Huang; Min Lung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huang; Min Lung.The latest application filed is for "semiconductor package structure, electronic device, and method for manufacturing the same".
Company Profile
7.68.103
- Huang; Min Lung - Kaohsiung TW
- Huang; Min-Lung - Kaohsiung City TW
- Huang; Min-Lung - Kao-Hsiung TW
- Huang; Min-Lung - Kao-Hsiung City TW
- Huang; Min-Lung - Koahsiung TW
- Huang, Min-Lung - Kaosiung TW
- Huang, Min-Lung - Kaoshiung TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor device package having an antenna formed over a foaming agent filled cavity in a support layer Grant 11,430,750 - Huang , et al. August 30, 2 | 2022-08-30 |
| Method for manufacturing a through substrate via Grant 11,428,946 - Chiang , et al. August 30, 2 | 2022-08-30 |
| Semiconductor package structure and method for manufacturing the same Grant 11,424,212 - Chang , et al. August 23, 2 | 2022-08-23 |
| Semiconductor package device and method for manufacturing the same Grant 11,411,073 - Chuang , et al. August 9, 2 | 2022-08-09 |
| Semiconductor device package and method of manufacturing the same Grant 11,373,956 - Huang , et al. June 28, 2 | 2022-06-28 |
| Wiring structure and method for manufacturing the same Grant 11,355,426 - Huang , et al. June 7, 2 | 2022-06-07 |
| Semiconductor Package Structure, Electronic Device, And Method For Manufacturing The Same App 20220108932 - LIU; Syu-Tang ; et al. | 2022-04-07 |
| Wiring Structure And Method For Manufacturing The Same App 20220037242 - HUANG; Wen Hung ; et al. | 2022-02-03 |
| Semiconductor device package and method of manufacturing the same Grant 11,222,870 - Lu , et al. January 11, 2 | 2022-01-11 |
| Semiconductor device package and method for manufacturing the same Grant 11,211,325 - Huang , et al. December 28, 2 | 2021-12-28 |
| Semiconductor device package with conductive pillars and method for manufacturing the same Grant 11,201,110 - Huang , et al. December 14, 2 | 2021-12-14 |
| Semiconductor package devices having conductive layer, semiconductor wall, conductive wall, and insulation layer Grant 11,107,881 - Chuang , et al. August 31, 2 | 2021-08-31 |
| Semiconductor Package Device And Method For Manufacturing The Same App 20210265459 - CHUANG; Shao Hsuan ; et al. | 2021-08-26 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20210265311 - LU; Wen-Long ; et al. | 2021-08-26 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20210217701 - HUANG; Min Lung ; et al. | 2021-07-15 |
| Semiconductor Device Package And Method For Manufacturing The Same App 20210159168 - HUANG; Wen Hung ; et al. | 2021-05-27 |
| Package Structure And Method For Manufacturing The Same App 20210151407 - LIU; Syu-Tang ; et al. | 2021-05-20 |
| Semiconductor device packages and methods of manufacturing the same Grant 11,011,491 - Tu , et al. May 18, 2 | 2021-05-18 |
| Package Structure, Assembly Structure And Method For Manufacturing The Same App 20210118812 - LIU; Syu-Tang ; et al. | 2021-04-22 |
| Semiconductor Device Packages And Methods Of Manufacturing The Same App 20210074669 - TU; Shun-Tsat ; et al. | 2021-03-11 |
| Wiring structure and method of manufacturing the same Grant 10,939,561 - Huang , et al. March 2, 2 | 2021-03-02 |
| Semiconductor Device Package And Method For Manufacturing The Same App 20210035899 - HUANG; Min Lung ; et al. | 2021-02-04 |
| Semiconductor Package Structure And Method For Manufacturing The Same App 20210020597 - CHANG; Chien-Wei ; et al. | 2021-01-21 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20200381375 - HUANG; Wen Hung ; et al. | 2020-12-03 |
| Semiconductor Package Devices And Methods Of Making The Same App 20200343336 - CHUANG; Shao Hsuan ; et al. | 2020-10-29 |
| Collimator, Optical Device And Method Of Manufacturing The Same App 20200271942 - CHIANG; Yuan-Feng ; et al. | 2020-08-27 |
| Collimator, optical device and method of manufacturing the same Grant 10,663,746 - Chiang , et al. | 2020-05-26 |
| Package device, semiconductor device, and method for manufacturing the package device Grant 10,566,279 - Lu , et al. Feb | 2020-02-18 |
| Interposer, semiconductor package structure, and semiconductor process Grant 10,388,598 - Lu , et al. A | 2019-08-20 |
| Package Device, Semiconductor Device, And Method For Manufacturing The Package Device App 20190229054 - LU; Wen-Long ; et al. | 2019-07-25 |
| Collimator, Optical Device And Method Of Manufacturing The Same App 20180129062 - CHIANG; Yuan-Feng ; et al. | 2018-05-10 |
| Semiconductor devices and methods of manufacturing the same Grant 9,960,102 - Wu , et al. May 1, 2 | 2018-05-01 |
| Semiconductor device having conductive via and manufacturing process for same Grant 9,960,121 - Chen , et al. May 1, 2 | 2018-05-01 |
| Interposer, Semiconductor Package Structure, And Semiconductor Process App 20180076122 - LU; Wen-Long ; et al. | 2018-03-15 |
| Interposer, semiconductor package structure, and semiconductor process Grant 9,852,971 - Lu , et al. December 26, 2 | 2017-12-26 |
| Semiconductor Devices And Methods Of Manufacturing The Same App 20170358518 - WU; Chung-Hsi ; et al. | 2017-12-14 |
| Interposer, Semiconductor Package Structure, And Semiconductor Process App 20170358527 - LU; Wen-Long ; et al. | 2017-12-14 |
| Semiconductor Device Having Conductive Via And Manufacturing Process For Same App 20160315052 - Chen; Yung-Jen ; et al. | 2016-10-27 |
| Semiconductor device having conductive via and manufacturing process Grant 9,406,552 - Chen , et al. August 2, 2 | 2016-08-02 |
| Semiconductor Device Having Conductive Via And Manuacturing Process App 20140175663 - Chen; Yung-Jen ; et al. | 2014-06-26 |
| Semiconductor device packages, redistribution structures, and manufacturing methods thereof Grant 8,358,001 - Yang , et al. January 22, 2 | 2013-01-22 |
| Three-dimensional package and method of making the same Grant 8,288,853 - Huang , et al. October 16, 2 | 2012-10-16 |
| Semiconductor device package with an alignment mark Grant 8,193,647 - Hsieh , et al. June 5, 2 | 2012-06-05 |
| Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof App 20110018124 - Yang; Hung-Jen ; et al. | 2011-01-27 |
| Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof App 20110018118 - Hsieh; Chuehan ; et al. | 2011-01-27 |
| Semiconductor Package And Manufacturing Method Thereof App 20100314746 - Hsieh; Chueh-An ; et al. | 2010-12-16 |
| Semiconductor Packages And Manufacturing Method Thereof App 20100308449 - YANG; Hung-Jen ; et al. | 2010-12-09 |
| Semiconductor Package Structure And Manufacturing Method Thereof App 20100224983 - Huang; Min-Lung ; et al. | 2010-09-09 |
| Three-dimensional package and method of making the same Grant 7,741,152 - Huang , et al. June 22, 2 | 2010-06-22 |
| Three-Dimensional Package and Method of Making the Same App 20100052136 - Huang; Min-Lung ; et al. | 2010-03-04 |
| Three-dimensional package and method of making the same Grant 7,642,132 - Huang , et al. January 5, 2 | 2010-01-05 |
| Three-dimensional package and method of making the same Grant 7,528,053 - Huang , et al. May 5, 2 | 2009-05-05 |
| Three-dimensional package and method of making the same Grant 7,446,404 - Huang , et al. November 4, 2 | 2008-11-04 |
| Method For Forming Bumps On Under Bump Metallurgy App 20080261390 - CHEN; Chien Fan ; et al. | 2008-10-23 |
| Method for forming a redistribution layer in a wafer structure Grant 7,420,274 - Huang September 2, 2 | 2008-09-02 |
| Method of forming bumps Grant 7,375,020 - Wu , et al. May 20, 2 | 2008-05-20 |
| Screen printing method of forming conductive bumps Grant 7,358,176 - Huang April 15, 2 | 2008-04-15 |
| Chip Packaging Structure App 20070252275 - Huang; Min-Lung ; et al. | 2007-11-01 |
| Bump electrodes having multiple under ball metallurgy (UBM) layers Grant 7,271,498 - Huang September 18, 2 | 2007-09-18 |
| Bumping process Grant 7,261,828 - Wu , et al. August 28, 2 | 2007-08-28 |
| Method for forming a redistribution layer in a wafer structure App 20070182011 - Huang; Min-Lung | 2007-08-09 |
| Chip packaging structure having redistribution layer with recess Grant 7,253,519 - Huang , et al. August 7, 2 | 2007-08-07 |
| Solder bump structure and method for forming the same Grant 7,250,362 - Huang July 31, 2 | 2007-07-31 |
| Three-dimensional package and method of making the same App 20070172983 - Huang; Min-Lung ; et al. | 2007-07-26 |
| Three-dimensional package and method of making the same App 20070172982 - Huang; Min-Lung ; et al. | 2007-07-26 |
| Three-dimensional package and method of making the same App 20070172984 - Huang; Min-Lung ; et al. | 2007-07-26 |
| Three-dimensional package and method of making the same App 20070172986 - Huang; Min-Lung ; et al. | 2007-07-26 |
| Three-dimensional package and method of making the same App 20070172985 - Huang; Min-Lung ; et al. | 2007-07-26 |
| Integrated circuit inductane and the fabrication method thereof Grant 7,232,749 - Huang June 19, 2 | 2007-06-19 |
| Chip scale package with micro antenna and method for manufacturing the same Grant 7,221,052 - Huang , et al. May 22, 2 | 2007-05-22 |
| Method for forming a redistribution layer in a wafer structure Grant 7,220,618 - Huang May 22, 2 | 2007-05-22 |
| Method of enhancing the adhesion between photoresist layer and substrate and bumping process Grant 7,189,646 - Huang March 13, 2 | 2007-03-13 |
| Method for mounting passive components on wafer Grant 7,176,117 - Huang February 13, 2 | 2007-02-13 |
| Redistribution layer of wafer and the fabricating method thereof Grant 7,151,012 - Huang December 19, 2 | 2006-12-19 |
| Method For Forming Bumps App 20060276023 - Huang; Min-Lung ; et al. | 2006-12-07 |
| Method for treating wafer surface Grant 7,105,433 - Tsai , et al. September 12, 2 | 2006-09-12 |
| Method for utilizing dry film App 20060188826 - Tseng; Tsung-Yen ; et al. | 2006-08-24 |
| Wafer-level package structure Grant 7,064,428 - Tong , et al. June 20, 2 | 2006-06-20 |
| Chip structure Grant 7,049,705 - Huang May 23, 2 | 2006-05-23 |
| Bumping process and structure thereof App 20060094224 - Huang; Min-Lung ; et al. | 2006-05-04 |
| Bumping process App 20060094226 - Huang; Min-Lung ; et al. | 2006-05-04 |
| Bumping process and structure thereof App 20060087034 - Huang; Min-Lung ; et al. | 2006-04-27 |
| Bumping process and structure thereof App 20060088992 - Huang; Min-Lung ; et al. | 2006-04-27 |
| Chip Scale Package with Micro Antenna and Method for Manufacturing the same App 20060081982 - Huang; Min-Lung ; et al. | 2006-04-20 |
| Under bump metallurgic layer Grant 7,030,492 - Huang April 18, 2 | 2006-04-18 |
| Redistribution layer of wafer and the fabricating method thereof App 20060073693 - Huang; Min-Lung | 2006-04-06 |
| Method for making UBM pads and bumps on wafer Grant 7,015,130 - Tsai , et al. March 21, 2 | 2006-03-21 |
| Method for forming a redistribution layer in a wafer structure App 20060057772 - Huang; Min-Lung | 2006-03-16 |
| Structure and formation method of conductive bumps App 20060017160 - Huang; Min-Lung | 2006-01-26 |
| Bump manufacturing method Grant 6,989,326 - Tong , et al. January 24, 2 | 2006-01-24 |
| Screen printing method of forming conductive bumps App 20050266674 - Huang, Min-Lung | 2005-12-01 |
| Bump fabrication process Grant 6,967,153 - Tong , et al. November 22, 2 | 2005-11-22 |
| Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps App 20050233571 - Tao, Su ; et al. | 2005-10-20 |
| Method For Forming Photoresist Layer On Subsrtate And Bumping Process Using The Same App 20050215044 - Huang, Min-Lung | 2005-09-29 |
| Integrated circuit inductane and the fabrication method thereof App 20050181570 - Huang, Min-Lung | 2005-08-18 |
| Under bump metallization structure of a semiconductor wafer Grant 6,930,389 - Huang August 16, 2 | 2005-08-16 |
| Bumping process Grant 6,930,031 - Huang August 16, 2 | 2005-08-16 |
| Structure for preventing burnt fuse pad from further electrical connection Grant 6,927,964 - Tong , et al. August 9, 2 | 2005-08-09 |
| Wafer-level Package Structure App 20050161812 - Tong, Ho-Ming ; et al. | 2005-07-28 |
| Wafer bumping process Grant 6,921,716 - Huang , et al. July 26, 2 | 2005-07-26 |
| Method of forming bumps Grant 6,916,732 - Wu , et al. July 12, 2 | 2005-07-12 |
| Method Of Forming Bumps App 20050085061 - Wu, Tsung-Hua ; et al. | 2005-04-21 |
| Method of modifying tin to lead ratio in tin-lead bump Grant 6,877,653 - Tong , et al. April 12, 2 | 2005-04-12 |
| Method of forming bump Grant 6,875,683 - Tong , et al. April 5, 2 | 2005-04-05 |
| Method for mounting passive components on wafer App 20050064625 - Huang, Min-Lung | 2005-03-24 |
| Solder bump structure and method for forming the same App 20050054154 - Huang, Min-Lung | 2005-03-10 |
| Solder ball fabricating process Grant 6,861,346 - Tong , et al. March 1, 2 | 2005-03-01 |
| [chip Structure] App 20050040527 - Huang, Min-Lung | 2005-02-24 |
| [method Of Enhancing The Adhesion Between Photoresist Layer And Substrate And Bumping Process] App 20050042854 - Huang, Min-Lung | 2005-02-24 |
| [under Bump Metallurgic Layer] App 20050029677 - Huang, Min-Lung | 2005-02-10 |
| [process For Fabricating Bumps] App 20050016859 - Huang, Min-Lung ; et al. | 2005-01-27 |
| Process for fabricating wafer bumps Grant 6,846,719 - Tong , et al. January 25, 2 | 2005-01-25 |
| [chip Structure] App 20050012222 - Huang, Min-Lung | 2005-01-20 |
| [wafer Structure And Bumping Process Thereof] App 20050006759 - Huang, Min-Lung | 2005-01-13 |
| [bonding Pad Structure] App 20050006790 - Huang, Min-Lung | 2005-01-13 |
| [wafer Level Passive Component] App 20050001307 - Huang, Min-Lung | 2005-01-06 |
| Under bump metallization structure of a semiconductor wafer App 20040262759 - Huang, Min-Lung | 2004-12-30 |
| Under bump metallization structure of a semiconductor wafer App 20040262760 - Huang, Min-Lung | 2004-12-30 |
| Under bump metallization structure of a semiconductor wafer App 20040262755 - Huang, Min-Lung | 2004-12-30 |
| [flip-chip Package Substrate And Flip-chip Bonding Process Thereof] App 20040256737 - Huang, Min-Lung ; et al. | 2004-12-23 |
| [chip Structure] App 20040245630 - Huang, Min-Lung ; et al. | 2004-12-09 |
| Bump manufacturing method Grant 6,827,252 - Tong , et al. December 7, 2 | 2004-12-07 |
| [method For Treating Wafer Surface] App 20040229474 - Tsai, Chi-Long ; et al. | 2004-11-18 |
| Bumping process App 20040188378 - Wu, En-Chieh ; et al. | 2004-09-30 |
| [method Of Forming Bumps] App 20040185651 - Wu, Tsung-Hua ; et al. | 2004-09-23 |
| [under Bump Metallurgy Layer] App 20040183195 - Huang, Min-Lung ; et al. | 2004-09-23 |
| [a Wafer Bumping Process] App 20040185649 - HUANG, MIN-LUNG ; et al. | 2004-09-23 |
| [method Of Assembling Passive Component] App 20040127011 - HUANG, MIN-LUNG ; et al. | 2004-07-01 |
| Method for preventing burnt fuse pad from further electrical connection Grant 6,756,256 - Tong , et al. June 29, 2 | 2004-06-29 |
| [structure For Preventing Burnt Fuse Pad From Further Electrical Connection] App 20040114294 - Tong, Ho-Ming ; et al. | 2004-06-17 |
| [solder Ball Fabricating Process] App 20040112944 - Tong, Ho-Ming ; et al. | 2004-06-17 |
| Method for making UBM pads and bumps on wafer App 20040110364 - Tsai, Chi-Long ; et al. | 2004-06-10 |
| Bump fabrication process Grant 6,743,707 - Tong , et al. June 1, 2 | 2004-06-01 |
| Solder ball attaching process Grant 6,732,912 - Tong , et al. May 11, 2 | 2004-05-11 |
| Solder ball fabrication process Grant 6,723,630 - Tong , et al. April 20, 2 | 2004-04-20 |
| Bump fabrication method Grant 6,720,244 - Tong , et al. April 13, 2 | 2004-04-13 |
| Bump manufacturing method Grant 6,716,739 - Tong , et al. April 6, 2 | 2004-04-06 |
| Bumping process Grant 6,713,320 - Tong , et al. March 30, 2 | 2004-03-30 |
| Solder ball fabricating process Grant 6,673,711 - Tong , et al. January 6, 2 | 2004-01-06 |
| Bump fabrication process Grant 6,664,128 - Tong , et al. December 16, 2 | 2003-12-16 |
| Under-bump-metallurgy Layer App 20030189261 - Tong, Ho-Ming ; et al. | 2003-10-09 |
| Chip Structure And Wire Bonding Process Suited For The Same App 20030189249 - Tong, Ho-Ming ; et al. | 2003-10-09 |
| Flip-chip Bonding Structure And Method Thereof App 20030189260 - TONG, HO-MING ; et al. | 2003-10-09 |
| Lead-free bump fabrication process Grant 6,617,237 - Tong , et al. September 9, 2 | 2003-09-09 |
| Solder Ball Attaching Process App 20030164395 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bump Fabrication Process App 20030166330 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Under-ball metallic layer App 20030164552 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bump Fabrication Process App 20030166331 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bump fabrication method App 20030166332 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bonding Structure For Bonding Substrates By Metal Studs App 20030161123 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Flip Chip Interconnection Structure And Fabrication Process Thereof App 20030160335 - TONG, HO-MING ; et al. | 2003-08-28 |
| Method Of Modifying Tin To Lead Ratio In Tin-lead Bump App 20030160089 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Solder Ball Fabrication Process App 20030162379 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Wafer-level Package Structure App 20030160323 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Lead-free Bump Fabrication Process App 20030162381 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Method For Preventing Burnt Fuse Pad From Further Electrical Connection App 20030162331 - TONG, HO-MING ; et al. | 2003-08-28 |
| Wafer Bump Fabrication Process App 20030162362 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Bmuping Process App 20030162321 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Solder Ball Fabricating Process App 20030162380 - TONG, HO-MING ; et al. | 2003-08-28 |
| Process of fabricating bumps App 20030157791 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Bump manufacturing method App 20030155406 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Bump Forming Process App 20030157438 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Bump manufacturing method App 20030157789 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Method of forming bump App 20030157790 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Bump Manufacturing Method App 20030157792 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Etching Method For Nickel-vanadium Alloy App 20030146191 - Tong, Ho-Ming ; et al. | 2003-08-07 |
| Under bump structure and process for producing the same App 20030141591 - Hsu, Chih-Hsiang ; et al. | 2003-07-31 |
| Bump Fabrication Process App 20030124833 - Tong , Ho-Ming ; et al. | 2003-07-03 |
| Semiconductor device having bump electrode Grant 6,452,270 - Huang September 17, 2 | 2002-09-17 |
| Semiconductor device having bump electrode App 20020096764 - Huang, Min-Lung | 2002-07-25 |
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