Hu; Ping-Cheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hu; Ping-Cheng.The latest application filed is for "light-emitting semiconductor packages and related methods".

Company Profile

0.13.14

Hu; Ping-Cheng - Kaohsiung TW
Hu; Ping-Cheng - Kaohsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light-emitting semiconductor packages and related methods Grant 9,059,379 - Kuo , et al. June 16, 2	2015-06-16
Semiconductor device packages with solder joint enhancement elements Grant 8,994,156 - Chiang , et al. March 31, 2	2015-03-31
Light-emitting Semiconductor Packages And Related Methods App 20140117388 - Kuo; Yen-Ting ; et al.	2014-05-01
Semiconductor packages with lead extensions and related methods Grant 8,674,487 - Yu , et al. March 18, 2	2014-03-18
Semiconductor Device Packages With Solder Joint Enhancement Element And Related Methods App 20130307157 - Chiang; Po-Shing ; et al.	2013-11-21
Semiconductor Packages With Lead Extensions And Related Methods App 20130241041 - Yu; Lin-Wang ; et al.	2013-09-19
Semiconductor device packages with solder joint enhancement element and related methods Grant 8,502,363 - Chiang , et al. August 6, 2	2013-08-06
Semiconductor package having a cavity structure Grant 8,492,883 - Chien , et al. July 23, 2	2013-07-23
Semiconductor Device Packages With Solder Joint Enhancement Element And Related Methods App 20130009313 - Chiang; Po-Shing ; et al.	2013-01-10
Advanced quad flat non-leaded package structure and manufacturing method thereof Grant 8,237,250 - Chang Chien , et al. August 7, 2	2012-08-07
Advanced Quad Flat Non-leaded Package Structure And Manufacturing Method Thereof App 20120119342 - Chang Chien; Pao-Huei ; et al.	2012-05-17
Manufacturing method of advanced quad flat non-leaded package Grant 8,124,447 - Chang Chien , et al. February 28, 2	2012-02-28
Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof Grant 8,120,152 - Chang Chien , et al. February 21, 2	2012-02-21
Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof Grant 8,115,285 - Chen , et al. February 14, 2	2012-02-14
Semiconductor package and manufacturing method thereof Grant 8,106,492 - Chang Chien , et al. January 31, 2	2012-01-31
Advanced Quad Flat Non-leaded Package Structure And Manufacturing Method Thereof App 20100258934 - CHANG CHIEN; PAO-HUEI ; et al.	2010-10-14
Advanced Quad Flat-leaded Package Structure And Manufacturing Method Thereof App 20100258921 - CHANG CHIEN; PAO-HUEI ; et al.	2010-10-14
Manufacturing Method Of Advanced Quad Flat Non-leaded Package App 20100258920 - Chien; Pao-Huei Chang ; et al.	2010-10-14
Advanced Quad Flat Non-leaded Package Structure And Manufacturing Method Thereof App 20100044843 - Chang Chien; Pao-Huei ; et al.	2010-02-25
Advanced Quad Flat Non-leaded Package Structure And Manufacturing Method Thereof App 20100044850 - Lin; Chun-Hung ; et al.	2010-02-25
Advanced Quad Flat No Lead Chip Package Having Marking And Corner Lead Features And Manufacturing Methods Thereof App 20090230525 - Chang Chien; Pao-Huei ; et al.	2009-09-17
Semiconductor Chip Package Having Ground And Power Regions And Manufacturing Methods Thereof App 20090230524 - Chien; Pao-Huei Chang ; et al.	2009-09-17
Advanced Quad Flat No Lead Chip Package Having A Cavity Structure And Manufacturing Methods Thereof App 20090230523 - Chien; Pao-Huei Chang ; et al.	2009-09-17

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