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Semiconductor Device And Manufacturing Method Thereof
App 20220189844 - Hung; Wensen ; et al. | 2022-06-16 |
Package Structure
App 20220149030 - Lin; Tsung-Shu ; et al. | 2022-05-12 |
Semiconductor device and manufacturing method thereof
Grant 11,302,600 - Hung , et al. April 12, 2 | 2022-04-12 |
Semiconductor Device And Manufacturing Method Thereof
App 20220102288 - Hung; Wensen ; et al. | 2022-03-31 |
Package structure
Grant 11,282,825 - Lin , et al. March 22, 2 | 2022-03-22 |
Package structure
Grant 11,282,766 - Ku , et al. March 22, 2 | 2022-03-22 |
Semiconductor Structure
App 20210366805 - WU; CHI-HSI ; et al. | 2021-11-25 |
Package Structure
App 20210366889 - Lin; Tsung-Shu ; et al. | 2021-11-25 |
Package Structure and Method and Equipment for Forming the Same
App 20210343619 - Hung; Wensen ; et al. | 2021-11-04 |
Package with embedded heat dissipation features
Grant 11,133,237 - Hung , et al. September 28, 2 | 2021-09-28 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20210287956 - Hung; Wensen ; et al. | 2021-09-16 |
Heat Spreading Device and Method
App 20210280491 - Lin; Tsung-Shu ; et al. | 2021-09-09 |
Semiconductor structure
Grant 11,088,048 - Wu , et al. August 10, 2 | 2021-08-10 |
Semiconductor Device and Method of Manufacture
App 20210233833 - Ku; Shih-Chang ; et al. | 2021-07-29 |
Package structure and method and equipment for forming the same
Grant 11,062,971 - Hung , et al. July 13, 2 | 2021-07-13 |
Semiconductor Device And Manufacturing Method Thereof
App 20210193550 - Hung; Wensen ; et al. | 2021-06-24 |
3DIC packaging with hot spot thermal management features
Grant 11,037,852 - Hung , et al. June 15, 2 | 2021-06-15 |
Heat spreading device and method
Grant 11,018,073 - Lin , et al. May 25, 2 | 2021-05-25 |
Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
Grant 11,004,771 - Hsieh , et al. May 11, 2 | 2021-05-11 |
Semiconductor device methods of manufacture
Grant 10,978,373 - Ku , et al. April 13, 2 | 2021-04-13 |
Package Structure
App 20210098333 - Ku; Shih-Chang ; et al. | 2021-04-01 |
Heat spreading device and method
Grant 10,867,884 - Yu , et al. December 15, 2 | 2020-12-15 |
Heat spreading device and method
Grant 10,867,885 - Yu , et al. December 15, 2 | 2020-12-15 |
3DIC Package Comprising Perforated Foil Sheet
App 20200294817 - Hung; Wensen | 2020-09-17 |
Package With Embedded Heat Dissipation Features
App 20200251398 - Kind Code | 2020-08-06 |
Package Structure and Method and Equipment for Forming the Same
App 20200219786 - Hung; Wensen ; et al. | 2020-07-09 |
3DIC package comprising perforated foil sheet
Grant 10,685,854 - Hung | 2020-06-16 |
Semiconductor Structure
App 20200135610 - WU; CHI-HSI ; et al. | 2020-04-30 |
Package with embedded heat dissipation features
Grant 10,629,510 - Hung , et al. | 2020-04-21 |
Heat Spreading Device And Method
App 20200051888 - Lin; Tsung-Shu ; et al. | 2020-02-13 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20200027809 - Hung; Wensen ; et al. | 2020-01-23 |
Heat Spreading Device and Method
App 20200013698 - Yu; Chen-Hua ; et al. | 2020-01-09 |
Heat Spreading Device and Method
App 20200013697 - Yu; Chen-Hua ; et al. | 2020-01-09 |
Semiconductor structure and manufacturing method thereof
Grant 10,515,867 - Wu , et al. Dec | 2019-12-24 |
Semiconductor Device And Method Of Manufacture
App 20190385929 - Ku; Shih-Chang ; et al. | 2019-12-19 |
Packaging devices and methods for semiconductor devices
Grant 10,510,687 - Hung Dec | 2019-12-17 |
Heat spreading device and method
Grant 10,483,187 - Yu , et al. Nov | 2019-11-19 |
3DIC packaging with hot spot thermal management features
Grant 10,461,009 - Hung , et al. Oc | 2019-10-29 |
Heat spreading device and method
Grant 10,461,014 - Lin , et al. Oc | 2019-10-29 |
3D semiconductor package interposer with die cavity
Grant 10,446,520 - Jeng , et al. Oc | 2019-10-15 |
Cooling Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices
App 20190252294 - Hsieh; Cheng-Chieh ; et al. | 2019-08-15 |
Packaged semiconductor devices
Grant 10,332,823 - Chen , et al. | 2019-06-25 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190148261 - WU; CHI-HSI ; et al. | 2019-05-16 |
Packaging Devices and Methods for Semiconductor Devices
App 20190122999 - Hung; Wensen | 2019-04-25 |
Packaged Semiconductor Devices
App 20190122959 - Chen; Kim Hong ; et al. | 2019-04-25 |
Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
Grant 10,269,682 - Hsieh , et al. | 2019-04-23 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20190096781 - Hung; Wensen ; et al. | 2019-03-28 |
Heat Spreading Device and Method
App 20190067157 - Lin; Tsung-Shu ; et al. | 2019-02-28 |
Heat Spreading Device and Method
App 20190006263 - Yu; Chen-Hua ; et al. | 2019-01-03 |
Packaging devices and methods for semiconductor devices
Grant 10,163,821 - Hung Dec | 2018-12-25 |
3DIC packaging with hot spot thermal management features
Grant 10,157,813 - Hung , et al. Dec | 2018-12-18 |
Methods of cooling packaged semiconductor devices
Grant 10,157,818 - Chen , et al. Dec | 2018-12-18 |
Semiconductor structure and manufacturing method thereof
Grant 10,153,218 - Chen , et al. Dec | 2018-12-11 |
Package with Embedded Heat Dissipation Features
App 20180269127 - Hung; Wensen ; et al. | 2018-09-20 |
Semiconductor packages with thermal management features for reduced thermal crosstalk
Grant 10,062,665 - Chen , et al. August 28, 2 | 2018-08-28 |
Packaging Devices and Methods for Semiconductor Devices
App 20180174984 - Hung; Wensen | 2018-06-21 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180151472 - CHEN; TSUNG-YU ; et al. | 2018-05-31 |
3DIC package and methods of forming the same
Grant 9,985,001 - Chen , et al. May 29, 2 | 2018-05-29 |
Package with embedded heat dissipation features
Grant 9,978,660 - Hung , et al. May 22, 2 | 2018-05-22 |
3DIC packages with heat dissipation structures
Grant 9,941,251 - Hung , et al. April 10, 2 | 2018-04-10 |
Packaging devices and methods for semiconductor devices
Grant 9,893,021 - Hung February 13, 2 | 2018-02-13 |
Test structures and testing methods for semiconductor devices
Grant 9,891,273 - Kuo , et al. February 13, 2 | 2018-02-13 |
3D Semiconductor Package Interposer with Die Cavity
App 20180026008 - Jeng; Shin-Puu ; et al. | 2018-01-25 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20170345732 - Hung; Wensen ; et al. | 2017-11-30 |
3D semiconductor package interposer with die cavity
Grant 9,780,072 - Jeng , et al. October 3, 2 | 2017-10-03 |
3DIC Package Comprising Perforated Foil Sheet
App 20170250092 - Hung; Wensen | 2017-08-31 |
3DIC packaging with hot spot thermal management features
Grant 9,735,082 - Hung , et al. August 15, 2 | 2017-08-15 |
Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same
App 20170162542 - Chen; Kim Hong ; et al. | 2017-06-08 |
3DIC Packages with Heat Dissipation Structures
App 20170148767 - Hung; Wensen ; et al. | 2017-05-25 |
3DIC package comprising perforated foil sheet
Grant 9,653,374 - Hung May 16, 2 | 2017-05-16 |
Cooling Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices
App 20170103937 - Hsieh; Cheng-Chieh ; et al. | 2017-04-13 |
Packages with thermal management features for reduced thermal crosstalk and methods of forming same
Grant 9,595,506 - Chen , et al. March 14, 2 | 2017-03-14 |
3DIC Package and Methods of Forming the Same
App 20170062391 - Chen; Kim Hong ; et al. | 2017-03-02 |
Packages with thermal interface material on the sidewalls of stacked dies
Grant 9,583,415 - Yu , et al. February 28, 2 | 2017-02-28 |
3DIC packages with heat dissipation structures
Grant 9,576,938 - Hung , et al. February 21, 2 | 2017-02-21 |
3DIC package and methods of forming the same
Grant 9,496,249 - Chen , et al. November 15, 2 | 2016-11-15 |
3DIC Packages with Heat Dissipation Structures
App 20160284670 - Hung; Wensen ; et al. | 2016-09-29 |
3D Semiconductor Package Interposer with Die Cavity
App 20160254249 - Jeng; Shin-Puu ; et al. | 2016-09-01 |
Testing probe head for wafer level testing, and test probe card
Grant 9,417,263 - Kuo , et al. August 16, 2 | 2016-08-16 |
3D semiconductor package interposer with die cavity
Grant 9,385,095 - Jeng , et al. July 5, 2 | 2016-07-05 |
3DIC packages with heat dissipation structures
Grant 9,379,036 - Hung , et al. June 28, 2 | 2016-06-28 |
Packaging Devices and Methods for Semiconductor Devices
App 20160163657 - Hung; Wensen | 2016-06-09 |
Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same
App 20160133602 - Chen; Kim Hong ; et al. | 2016-05-12 |
Methods of Cooling Packaged Semiconductor Devices
App 20160111350 - Chen; Kim Hong ; et al. | 2016-04-21 |
Packaging devices and methods for semiconductor devices
Grant 9,287,194 - Hung March 15, 2 | 2016-03-15 |
Packages with thermal management features for reduced thermal crosstalk and methods of forming same
Grant 9,269,694 - Chen , et al. February 23, 2 | 2016-02-23 |
3DIC Package and Methods of Forming the Same
App 20160049389 - Chen; Kim Hong ; et al. | 2016-02-18 |
Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices
Grant 9,224,673 - Chen , et al. December 29, 2 | 2015-12-29 |
High frequency probing structure
Grant 9,207,261 - Kuo , et al. December 8, 2 | 2015-12-08 |
3DIC package and methods of forming the same
Grant 9,184,128 - Hung , et al. November 10, 2 | 2015-11-10 |
Package with Embedded Heat Dissipation Features
App 20150262904 - Hung; Wensen ; et al. | 2015-09-17 |
3DIC packages with heat dissipation structures
Grant 9,082,743 - Hung , et al. July 14, 2 | 2015-07-14 |
3DIC packages with heat sinks attached to heat dissipating rings
Grant 9,076,754 - Hung , et al. July 7, 2 | 2015-07-07 |
3DIC Package and Methods of Forming the Same
App 20150171006 - Hung; Wensen ; et al. | 2015-06-18 |
Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same
App 20150162307 - Chen; Kim Hong ; et al. | 2015-06-11 |
3DIC Packaging with Hot Spot Thermal Management Features
App 20150155218 - Hung; Wensen ; et al. | 2015-06-04 |
3DIC Packages with Heat Dissipation Structures
App 20150108631 - Hung; Wensen ; et al. | 2015-04-23 |
Packages with Thermal Interface Material on the Sidewalls of Stacked Dies
App 20150108628 - Yu; Chen-Hua ; et al. | 2015-04-23 |
3DIC Package Comprising Perforated Foil Sheet
App 20150084181 - Hung; Wensen | 2015-03-26 |
High Frequency Probing Structure
App 20150048861 - Kuo; Yung-Hsin ; et al. | 2015-02-19 |
3dic Packages With Heat Dissipation Structures
App 20150035134 - Hung; Wensen ; et al. | 2015-02-05 |
3DIC Packages with Heat Sinks Attached to Heat Dissipating Rings
App 20150035135 - Hung; Wensen ; et al. | 2015-02-05 |
3DIC package comprising perforated foil sheet
Grant 8,907,472 - Hung December 9, 2 | 2014-12-09 |
Test Probe Card
App 20140347085 - KUO; Yung-Hsin ; et al. | 2014-11-27 |
High frequency probing structure
Grant 8,878,560 - Kuo , et al. November 4, 2 | 2014-11-04 |
Probe card wiring structure
Grant 8,841,931 - Kuo , et al. September 23, 2 | 2014-09-23 |
Method of fabricating a semiconductor test probe head
Grant 8,832,933 - Kuo , et al. September 16, 2 | 2014-09-16 |
Packaging Devices and Methods for Semiconductor Devices
App 20140252634 - Hung; Wensen | 2014-09-11 |
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Cooling Packaged Semiconductor Devices
App 20140252585 - Chen; Kim Hong ; et al. | 2014-09-11 |
3DIC Package Comprising Perforated Foil Sheet
App 20140217575 - Hung; Wensen | 2014-08-07 |
3D Semiconductor Package Interposer with Die Cavity
App 20140217610 - Jeng; Shin-Puu ; et al. | 2014-08-07 |
Probe head formation methods employing guide plate raising assembly mechanism
Grant 8,723,538 - Hung , et al. May 13, 2 | 2014-05-13 |
Test Probe Card
App 20130069683 - KUO; Yung-Hsin ; et al. | 2013-03-21 |
Test Structures and Testing Methods for Semiconductor Devices
App 20130002282 - Kuo; Yung-Hsin ; et al. | 2013-01-03 |
Probe Head Formation Methods Employing Guide Plate Raising Assembly Mechanism
App 20120319711 - Hung; Wensen ; et al. | 2012-12-20 |
Probe Card Wiring Structure
App 20120194210 - Kuo; Yung-Hsin ; et al. | 2012-08-02 |
High Frequency Probing Structure
App 20120169367 - Kuo; Yung-Hsin ; et al. | 2012-07-05 |
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