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Random number generator, encryption/decryption secret key generator and method based on characteristics of memory cells
Grant 11,449,310 - Huang , et al. September 20, 2 | 2022-09-20 |
Electronic device, related controller circuit and method
Grant 11,055,023 - Huang , et al. July 6, 2 | 2021-07-06 |
Memory controller having temperature dependent data program scheme and related method
Grant 10,956,087 - Huang , et al. March 23, 2 | 2021-03-23 |
Memory Controller And Related Method
App 20200310687 - HUANG; Shih-Fu ; et al. | 2020-10-01 |
Electronic Device, Related Controller Circuit And Method
App 20200293224 - HUANG; Shih-Fu ; et al. | 2020-09-17 |
Memory control device, control method of flash memory, and method for generating security feature of flash memory
Grant 10,705,743 - Huang , et al. | 2020-07-07 |
NAND flash memory controller and storage apparatus applying the same
Grant 10,672,499 - Huang , et al. | 2020-06-02 |
Circuit Board And Method Of Making Circuit Board
App 20200163229 - HUANG; SHIH-FU ; et al. | 2020-05-21 |
Random Number Generator, Encryption/decryption Secret Key Generator And Method Based On Characteristics Of Memory Cells
App 20200081689 - Huang; Shih-Fu ; et al. | 2020-03-12 |
Memory Control Device, Control Method Of Flash Memory, And Method For Generating Security Feature Of Flash Memory
App 20200081635 - Huang; Shih-Fu ; et al. | 2020-03-12 |
Nand Flash Memory Controller And Storage Apparatus Applying The Same
App 20200075107 - Huang; Shih-Fu ; et al. | 2020-03-05 |
Lighting module
Grant 10,288,258 - Huang , et al. | 2019-05-14 |
Test method for memory
Grant 9,548,138 - Ting , et al. January 17, 2 | 2017-01-17 |
Embedded component device and manufacturing methods thereof
Grant 9,406,658 - Lee , et al. August 2, 2 | 2016-08-02 |
Package Carrier, Semiconductor Package, And Process For Fabricating Same
App 20160218019 - SU; Yuan-Chang ; et al. | 2016-07-28 |
Operation method for memory device
Grant 9,305,638 - Chang , et al. April 5, 2 | 2016-04-05 |
Test Method For Memory
App 20160064103 - Ting; Ying-Tsai ; et al. | 2016-03-03 |
Semiconductor package with single sided substrate design and manufacturing methods thereof
Grant 9,196,597 - Su , et al. November 24, 2 | 2015-11-24 |
Semiconductor package and process for fabricating same
Grant 9,165,900 - Su , et al. October 20, 2 | 2015-10-20 |
Semiconductor Package With Single Sided Substrate Design And Manufacturing Methods Thereof
App 20140346670 - Su; Yuan-Chang ; et al. | 2014-11-27 |
Semiconductor package with single sided substrate design and manufacturing methods thereof
Grant 8,884,424 - Su , et al. November 11, 2 | 2014-11-11 |
Semiconductor package and process for fabricating same
Grant 8,786,062 - Su , et al. July 22, 2 | 2014-07-22 |
Semiconductor Package And Process For Fabricating Same
App 20140151876 - Su; Yuan-Chang ; et al. | 2014-06-05 |
Semiconductor Package With Single Sided Substrate Design And Manufacturing Methods Thereof
App 20140021636 - Su; Yuan-Chang ; et al. | 2014-01-23 |
Semiconductor package with single sided substrate design and manufacturing methods thereof
Grant 8,569,894 - Su , et al. October 29, 2 | 2013-10-29 |
Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package
Grant 8,399,776 - Appelt , et al. March 19, 2 | 2013-03-19 |
Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof
Grant 8,367,473 - Huang , et al. February 5, 2 | 2013-02-05 |
Circuit board, and chip package structure
Grant 8,357,861 - Huang , et al. January 22, 2 | 2013-01-22 |
Semiconductor package
Grant 8,330,267 - Chen , et al. December 11, 2 | 2012-12-11 |
Embedded component substrate and manufacturing methods thereof
Grant 8,320,134 - Su , et al. November 27, 2 | 2012-11-27 |
Semiconductor package with substrate having single metal layer and manufacturing methods thereof
Grant 8,288,869 - Huang , et al. October 16, 2 | 2012-10-16 |
Embedded component package structure
Grant 8,284,561 - Su , et al. October 9, 2 | 2012-10-09 |
Embedded Component Device And Manufacturing Methods Thereof
App 20120153493 - LEE; CHUN-CHE ; et al. | 2012-06-21 |
Method Of Fabricating Embedded Component Package Structure And The Package Structure Thereof
App 20120033394 - Su; Yuan-Chang ; et al. | 2012-02-09 |
Embedded Component Substrate and Manufacturing Methods Thereof
App 20110194265 - Su; Yuan-Chang ; et al. | 2011-08-11 |
Semiconductor Package with Single Sided Substrate Design and Manufacturing Methods Thereof
App 20110169150 - Su; Yuan-Chang ; et al. | 2011-07-14 |
Semiconductor Package And Process For Fabricating Same
App 20110084370 - SU; YUAN-CHANG ; et al. | 2011-04-14 |
Package Carrier, Semiconductor Package, And Process For Fabricating Same
App 20110084372 - SU; YUAN-CHANG ; et al. | 2011-04-14 |
Fabrication Method Of Circuit Board, Circuit Board, And Chip Package Structure
App 20110056736 - HUANG; SHIH-FU ; et al. | 2011-03-10 |
Semiconductor Package
App 20110057301 - Chen; Kuang-Hsiung ; et al. | 2011-03-10 |
Semiconductor Package With Substrate Having Single Metal Layer And Manufacturing Methods Thereof
App 20100320610 - HUANG; SHIH-FU ; et al. | 2010-12-23 |
Substrate Having Single Patterned Metal Layer Exposing Patterned Dielectric Layer, Chip Package Structure Including The Substrate, And Manufacturing Methods Thereof
App 20100314744 - Huang; Shih-Fu ; et al. | 2010-12-16 |
Substrate Having Single Patterned Metal Layer, And Package Applied With The Substrate , And Methods Of Manufacturing Of The Substrate And Package
App 20100288541 - APPELT; Bernd Karl ; et al. | 2010-11-18 |
Substrate Having Embedded Single Patterned Metal Layer, And Package Applied With The Same, And Methods Of Manufacturing Of The Substrate And Package
App 20100289132 - Huang; Shih-Fu ; et al. | 2010-11-18 |
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