Iijima; Toshitsune

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iijima; Toshitsune.The latest application filed is for "method for manufacturing a semiconductor device and a semiconductor device".

Company Profile

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Iijima; Toshitsune - Tokyo N/A JP
Iijima; Toshitsune - Tama-shi JP
Iijima; Toshitsune - Tama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing a semiconductor device and a semiconductor device Grant 8,673,690 - Iijima March 18, 2	2014-03-18
Method For Manufacturing A Semiconductor Device And A Semiconductor Device App 20110221066 - WATANABE; Kazuhiro ; et al.	2011-09-15
Method For Manufacturing A Semiconductor Device And A Semiconductor Device App 20110215461 - IIJIMA; Toshitsune	2011-09-08
Semiconductor Device And Manufacturing Method Thereof App 20100213599 - Watanabe; Kazuhiro ; et al.	2010-08-26
Method of dividing a semiconductor wafer utilizing a laser dicing technique Grant 7,138,297 - Iijima , et al. November 21, 2	2006-11-21
Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same Grant 7,091,624 - Iijima , et al. August 15, 2	2006-08-15
Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same App 20050017326 - Iijima, Toshitsune ; et al.	2005-01-27
Semiconductor wafer having separation groove on insulating film on dicing line region and its manufacturing method App 20040169258 - Iijima, Toshitsune	2004-09-02
First and second level packaging assemblies and method of assembling package App 20040155358 - Iijima, Toshitsune	2004-08-12
Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same App 20040137702 - Iijima, Toshitsune ; et al.	2004-07-15
Wiring pattern of semiconductor device Grant 6,713,869 - Kusakabe , et al. March 30, 2	2004-03-30
Wiring pattern of semiconductor device App 20030071364 - Kusakabe, Takeshi ; et al.	2003-04-17
Semiconductor device Grant D473,198 - Ozawa , et al. April 15, 2	2003-04-15

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