loadpatents
Patent applications and USPTO patent grants for Huang; Tzu-Wei.The latest application filed is for "supporting shelf module and wafer container using same".
Patent | Date |
---|---|
Fast multi-modal object recognition system Grant 11,380,090 - Lee , et al. July 5, 2 | 2022-07-05 |
Supporting Shelf Module And Wafer Container Using Same App 20220093434 - CHIU; MING-CHIEN ;   et al. | 2022-03-24 |
Modularized Large-sized Carrier App 20220089325 - CHIU; MING-CHIEN ;   et al. | 2022-03-24 |
Fast Multi-modal Object Recognition System App 20220076015 - Lee; Tung-Ying ;   et al. | 2022-03-10 |
Point-of-sale base with object recognition camera module thereon Grant D931,363 - Tseng , et al. September 21, 2 | 2021-09-21 |
Solid-state imaging devices having flat microlenses Grant 10,804,306 - Huang , et al. October 13, 2 | 2020-10-13 |
Image sensors Grant 10,462,431 - Huang , et al. Oc | 2019-10-29 |
Solid-state Imaging Devices Having Flat Microlenses App 20190123087 - HUANG; Tzu-Wei ;   et al. | 2019-04-25 |
Methods of fabricating solid-state imaging devices having flat microlenses Grant 10,192,916 - Huang , et al. Ja | 2019-01-29 |
Solid-state imaging devices having a microlens layer with dummy structures Grant 10,170,511 - Huang , et al. J | 2019-01-01 |
Solid-state Imaging Devices Having A Microlens Layer With Dummy Structures App 20180358396 - HUANG; Tzu-Wei ;   et al. | 2018-12-13 |
Methods Of Fabricating Solid-state Imaging Devices Having Flat Microlenses App 20180358397 - HUANG; Tzu-Wei ;   et al. | 2018-12-13 |
Polymer Coated Cathode Material, Cathode And Battery App 20180198125 - CHANG; JEI-WEI ;   et al. | 2018-07-12 |
Manufacturing method of circuit substrate Grant 9,961,784 - Huang May 1, 2 | 2018-05-01 |
Manufacturing Method Of Circuit Substrate App 20170208696 - Huang; Tzu-Wei | 2017-07-20 |
Image sensors and methods of forming the same Grant 9,679,933 - Huang , et al. June 13, 2 | 2017-06-13 |
Manufacturing method of circuit substrate Grant 9,655,254 - Huang May 16, 2 | 2017-05-16 |
Manufacturing method of circuit substrate Grant 9,603,263 - Chuang , et al. March 21, 2 | 2017-03-21 |
Image Sensors App 20160301897 - HUANG; Tzu-Wei ;   et al. | 2016-10-13 |
Image Sensors And Methods Of Forming The Same App 20160099280 - HUANG; Tzu-WEI ;   et al. | 2016-04-07 |
Verification Method Applied To Remote Connection And Related Verification System And Related Ip Camera App 20160013943 - Huang; Tzu-Wei | 2016-01-14 |
Manufacturing method of substrate structure Grant 9,131,635 - Huang September 8, 2 | 2015-09-08 |
Substrate Structure And Manufacturing Method Thereof App 20150114698 - Huang; Tzu-Wei ;   et al. | 2015-04-30 |
Image sensor devices and methods for manufacturing the same Grant 8,941,202 - Liu , et al. January 27, 2 | 2015-01-27 |
Packaging Process App 20140113788 - Huang; Tzu-Wei | 2014-04-24 |
Manufacturing Method Of Substrate Structure App 20140096382 - Huang; Tzu-Wei | 2014-04-10 |
Image Sensor Devices And Methods For Manufacturing The Same App 20140001590 - LIU; Ming-Kai ;   et al. | 2014-01-02 |
Image sensor devices and methods for manufacturing the same Grant 8,557,626 - Liu , et al. October 15, 2 | 2013-10-15 |
Manufacturing method of package carrier Grant 8,510,936 - Chuang , et al. August 20, 2 | 2013-08-20 |
Brainwave Control System And Method Operable Through Time Differential Event-related Potential App 20130131535 - Sun; Kuang-Tien ;   et al. | 2013-05-23 |
Manufacturing Method Of Circuit Substrate App 20120279630 - Chuang; Chih-Hong ;   et al. | 2012-11-08 |
Manufacturing Method Of Circuit Substrate App 20120280022 - Huang; Tzu-Wei | 2012-11-08 |
Camera module and method for fabricating the same Grant 8,251,601 - Huang , et al. August 28, 2 | 2012-08-28 |
Camera Module And Method For Fabricating The Same App 20120155854 - HUANG; Tzu-Wei ;   et al. | 2012-06-21 |
Image Sensor Devices And Methods For Manufacturing The Same App 20110298073 - Liu; Ming-Kai ;   et al. | 2011-12-08 |
Circuit Substrate And Manufacturing Method Thereof App 20110253439 - Huang; Tzu-Wei | 2011-10-20 |
Manufacturing Method Of Package Carrier App 20110154657 - Chuang; Chih-Hong ;   et al. | 2011-06-30 |
Circuit Substrate And Manufacturing Method Thereof App 20110154658 - Chuang; Chih-Hong ;   et al. | 2011-06-30 |
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