controllers, Apparatuses, And Methods For Thermal Management Using Adaptive Thermal Resistance And Thermal Capacity App 20180209750 - IM; Yun-hyeok ; et al.	2018-07-26
Semiconductor package and electronic system including the same Grant 9,666,503 - Im , et al. May 30, 2	2017-05-30
Semiconductor package having stacked semiconductor chips Grant 9,589,945 - Jo , et al. March 7, 2	2017-03-07
System and method for predicting the temperature of a device Grant 9,482,584 - Im , et al. November 1, 2	2016-11-01
Semiconductor Package And Three-dimensional Semiconductor Package Including The Same App 20160315029 - LEE; Dong-Han ; et al.	2016-10-27
Semiconductor Package Having Stacked Semiconductor Chips App 20160093598 - JO; Cha-jea ; et al.	2016-03-31
Method of manufacturing a semiconductor package including a surface profile modifier Grant 9,293,389 - Park , et al. March 22, 2	2016-03-22
Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package Grant 9,076,881 - Im , et al. July 7, 2	2015-07-07
Method Of Manufacturing A Semiconductor Package App 20150104905 - PARK; Kyol ; et al.	2015-04-16
Semiconductor Device Having Thermoelectric Module App 20150062824 - HYUN; YOUNG-HOON ; et al.	2015-03-05
Semiconductor Packages Including Heat Exhaust Part App 20150054148 - JANG; Eon-Soo ; et al.	2015-02-26
Semiconductor package Grant 8,921,990 - Park , et al. December 30, 2	2014-12-30
Semiconductor Package And Electronic System Including The Same App 20140254092 - Im; Yun-Hyeok ; et al.	2014-09-11
Stack package and semiconductor package including the same Grant 8,791,562 - Lee , et al. July 29, 2	2014-07-29
Semiconductor Package App 20140168902 - PARK; Kyol ; et al.	2014-06-19
Bump Structure Including Nano-wires And A Body Connecting Ends Of The Nano-wires, Semiconductor Package Having The Bump Structure And Method Of Manufacturing The Semiconductor Package App 20140147974 - IM; Yun-Hyeok ; et al.	2014-05-29
Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package Grant 8,643,179 - Im , et al. February 4, 2	2014-02-04
Semiconductor packages Grant 8,587,134 - Im , et al. November 19, 2	2013-11-19
System And Method For Predicting The Temperature Of A Device App 20130259092 - IM; Yun-hyeok ; et al.	2013-10-03
Semiconductor Packages App 20130134606 - IM; Yun-hyeok ; et al.	2013-05-30
Bump Structure And Semiconductor Package Having The Bump Structure App 20120119359 - Im; Yun-Hyeok ; et al.	2012-05-17
Micro heat flux sensor array Grant 8,104,952 - Yoo , et al. January 31, 2	2012-01-31
Stack Package And Semiconductor Package Including The Same App 20120018871 - LEE; Chung-sun ; et al.	2012-01-26
Micro heat flux sensor array App 20100158069 - Yoo; Jae-Wook ; et al.	2010-06-24
Micro heat flux sensor array Grant 7,699,520 - Yoo , et al. April 20, 2	2010-04-20
Heat-radiating tape carrier package and method for manufacturing the same Grant 7,601,561 - Im , et al. October 13, 2	2009-10-13
Semiconductor Package Having Enhanced Heat Dissipation And Method Of Fabricating The Same App 20080213992 - KIM; Sang-uk ; et al.	2008-09-04
Semiconductor package having enhanced heat dissipation and method of fabricating the same Grant 7,388,286 - Kim , et al. June 17, 2	2008-06-17
Semiconductor package Grant 7,375,426 - Kang , et al. May 20, 2	2008-05-20
Semiconductor chip having coolant path, semiconductor package and package cooling system using the same Grant 7,372,148 - Im , et al. May 13, 2	2008-05-13
Heat-radiating tape carrier package and method for manufacturing the same App 20070216016 - Im; Yun-Hyeok ; et al.	2007-09-20
Micro heat flux sensor array App 20070181650 - Yoo; Jae-Wook ; et al.	2007-08-09
Semiconductor chip package with a metal substrate and semiconductor module having the same App 20070108599 - Im; Yun-Hyeok ; et al.	2007-05-17
Semiconductor package having thermal interface material (TIM) Grant 7,081,375 - Baek , et al. July 25, 2	2006-07-25
Multi-path printed circuit board having heterogeneous layers and power delivery system including the same App 20060157826 - Lee; Hee-seok ; et al.	2006-07-20
Semiconductor package having enhanced heat dissipation and method of fabricating the same App 20060145316 - Kim; Sang-uk ; et al.	2006-07-06
Semiconductor chip having coolant path, semiconductor package and package cooling system using the same App 20060131737 - Im; Yun-Hyeok ; et al.	2006-06-22
Temperature measuring device using a matrix switch, a semiconductor package and a cooling system App 20060075760 - Im; Yun-Hyeok ; et al.	2006-04-13
Semiconductor package App 20060012019 - Kang; Suk-Chae ; et al.	2006-01-19
Apparatus for transferring heat and method of manufacturing the same App 20050189093 - Im, Yun-Hyeok	2005-09-01
Semiconductor package having dam and method for fabricating the same Grant 6,891,259 - Im , et al. May 10, 2	2005-05-10
Stacked semiconductor module and method of manufacturing the same Grant 6,835,598 - Baek , et al. December 28, 2	2004-12-28
Clothespin type heat dissipating apparatus for semiconductor module App 20040250989 - Im, Yun-hyeok ; et al.	2004-12-16
Semiconductor package having thermal interface material (TIM) App 20040197948 - Baek, Joong-Hyun ; et al.	2004-10-07
Multi-chip package having improved heat spread characteristics and method for manufacturing the same Grant 6,781,849 - Baek , et al. August 24, 2	2004-08-24
Semiconductor package having thermal interface material (TIM) Grant 6,756,668 - Baek , et al. June 29, 2	2004-06-29
Semiconductor package having DAM and method for fabricating the same App 20040036183 - Im, Yun-Hyeok ; et al.	2004-02-26
Stacked semiconductor module and method of manufacturing the same App 20040018661 - Baek, Joong-Hyun ; et al.	2004-01-29
Multi-chip package having improved heat spread characteristics and method for manufacturing the same App 20030210533 - Baek, Joong-Hyun ; et al.	2003-11-13
Semiconductor package having dam and method for fabricating the same App 20030085475 - Im, Yun-Hyeok ; et al.	2003-05-08
Semiconductor package having thermal interface material (TIM) App 20030080411 - Baek, Joong-Hyun ; et al.	2003-05-01

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.