Hwang; Seong-deok

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hwang; Seong-deok.The latest application filed is for "light emitting device package and manufacturing method therof".

Company Profile

0.38.41

Hwang; Seong-deok - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light emitting device package Grant 9,691,957 - Lee , et al. June 27, 2	2017-06-27
Light emitting device package and manufacturing method thereof Grant 9,577,147 - Lee , et al. February 21, 2	2017-02-21
Light emitting device package and manufacturing method thereof Grant 9,472,722 - Lee , et al. October 18, 2	2016-10-18
Light Emitting Device Package And Manufacturing Method Therof App 20160276536 - LEE; Sang Hyun ; et al.	2016-09-22
Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method Grant 9,269,877 - Kim , et al. February 23, 2	2016-02-23
Method of grinding substrate and method of manufacturing semiconductor light emitting device using the same Grant 9,165,817 - Kim , et al. October 20, 2	2015-10-20
Light Emitting Device Package App 20150255694 - LEE; Sang-hyun ; et al.	2015-09-10
Light emitting device package and manufacturing method thereof Grant 9,070,852 - Lee , et al. June 30, 2	2015-06-30
Light emitting device package Grant 9,065,033 - Lee , et al. June 23, 2	2015-06-23
Light Emitting Diode Package And Method Of Manufacturing The Same App 20150102373 - Lee; Sang Hyun ; et al.	2015-04-16
Light-emitting device package and method of manufacturing the same Grant 8,987,022 - Yoo , et al. March 24, 2	2015-03-24
Light emitting apparatus Grant 8,896,078 - Kam , et al. November 25, 2	2014-11-25
LED package with recess and protrusions Grant 8,847,270 - Park , et al. September 30, 2	2014-09-30
Wafer level light-emitting device package and method of manufacturing the same Grant 8,828,756 - Hwang September 9, 2	2014-09-09
Light Emitting Device Package App 20140239328 - LEE; Sang-hyun ; et al.	2014-08-28
Method Of Grinding Substrate And Method Of Manufacturing Semiconductor Light Emitting Device Using The Same App 20140235000 - KIM; Jae Yoon ; et al.	2014-08-21
Light-emitting Device Package App 20140232293 - KAM; Dong-hyuck ; et al.	2014-08-21
Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device Grant 8,809,888 - Kim , et al. August 19, 2	2014-08-19
Semiconductor packages and methods of manufacturing the same Grant 8,735,276 - Chung , et al. May 27, 2	2014-05-27
Light emitting device package and method of manufacturing the same Grant 8,722,435 - Yoo , et al. May 13, 2	2014-05-13
Light emitting device package and manufacturing method thereof Grant 8,679,872 - Yoo , et al. March 25, 2	2014-03-25
Method Of Fabricating Light-emitting Apparatus With Improved Light Extraction Efficiency And Light-emitting Apparatus Fabricated Using The Method App 20140061710 - Kim; Yu-Sik ; et al.	2014-03-06
Light Emitting Device Package And Method Of Manufacturing The Same App 20140045286 - YOO; Cheol Jun ; et al.	2014-02-13
Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method Grant 8,637,881 - Kim , et al. January 28, 2	2014-01-28
Light emitting device package and method of manufacturing the same Grant 8,587,010 - Yoo , et al. November 19, 2	2013-11-19
Light Emitting Apparatus App 20130234274 - KAM; Dong Hyuck ; et al.	2013-09-12
Method Of Fabricating Light Emitting Device App 20130236997 - LEE; Sang Hyun ; et al.	2013-09-12
Light Emitting Element With Improved Light Extraction Efficiency, Light Emitting Device Comprising The Same, And Fabricating Method Of The Light Emitting Element And The Light Emitting Device App 20130193474 - Kim; Yu-Sik ; et al.	2013-08-01
Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device Grant 8,415,181 - Kim , et al. April 9, 2	2013-04-09
Light emitting device with improved light extraction efficiency Grant 8,319,238 - Lee , et al. November 27, 2	2012-11-27
Light Emitting Diode Package And Manufacturing Method Thereof App 20120267663 - PARK; Hun Yong ; et al.	2012-10-25
Semiconductor Light Emitting Diode Chip, Method Of Manufacturing Thereof And Method For Quality Control Thereof App 20120235142 - SONG; Young Hee ; et al.	2012-09-20
Light Emitting Device Package And Method Of Manufacturing Thereof App 20120205696 - YOO; Cheol Jun ; et al.	2012-08-16
Method Of Fabricating Light-emitting Apparatus With Improved Light Extraction Efficiency And Light-emitting Apparatus Fabricated Using The Method App 20120193672 - Kim; Yu-Sik ; et al.	2012-08-02
Wafer Level Light-emitting Device Package And Method Of Manufacturing The Same App 20120181558 - HWANG; Seong-deok	2012-07-19
Light-emitting Device Package And Method Of Manufacturing The Same App 20120181555 - Yoo; Cheol-jun ; et al.	2012-07-19
Light Emitting Device Package And Method Of Manufacturing The Same App 20120161181 - YOO; Cheol Jun ; et al.	2012-06-28
Led Package App 20120153334 - PARK; Hun Yong ; et al.	2012-06-21
Tray, Testing Apparatus And Testing Method Using The Same App 20120140210 - YOO; Cheol Jun ; et al.	2012-06-07
Light Emitting Device Package And Manufacturing Method Thereof App 20120138974 - YOO; Cheol Jun ; et al.	2012-06-07
Light Emitting Device Package And Manufacturing Method Thereof App 20120138988 - LEE; Sang Hyun ; et al.	2012-06-07
Semiconductor Packages And Methods Of Manufacturing The Same App 20120129334 - CHUNG; Hyun-Soo ; et al.	2012-05-24
Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method Grant 8,178,424 - Kim , et al. May 15, 2	2012-05-15
Light Emitting Element With Improved Light Extraction Efficiency, Light Emitting Device Comprising The Same, And Fabricating Method Of The Light Emitting Element And The Light Emitting Device App 20120107988 - Kim; Yu-Sik ; et al.	2012-05-03
Method For Manufacturing Light Emitting Device, Light Emitting Device, Light Emitting Element Substrate, And Quality Management Method App 20120074438 - HWANG; Seong Deok ; et al.	2012-03-29
Semiconductor module Grant 8,111,520 - Chung , et al. February 7, 2	2012-02-07
Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device Grant 8,110,843 - Kim , et al. February 7, 2	2012-02-07
Wafer level semiconductor module and method for manufacturing the same Grant 8,110,922 - Chung , et al. February 7, 2	2012-02-07
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same Grant 8,039,937 - Chung , et al. October 18, 2	2011-10-18
Semiconductor package with joint reliability, entangled wires including insulating material Grant 7,969,024 - Chung , et al. June 28, 2	2011-06-28
Method of manufacturing chip-on-chip semiconductor device Grant 7,851,256 - Chung , et al. December 14, 2	2010-12-14
Wafer level package and method of fabricating the same Grant 7,847,416 - Chung , et al. December 7, 2	2010-12-07
Light Emitting Device With Improved Light Extraction Efficiency App 20100176415 - Lee; Seung-Jae ; et al.	2010-07-15
Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method App 20100120183 - Kim; Yu-Sik ; et al.	2010-05-13
Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device App 20100078670 - Kim; Yu-Sik ; et al.	2010-04-01
Wafer level semiconductor module and method for manufacturing the same App 20100032807 - Chung; Hyun-Soo ; et al.	2010-02-11
Semiconductor package with joint reliability App 20090315177 - Chung; Hyun-soo ; et al.	2009-12-24
Stack-type semiconductor device having cooling path on its bottom surface Grant 7,626,260 - Chung , et al. December 1, 2	2009-12-01
Wafer Level Package And Method Of Fabricating The Same App 20090267211 - CHUNG; Hyun-Soo ; et al.	2009-10-29
Method Of Forming Semiconductor Chips, The Semiconductor Chips So Formed And Chip-stack Package Having The Same App 20090206464 - CHUNG; Hyun-Soo ; et al.	2009-08-20
Semiconductor Packages And Methods Of Manufacturing The Same App 20090184411 - CHUNG; Hyun-Soo ; et al.	2009-07-23
Semiconductor Module App 20090168382 - CHUNG; Hyun-Soo ; et al.	2009-07-02
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same Grant 7,544,538 - Chung , et al. June 9, 2	2009-06-09
Semiconductor Modules And Electronic Devices Using The Same App 20090109642 - Chung; Hyun-Soo ; et al.	2009-04-30
Method of manufacturing chip-on-chip semiconductor device App 20090111217 - Chung; Hyun-soo ; et al.	2009-04-30
Method Of Forming Semiconductor Chips, The Semiconductor Chips So Formed And Chip-stack Package Having The Same App 20080014735 - CHUNG; Hyun-Soo ; et al.	2008-01-17
Wafer Level Package And Method Of Fabricating The Same App 20070269931 - Chung; Hyun-Soo ; et al.	2007-11-22
Stack-type Semiconductor Device Having Cooling Path On Its Bottom Surface App 20070267738 - CHUNG; Hyun-Soo ; et al.	2007-11-22
Wafer level semiconductor module and method for manufacturing the same App 20070246826 - Chung; Hyun-Soo ; et al.	2007-10-25
Method of fabricating wafer level package App 20070184577 - Chung; Hyun-Soo ; et al.	2007-08-09

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