Hu; Jung-Chih
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hu; Jung-Chih.The latest application filed is for "through via process".
- Hu; Jung-Chih - Yangmei N/A TW
- Hu; Jung-Chih - Yangmei Township N/A TW
- Hu; Jung-Chih - Taoyuan County TW
- Hu; Jung-Chih - Hsinchu TW
- Hu, Jung-Chih - Kaohsiung TW
| Patent | Date |
|---|---|
| Backside process for a substrate Grant 8,691,664 - Yang , et al. April 8, 2 | 2014-04-08 |
| Component stacking using pre-formed adhesive films Grant 8,664,749 - Wu , et al. March 4, 2 | 2014-03-04 |
| Through Via Process App 20130277844 - CHIOU; Wen-Chih ; et al. | 2013-10-24 |
| Methods of forming through via Grant 8,486,823 - Chiou , et al. July 16, 2 | 2013-07-16 |
| Particle free wafer separation Grant 8,058,150 - Wu , et al. November 15, 2 | 2011-11-15 |
| Component Stacking Using Pre-Formed Adhesive Films App 20110186967 - Wu; Weng-Jin ; et al. | 2011-08-04 |
| Component stacking using pre-formed adhesive films Grant 7,943,421 - Wu , et al. May 17, 2 | 2011-05-17 |
| Backside Process for a Substrate App 20100267217 - Yang; Ku-Feng ; et al. | 2010-10-21 |
| Component Stacking Using Pre-Formed Adhesive Films App 20100140767 - Wu; Weng-Jin ; et al. | 2010-06-10 |
| Two Step Method And Apparatus For Polishing Metal And Other Films In Semiconductor Manufacturing App 20100062693 - Yu; Chen-Hua ; et al. | 2010-03-11 |
| Particle Free Wafer Separation App 20100009518 - Wu; Weng-Jin ; et al. | 2010-01-14 |
| Through Via Process App 20090224405 - Chiou; Wen-Chih ; et al. | 2009-09-10 |
| Galvanizing solution for the galvanic deposition of copper Grant 6,858,123 - Hu , et al. February 22, 2 | 2005-02-22 |
| Self-grown hydrophobic nano molecule organic diffusion barrier and method of the same App 20030148630 - Hu, Jung-Chih | 2003-08-07 |
| Method for improving the moisture absorption of porous low dielectric film Grant 6,417,118 - Hu , et al. July 9, 2 | 2002-07-09 |
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