loadpatents
name:-0.021542072296143
name:-0.010967016220093
name:-0.0051059722900391
HUANG; Chih-Yi Patent Filings

HUANG; Chih-Yi

Patent Applications and Registrations

Patent applications and USPTO patent grants for HUANG; Chih-Yi.The latest application filed is for "assembly structure and method for manufacturing the same".

Company Profile
4.12.20
  • HUANG; Chih-Yi - Kaohsiung TW
  • Huang; Chih-Yi - Changhua County TW
  • Huang; Chih-Yi - Kaohsiung City TW
  • Huang, Chih-Yi - Taichung TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Assembly Structure And Method For Manufacturing The Same
App 20220310500 - CHANG; Yung-Shun ;   et al.
2022-09-29
Semiconductor package structure and method for manufacturing the same
Grant 11,424,167 - Wang , et al. August 23, 2
2022-08-23
Wiring Package And Method Of Manufacturing The Same
App 20220139824 - HUANG; Chih-Yi ;   et al.
2022-05-05
Semiconductor Package Structure And Method For Manufacturing The Same
App 20220115276 - WANG; Chen-Chao ;   et al.
2022-04-14
Optical Lens, Mold For Optical Lens And Manufacturing Method Thereof
App 20220091305 - Chen; Chun-Chieh ;   et al.
2022-03-24
Package Structure And Testing Method
App 20210278457 - WANG; Chen-Chao ;   et al.
2021-09-09
Stacked semiconductor package assemblies including double sided redistribution layers
Grant 10,886,263 - Chen , et al. January 5, 2
2021-01-05
Semiconductor device package and a method of manufacturing the same
Grant 10,522,508 - Hu , et al. Dec
2019-12-31
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20190341368 - HU; Ian ;   et al.
2019-11-07
Semiconductor package device and method of manufacturing the same
Grant 10,332,849 - Yeh , et al.
2019-06-25
Stacked Semiconductor Package Assemblies Including Double Sided Redistribution Layers
App 20190103386 - CHEN; William T. ;   et al.
2019-04-04
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180374805 - YEH; Chang-Lin ;   et al.
2018-12-27
Semiconductor package device and method of manufacturing the same
Grant 10,074,622 - Yeh , et al. September 11, 2
2018-09-11
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180226365 - YEH; Chang-Lin ;   et al.
2018-08-09
Semiconductor device package and method of making the same
Grant 9,564,393 - Huang , et al. February 7, 2
2017-02-07
Method of making semiconductor package having redistribution layer
Grant 8,389,394 - Huang , et al. March 5, 2
2013-03-05
Circuit substrate having power/ground plane with grid holes
Grant 8,193,454 - Cheng , et al. June 5, 2
2012-06-05
Semiconductor Package and Method for Making the Same
App 20110237032 - Huang; Chih-Yi ;   et al.
2011-09-29
Semiconductor package having redistribution layer
Grant 7,977,784 - Huang , et al. July 12, 2
2011-07-12
Semiconductor structure and semiconductor manufacturing method
Grant 7,851,895 - Huang , et al. December 14, 2
2010-12-14
Signal transmission structure, package structure and bonding method thereof
Grant 7,838,777 - Chou , et al. November 23, 2
2010-11-23
Semiconductor Device Package Having Chip With Conductive Layer
App 20100283139 - CHENG; Hung-Hsiang ;   et al.
2010-11-11
Substrate of window ball grid array package and method for making the same
App 20100102447 - Huang; Chih-Yi ;   et al.
2010-04-29
Substrate of window ball grid array package
App 20100071939 - Cheng; Hung-Hsiang ;   et al.
2010-03-25
Substrate for window ball grid array package
App 20100065312 - Cheng; Hung-Hsiang ;   et al.
2010-03-18
Circuit substrate having power/ground plane with grid holes
App 20100051341 - Cheng; Hung-Hsiang ;   et al.
2010-03-04
Semiconductor Package And Method For Making The Same
App 20090152721 - Huang; Chih-Yi ;   et al.
2009-06-18
Semiconductor structure and semiconductor manufacturing method
App 20090039521 - Huang; Chih Yi ;   et al.
2009-02-12
Method Of Cutting Signal Wire Preserved On Circuit Board And Circuit Layout Thereof
App 20090019692 - Huang; Chih-Yi ;   et al.
2009-01-22
Signal Transmission Structure, Package Structure And Bonding Method Thereof
App 20070221403 - Chou; Chia-Hsing ;   et al.
2007-09-27
Image retrieval system and method for processing image in image retrieval system
App 20040075757 - Huang, Chen-Liang ;   et al.
2004-04-22

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed