Huang; Yao-Ting

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Yao-Ting.The latest application filed is for "method for analyzing the liquefied petroleum gas and device thereof".

Company Profile

0.18.24

Huang; Yao-Ting - Tainan TW
Huang; Yao-Ting - Tainan City TW
Huang; Yao-Ting - Taipei TW
Huang; Yao-Ting - Taipei City TW
Huang; Yao-Ting - Kaohsiung TW
Huang; Yao-Ting - Koashiung TW
HUANG; Yao Ting - Kaohsiung City TW
Huang; Yao-Ting - Kaoshiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for analyzing the liquefied petroleum gas and device thereof Grant 9,034,654 - Su , et al. May 19, 2	2015-05-19
Methods for recycling liquid crystal and forming reformulated liquid crystal mixtures Grant 8,968,595 - Lu , et al. March 3, 2	2015-03-03
Method For Analyzing The Liquefied Petroleum Gas And Device Thereof App 20140147927 - Su; Hsiu-Li ; et al.	2014-05-29
Capture-and-paste Method For Electronic Device App 20130097543 - Su; Po-Chou ; et al.	2013-04-18
Methods For Recycling Liquid Crystal And Forming Reformulated Liquid Crystal Mixtures App 20130056679 - LU; Chien-Wei ; et al.	2013-03-07
Method and apparatus for resonant frequency identification through out-of-plane displacement detection Grant 8,035,820 - Chen , et al. October 11, 2	2011-10-11
Method and apparatus for identifying dynamic characteristics of a vibratory object Grant 7,965,394 - Chen , et al. June 21, 2	2011-06-21
Method And Apparatus For Resonant Frequency Identification Through Out-of-plane Displacement Detection App 20100277744 - CHEN; Liang-Chia ; et al.	2010-11-04
Method and apparatus for resonant frequency identification through out-of-plane displacement detection Grant 7,782,466 - Chen , et al. August 24, 2	2010-08-24
Manufacturing process of a carrier Grant 7,748,111 - Wang , et al. July 6, 2	2010-07-06
Semiconductor package and method for manufacturing the same Grant 7,656,043 - Huang February 2, 2	2010-02-02
Leadframe of a leadless flip-chip package and method for manufacturing the same Grant 7,602,053 - Huang , et al. October 13, 2	2009-10-13
Leadless semiconductor package and method for manufacturing the same Grant 7,575,957 - Huang , et al. August 18, 2	2009-08-18
Method And Apparatus For Identifying Dynamic Characteristics Of A Vibratory Object App 20090180124 - CHEN; LIANG-CHIA ; et al.	2009-07-16
Signal analysis method for vibratory interferometry Grant 7,536,265 - Chen , et al. May 19, 2	2009-05-19
Multi-row substrate strip and method for manufacturing the same Grant 7,511,366 - Huang , et al. March 31, 2	2009-03-31
Substrate structure having a solder mask and a process for making the same Grant 7,473,629 - Tai , et al. January 6, 2	2009-01-06
Signal Analysis Method For Vibratory Interferometry App 20080243441 - Chen; Liang-Chia ; et al.	2008-10-02
Conversion Substrate For A Leadframe And The Method For Making The Same App 20080232077 - Chang; Che-Yuan ; et al.	2008-09-25
Semiconductor Package And Method For Manufacturing The Same App 20080145969 - HUANG; Yao Ting	2008-06-19
Carrier And Manufacturing Process Thereof App 20080142254 - WANG; CHIEN-HAO ; et al.	2008-06-19
Method and apparatus for resonant frequency identification through out-of-plane displacement detection App 20080137095 - Chen; Liang-Chia ; et al.	2008-06-12
Semiconductor Package And Method For Manufacturing The Same App 20080136014 - HUANG; Yao Ting	2008-06-12
Leadframe Of A Leadless Flip-chip Package And Method For Manufacturing The Same App 20080093717 - Huang; Yao-Ting ; et al.	2008-04-24
Semiconductor package and method for manufacturing the same Grant 7,335,987 - Huang February 26, 2	2008-02-26
Leadframe of a leadless flip-chip package and method for manufacturing the same Grant 7,312,105 - Huang , et al. December 25, 2	2007-12-25
Substrate structure having a solder mask and a process for making the same App 20070243704 - Tai; Wei-Chang ; et al.	2007-10-18
Leadframe for a multi-chip package and method for manufacturing the same Grant 7,157,292 - Huang January 2, 2	2007-01-02
Leadframe with a chip pad for two-sided stacking and method for manufacturing the same Grant 7,101,733 - Huang September 5, 2	2006-09-05
Multi-row substrate strip and method for manufacturing the same App 20060091533 - Huang; Yao-Ting ; et al.	2006-05-04
Circuitized substrate with trace embedded inside ground layer App 20060091558 - Huang; Yao-Ting ; et al.	2006-05-04
Semiconductor package with flip chip on leadless leadframe App 20060022316 - Huang; Yao-Ting ; et al.	2006-02-02
Leadframe of a leadless flip-chip package and method for manufacturing the same App 20050287711 - Huang, Yao-Ting ; et al.	2005-12-29
Leadless semiconductor package and method for manufacturing the same App 20050287710 - Huang, Yao-Ting ; et al.	2005-12-29
Leadframe for a multi-chip package and method for manufacturing the same App 20050287701 - Huang, Yao-Ting	2005-12-29
Leadframe with a chip pad for two-sided stacking and method for manufacturing the same App 20050287700 - Huang, Yao-Ting	2005-12-29
Semiconductor package and method for manufacturing the same App 20050173786 - Huang, Yao Ting	2005-08-11
[method Of Assembling Passive Component] App 20040127011 - HUANG, MIN-LUNG ; et al.	2004-07-01
Die bonder Grant 6,722,412 - Huang , et al. April 20, 2	2004-04-20
Die bonder App 20030094241 - Huang, Yao-Ting ; et al.	2003-05-22

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