| Patent | Date |
|---|
Semiconductor device with stress-relieving structures and method for fabricating the same
Grant 11,456,242 - Huang September 27, 2 | 2022-09-27 |
Method For Fabricating Semiconductor Device With Protection Layers
App 20220285240 - HUANG; TSE-YAO ; et al. | 2022-09-08 |
Method For Fabricating Semiconductor Device With Stress-relieving Structures
App 20220285258 - HUANG; TSE-YAO | 2022-09-08 |
Semiconductor device with graphene-based element and method for fabricating the same
Grant 11,437,494 - Huang September 6, 2 | 2022-09-06 |
Semiconductor device with anti-fuse and metal-insulator-metal (MIM) capacitor connected to redistribution layer (RDL) and method for forming the same
Grant 11,437,314 - Huang September 6, 2 | 2022-09-06 |
Semiconductor Device With Tilted Insulating Layers And Method For Fabricating The Same
App 20220278025 - HUANG; TSE-YAO | 2022-09-01 |
Semiconductor device with graphene layers and method for fabricating the same
Grant 11,424,198 - Huang August 23, 2 | 2022-08-23 |
Semiconductor device with porous insulating layers and method for fabricating the same
Grant 11,424,187 - Huang August 23, 2 | 2022-08-23 |
Method For Preparing Semiconductor Device With Gate Spacer
App 20220254899 - HUANG; TSE-YAO | 2022-08-11 |
Semiconductor Device With Gate Spacer And Manufacturing Method Of The Semiconductor Device
App 20220254898 - HUANG; TSE-YAO | 2022-08-11 |
Method For Fabricating Semiconductor Device With Covering Liners
App 20220230913 - HUANG; TSE-YAO | 2022-07-21 |
Semiconductor device with connection structure and method for fabricating the same
Grant 11,393,792 - Huang July 19, 2 | 2022-07-19 |
Semiconductor Device Structure With Manganese-containing Interconnect Structure And Method For Forming The Same
App 20220223535 - HUANG; Tse-Yao | 2022-07-14 |
Semiconductor Device With Programmable Unit And Method For Fabricating The Same
App 20220223520 - CHIU; HSIH-YANG ; et al. | 2022-07-14 |
Semiconductor Device With Programmable Unit And Method For Fabricating The Same
App 20220223521 - CHIU; HSIH-YANG ; et al. | 2022-07-14 |
Semiconductor Device With Adjustment Layers And Method For Fabricating The Same
App 20220216161 - HUANG; TSE-YAO | 2022-07-07 |
Semiconductor device structure with bottle-shaped through silicon via and method for forming the same
Grant 11,355,464 - Shih , et al. June 7, 2 | 2022-06-07 |
Semiconductor Device With Anti-fuse And Metal-insulator-metal (mim) Capacitor Connected To Redistribution Layer (rdl) And Method For Forming The Same
App 20220173037 - HUANG; Tse-Yao | 2022-06-02 |
Semiconductor device
Grant 11,342,333 - Shih , et al. May 24, 2 | 2022-05-24 |
Method For Preparing Semiconductor Device Including Conductive Contact Having Tapering Profile
App 20220148966 - Huang; Tse-Yao | 2022-05-12 |
Semiconductor Device And Method For Fabricating The Same
App 20220149050 - HUANG; TSE-YAO | 2022-05-12 |
Semiconductor Device Structure With Bottle-shaped Through Silicon Via And Method For Forming The Same
App 20220148995 - Shih; Shing-Yih ; et al. | 2022-05-12 |
Semiconductor device with composite connection structure and method for fabricating the same
Grant 11,315,893 - Huang April 26, 2 | 2022-04-26 |
Semiconductor device with decoupling unit and method for fabricating the same
Grant 11,315,869 - Huang , et al. April 26, 2 | 2022-04-26 |
Semiconductor device with connecting structure and method for fabricating the same
Grant 11,315,903 - Huang April 26, 2 | 2022-04-26 |
Semiconductor device structure with air gap and method for forming the same
Grant 11,309,266 - Huang April 19, 2 | 2022-04-19 |
Semiconductor package with air gap and manufacturing method thereof
Grant 11,309,249 - Huang April 19, 2 | 2022-04-19 |
Semiconductor device with graphene-based element and method for fabricating the same
Grant 11,309,214 - Huang April 19, 2 | 2022-04-19 |
Semiconductor device and method for fabricating the same
Grant 11,309,387 - Huang April 19, 2 | 2022-04-19 |
Semiconductor package with air gap and manufacturing method thereof
Grant 11,302,662 - Huang April 12, 2 | 2022-04-12 |
Semiconductor device with protection layers and method for fabricating the same
Grant 11,302,608 - Huang , et al. April 12, 2 | 2022-04-12 |
Semiconductor device with porous decoupling feature
Grant 11,296,092 - Huang April 5, 2 | 2022-04-05 |
Method For Fabricating Semiconductor Device With Stress Relief Structure
App 20220102303 - HUANG; TSE-YAO | 2022-03-31 |
Method For Fabricating Semiconductor Device With Graphene Layers
App 20220093541 - HUANG; TSE-YAO | 2022-03-24 |
Method For Fabricating Semiconductor Device With Porous Decoupling Features
App 20220093609 - HUANG; TSE-YAO | 2022-03-24 |
Semiconductor Device With Tilted Insulating Layers And Method For Fabricating The Same
App 20220093490 - HUANG; Tse-Yao | 2022-03-24 |
Semiconductor Device Including Conductive Contact Having Tapering Profile And Method For Preparing The Same
App 20220093510 - HUANG; Tse-Yao | 2022-03-24 |
Semiconductor device and method for fabricating the same
Grant 11,282,781 - Huang , et al. March 22, 2 | 2022-03-22 |
Method For Fabricating Semiconductor Device With Connecting Structure
App 20220084989 - HUANG; TSE-YAO | 2022-03-17 |
Semiconductor Device And Method For Fabricating The Same
App 20220085164 - HUANG; TSE-YAO | 2022-03-17 |
Method For Preparing Semiconductor Device With Composite Dielectric Structure
App 20220084976 - HUANG; TSE-YAO | 2022-03-17 |
Method For Fabricating Semiconductor Device With Tapering Impurity Region
App 20220077155 - HUANG; TSE-YAO | 2022-03-10 |
Method For Fabricating Semiconductor Device
App 20220077144 - HUANG; TSE-YAO | 2022-03-10 |
Semiconductor Package With Air Gap
App 20220077091 - HUANG; TSE-YAO | 2022-03-10 |
Semiconductor Device With Connection Structure And Method For Fabricating The Same
App 20220077118 - HUANG; TSE-YAO | 2022-03-10 |
Semiconductor Device With Protection Layers And Method For Fabricating The Same
App 20220077025 - HUANG; TSE-YAO ; et al. | 2022-03-10 |
Semiconductor Device With Graphene Layers And Method For Fabricating The Same
App 20220068848 - HUANG; Tse-Yao | 2022-03-03 |
Semiconductor device and method for fabricating the same
Grant 11,264,323 - Huang March 1, 2 | 2022-03-01 |
Semiconductor device with composite dielectric structure and method for forming the same
Grant 11,264,350 - Huang March 1, 2 | 2022-03-01 |
Method For Fabricating Semiconductor Device With Alleviation Feature
App 20220059451 - HUANG; TSE-YAO | 2022-02-24 |
Semiconductor Device With Graphene-based Element And Method For Fabricating The Same
App 20220059673 - HUANG; TSE-YAO | 2022-02-24 |
Method For Fabricating Semiconductor Device
App 20220059448 - HUANG; TSE-YAO | 2022-02-24 |
Method For Manufacturing Semiconductor Package With Air Gap
App 20220059468 - HUANG; TSE-YAO | 2022-02-24 |
Method For Fabricating Semiconductor Device With Porous Insulating Layers
App 20220059463 - HUANG; TSE-YAO | 2022-02-24 |
Method For Fabricating Semiconductor Device With Graphene-based Element
App 20220059674 - Huang; Tse-Yao | 2022-02-24 |
Method For Preparing Semiconductor Device Structure With Series-connected Transistor And Resistor
App 20220059526 - HUANG; TSE-YAO | 2022-02-24 |
Semiconductor Device With Graded Porous Dielectric Structure
App 20220059464 - HUANG; TSE-YAO | 2022-02-24 |
Semiconductor Device With Graphene-based Element And Method For Fabricating The Same
App 20220051937 - HUANG; TSE-YAO | 2022-02-17 |
Method For Preparing Semiconductor Device With Epitaxial Structures
App 20220052050 - HUANG; TSE-YAO | 2022-02-17 |
Semiconductor Device And Method For Fabricating The Same
App 20220045187 - HUANG; TSE-YAO | 2022-02-10 |
Semiconductor Device With Porous Insulating Layers And Method For Fabricating The Same
App 20220045006 - HUANG; TSE-YAO | 2022-02-10 |
Semiconductor device with graded porous dielectric structure
Grant 11,244,901 - Huang February 8, 2 | 2022-02-08 |
Semiconductor Device With Stress-relieving Structures And Method For Fabricating The Same
App 20220028776 - HUANG; Tse-Yao | 2022-01-27 |
Semiconductor device with alleviation feature
Grant 11,227,831 - Huang January 18, 2 | 2022-01-18 |
Semiconductor Device With Protection Layers And Method For Fabricating The Same
App 20220013425 - HUANG; TSE-YAO ; et al. | 2022-01-13 |
Semiconductor device and method for fabricating the same
Grant 11,217,594 - Huang January 4, 2 | 2022-01-04 |
Semiconductor device and method for fabricating the same
Grant 11,211,287 - Huang , et al. December 28, 2 | 2021-12-28 |
Semiconductor Device With Protection Layers And Method For Fabricating The Same
App 20210398879 - HUANG; TSE-YAO ; et al. | 2021-12-23 |
Semiconductor Device With Covering Liners And Method For Fabricating The Same
App 20210391212 - HUANG; Tse-Yao | 2021-12-16 |
Semiconductor Device With Adjustment Layers And Method For Fabricating The Same
App 20210384140 - HUANG; Tse-Yao | 2021-12-09 |
Method For Fabricating Semiconductor Device
App 20210375763 - HUANG; Tse-Yao | 2021-12-02 |
Semiconductor Device Structure With Air Gap And Method For Forming The Same
App 20210375803 - HUANG; Tse-Yao | 2021-12-02 |
Semiconductor Device With Porous Decoupling Feature And Method For Fabricating The Same
App 20210375881 - HUANG; Tse-Yao | 2021-12-02 |
Semiconductor Device With Alleviation Feature
App 20210375744 - HUANG; TSE-YAO | 2021-12-02 |
Semiconductor Device Structure With Air Gap
App 20210366762 - HUANG; Tse-Yao | 2021-11-25 |
Semiconductor Device With Tapering Impurity Region And Method For Fabricating The Same
App 20210351185 - HUANG; Tse-Yao | 2021-11-11 |
Semiconductor Package With Air Gap And Manufacturing Method Thereof
App 20210343654 - HUANG; TSE-YAO | 2021-11-04 |
Semiconductor Package With Air Gap And Manufacturing Method Thereof
App 20210343668 - HUANG; Tse-Yao | 2021-11-04 |
Semiconductor device and method for fabricating the same
Grant 11,164,816 - Huang November 2, 2 | 2021-11-02 |
Method for forming semiconductor device structure with air gap
Grant 11,164,773 - Huang November 2, 2 | 2021-11-02 |
Semiconductor Device Structure With Series-connected Transistor And Resistor And Method For Forming The Same
App 20210305238 - HUANG; TSE-YAO | 2021-09-30 |
Semiconductor Device With Connection Structure And Method For Fabricating The Same
App 20210305208 - HUANG; Tse-Yao | 2021-09-30 |
Semiconductor Device With Composite Connection Structure And Method For Fabricating The Same
App 20210305182 - HUANG; Tse-Yao | 2021-09-30 |
Semiconductor Device With Composite Dielectric Structure And Method For Forming The Same
App 20210296276 - HUANG; TSE-YAO | 2021-09-23 |
Method For Fabricating A Semiconductor Device And The Same
App 20210288052 - HUANG; Tse-Yao | 2021-09-16 |
Semiconductor Device With Connecting Structure And Method For Fabricating The Same
App 20210280560 - HUANG; TSE-YAO | 2021-09-09 |
Method For Fabricating A Semiconductor Device
App 20210272960 - HUANG; TSE-YAO | 2021-09-02 |
Semiconductor device with electrically floating contacts between signal-transmitting contacts
Grant 11,107,775 - Huang August 31, 2 | 2021-08-31 |
Semiconductor Device With Graded Porous Dielectric Structure
App 20210249355 - HUANG; Tse-Yao | 2021-08-12 |
Multiple semiconductor elements with different threshold voltages
Grant 11,088,140 - Huang August 10, 2 | 2021-08-10 |
Semiconductor device and method for fabricating the same
Grant 11,088,141 - Huang August 10, 2 | 2021-08-10 |
Semiconductor device and method for fabricating the same
Grant 11,069,676 - Huang July 20, 2 | 2021-07-20 |
Semiconductor device and method for fabricating the same
Grant 11,063,051 - Huang July 13, 2 | 2021-07-13 |
Method For Preparing A Semiconductor Device With Spacer Over Sidewall Of Bonding Pad
App 20210202416 - HUANG; Tse-Yao | 2021-07-01 |
Semiconductor structure
Grant 11,031,348 - Shih , et al. June 8, 2 | 2021-06-08 |
Semiconductor device with spacer over sidewall of bonding pad and method for preparing the same
Grant 11,024,592 - Huang June 1, 2 | 2021-06-01 |
Semiconductor structure having buried gate, buried source and drain contacts, and strained silicon and method of manufacturing the same
Grant 11,011,637 - Huang May 18, 2 | 2021-05-18 |
Semiconductor Device And Method For Fabricating The Same
App 20210143261 - HUANG; TSE-YAO | 2021-05-13 |
Semiconductor Device With Epitaxial Structures And Method For Forming The Same
App 20210143155 - HUANG; TSE-YAO | 2021-05-13 |
Semiconductor Device And Method For Fabricating The Same
App 20210134953 - HUANG; Tse-Yao | 2021-05-06 |
Semiconductor Device And Method For Fabricating The Same
App 20210125948 - HUANG; Tse-Yao | 2021-04-29 |
Semiconductor Structure
App 20210125910 - SHIH; Shing-Yih ; et al. | 2021-04-29 |
Semiconductor Device And Method For Fabricating The Same
App 20210118874 - HUANG; Tse-Yao | 2021-04-22 |
Semiconductor Device With Spacer Over Sidewall Of Bonding Pad And Method For Preparing The Same
App 20210118830 - HUANG; Tse-Yao | 2021-04-22 |
Semiconductor device and method for fabricating the same
Grant 10,978,549 - Huang April 13, 2 | 2021-04-13 |
Semiconductor Device And Method For Fabricating The Same
App 20210104528 - HUANG; Tse-Yao | 2021-04-08 |
Semiconductor Device And Method For Fabricating The Same
App 20210104458 - HUANG; TSE-YAO | 2021-04-08 |
Semiconductor Device And Method For Fabricating The Same
App 20210098447 - HUANG; TSE-YAO | 2021-04-01 |
Semiconductor Device
App 20210098461 - SHIH; Shing-Yih ; et al. | 2021-04-01 |
Semiconductor Device And Method For Fabricating The Same
App 20210098464 - HUANG; Tse-Yao | 2021-04-01 |
Semiconductor Device Structure With Air Gap And Method For Forming The Same
App 20210090939 - HUANG; Tse-Yao | 2021-03-25 |
Semiconductor Device And Method For Fabricating The Same
App 20210074639 - HUANG; Tse-Yao | 2021-03-11 |
Semiconductor Device And Method For Fabricating The Same
App 20210074804 - HUANG; Tse-Yao | 2021-03-11 |
Semiconductor Device And Method For Fabricating The Same
App 20210074708 - HUANG; TSE-YAO | 2021-03-11 |
Semiconductor Device And Method For Fabricating The Same
App 20210066303A1 - | 2021-03-04 |
Semiconductor Structure Having Buried Gate, Buried Source And Drain Contacts, And Strained Silicon And Method Of Manufacturing The Same
App 20210057578 - HUANG; Tse-Yao | 2021-02-25 |
Semiconductor Device And Method For Fabricating The Same
App 20210043634 - HUANG; TSE-YAO | 2021-02-11 |
Semiconductor device with stress-relieving features and method for fabricating the same
Grant 10,916,510 - Huang February 9, 2 | 2021-02-09 |
Semiconductor Device And Method For Fabricating The Same
App 20210028053 - HUANG; TSE-YAO ; et al. | 2021-01-28 |
Semiconductor Device And Method For Fabricating The Same
App 20210028103 - HUANG; TSE-YAO ; et al. | 2021-01-28 |
Semiconductor Structure
App 20210028121 - SHIH; SHING-YIH ; et al. | 2021-01-28 |
Method for forming crack stop structure
Grant 9,287,221 - Huang , et al. March 15, 2 | 2016-03-15 |
Method For Forming Crack Stop Structure
App 20150194390 - Huang; Tse-Yao ; et al. | 2015-07-09 |
Crack stop structure and method for forming the same
Grant 8,963,282 - Huang , et al. February 24, 2 | 2015-02-24 |
Crack stop structure and method for forming the same
Grant 8,828,842 - Huang , et al. September 9, 2 | 2014-09-09 |
Crack Stop Structure And Method For Forming The Same
App 20140154864 - Huang; Tse-Yao ; et al. | 2014-06-05 |
Crack stop structure and method for forming the same
Grant 8,692,245 - Huang , et al. April 8, 2 | 2014-04-08 |
Bonding pad structure for semiconductor devices
Grant 8,476,764 - Huang , et al. July 2, 2 | 2013-07-02 |
Method of forming an etch mask
Grant 8,470,515 - Huang , et al. June 25, 2 | 2013-06-25 |
Method Of Forming An Etch Mask
App 20130071790 - Huang; Tse-Yao ; et al. | 2013-03-21 |
Bonding Pad Structure For Semiconductor Devices
App 20130069235 - Huang; Tse-Yao ; et al. | 2013-03-21 |
Crack Stop Structure And Method For Forming The Same
App 20130062727 - Huang; Tse-Yao ; et al. | 2013-03-14 |
Crack Stop Structure And Method For Forming The Same
App 20130043470 - Huang; Tse-Yao ; et al. | 2013-02-21 |
Method of fabricating a semiconductor device
Grant 7,807,558 - Tsai , et al. October 5, 2 | 2010-10-05 |
Method of forming shadow layer on the wafer bevel
Grant 7,696,108 - Wang , et al. April 13, 2 | 2010-04-13 |
Method Of Forming Shadow Layer On The Wafer Bevel
App 20090023300 - Wang; Wen-Chieh ; et al. | 2009-01-22 |
Method Of Fabricating A Semiconductor Device
App 20090011587 - TSAI; Tzu-Ching ; et al. | 2009-01-08 |
Method for forming self-aligned contact in semiconductor device
Grant 7,115,491 - Huang , et al. October 3, 2 | 2006-10-03 |
Method for forming contact holes
Grant 7,105,453 - Chen , et al. September 12, 2 | 2006-09-12 |
Method of forming gate structure
Grant 7,094,638 - Huang , et al. August 22, 2 | 2006-08-22 |
Method Of Fabricating Trench Isolation For Trench-capacitor Dram Devices
App 20060154435 - Lee; Hsiu-Chun ; et al. | 2006-07-13 |
Interconnect structure and method for fabricating the same
Grant 7,067,418 - Huang , et al. June 27, 2 | 2006-06-27 |
Deep trench self-alignment process for an active area of a partial vertical cell
Grant 7,056,832 - Chang , et al. June 6, 2 | 2006-06-06 |
Method for forming bit line
Grant 7,052,949 - Wu , et al. May 30, 2 | 2006-05-30 |
Method for forming contact hole
Grant 7,005,374 - Huang , et al. February 28, 2 | 2006-02-28 |
Interconnect structure and method for fabricating the same
Grant 6,992,393 - Huang , et al. January 31, 2 | 2006-01-31 |
Conducting wire and contact opening forming method for reducing photoresist thickness and via resistance
Grant 6,979,638 - Huang , et al. December 27, 2 | 2005-12-27 |
Method for forming self-aligned contact in semiconductor device
App 20050277258 - Huang, Tse-Yao ; et al. | 2005-12-15 |
Method for forming shallow trench in semiconductor device
Grant 6,974,741 - Lee , et al. December 13, 2 | 2005-12-13 |
Method of forming geometric deep trench capacitors
Grant 6,964,926 - Huang , et al. November 15, 2 | 2005-11-15 |
Interconnect Structure And Method For Fabricating The Same
App 20050202671 - Huang, Tse-Yao ; et al. | 2005-09-15 |
Conducting Wire And Contact Opening Forming Method For Reducing Photoresist Thickness And Via Resistance
App 20050186775 - Huang, Tse-Yao ; et al. | 2005-08-25 |
Method for forming shallow trench in semiconductor device
App 20050148152 - Lee, Hsiu-Chun ; et al. | 2005-07-07 |
Method for processing photoresist
App 20050147926 - Lee, Hsiu-Chun ; et al. | 2005-07-07 |
Method for forming contact hole
App 20050136674 - Huang, Tse-Yao ; et al. | 2005-06-23 |
Method of filling bit line contact via
Grant 6,908,840 - Huang , et al. June 21, 2 | 2005-06-21 |
Trench-capacitor DRAM cell having a folded gate conductor
Grant 6,909,136 - Chen , et al. June 21, 2 | 2005-06-21 |
Method For Controlling Critical Dimension By Utilizing Resist Sidewall Protection
App 20050118531 - Lee, Hsiu-Chun ; et al. | 2005-06-02 |
Method for formimg contact holes
App 20050106887 - Chen, Yi-Nan ; et al. | 2005-05-19 |
Method of forming shallow trench isolation with chamfered corners
Grant 6,884,714 - Huang , et al. April 26, 2 | 2005-04-26 |
Method Of Forming Gate Structure
App 20050085025 - Huang, Jin-Tau ; et al. | 2005-04-21 |
Etching method and recipe for forming high aspect ratio contact hole
App 20050054206 - Huang, Tse-Yao ; et al. | 2005-03-10 |
[interconnect Structure And Method For Fabricating The Same]
App 20050048749 - HUANG, TSE-YAO ; et al. | 2005-03-03 |
Trench-capacitor Dram Cell Having A Folded Gate Conductor
App 20050012131 - Chen, Yinan ; et al. | 2005-01-20 |
Method of forming geometric deep trench capacitors
App 20040266098 - Huang, Tse-Yao ; et al. | 2004-12-30 |
Method of forming adjacent holes on a semiconductor substrate
Grant 6,835,653 - Huang , et al. December 28, 2 | 2004-12-28 |
Deep trench self-alignment process for an active area of a partial vertical cell
App 20040219798 - Chang, Ming-Cheng ; et al. | 2004-11-04 |
Method of filling bit line contact via
App 20040209427 - Huang, Tse-Yao ; et al. | 2004-10-21 |
Method Of Forming Shallow Trench Isolation With Chamfered Corners
App 20040198038 - Huang, Tse-Yao ; et al. | 2004-10-07 |
Method for forming contact
Grant 6,790,765 - Huang , et al. September 14, 2 | 2004-09-14 |
Process for filling polysilicon seam
Grant 6,790,740 - Huang , et al. September 14, 2 | 2004-09-14 |
Method of improving pattern profile of thin photoresist layer
App 20040157168 - Huang, Tse-Yao ; et al. | 2004-08-12 |
Etch-back method for dielectric layer
Grant 6,767,837 - Sun , et al. July 27, 2 | 2004-07-27 |
Method for fabricating floating gate
Grant 6,759,300 - Lay , et al. July 6, 2 | 2004-07-06 |
Method for forming bit line
App 20040127013 - Wu, Kuo-Chien ; et al. | 2004-07-01 |
Method For Fabricating Floating Gate
App 20040110342 - Lay, Chao-Wen ; et al. | 2004-06-10 |
Process for filling polysilicon seam
App 20040082137 - Huang, Tse-Yao ; et al. | 2004-04-29 |
Etch-back method for dielectric layer
App 20040063317 - Sun, Yu-Chi ; et al. | 2004-04-01 |
Method of fabricating bit line and bit line contact plug of a memory cell
Grant 6,680,254 - Sun , et al. January 20, 2 | 2004-01-20 |
Method Of Forming Interconnects
App 20030082899 - Huang, Tse-Yao ; et al. | 2003-05-01 |
Method of forming a self-aligned contact hole
App 20030045099 - Sun, Yu-Chi ; et al. | 2003-03-06 |
Method of fabricating bit line and bit line contact plug of a memory cell
App 20020119649 - Sun, Yu-Chi ; et al. | 2002-08-29 |
Plasma generator
Grant 6,437,512 - Chen , et al. August 20, 2 | 2002-08-20 |
Method for STI-top rounding control
Grant 6,225,187 - Huang , et al. May 1, 2 | 2001-05-01 |
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