| Patent | Date |
|---|
Interposer And Manufacturing Method Thereof
App 20220254708 - HU; Dyi-Chung | 2022-08-11 |
Manufacturing method of carrier for semiconductor chip mounting thereon
Grant 11,404,335 - Hu August 2, 2 | 2022-08-02 |
Package Substrate And Package Structure
App 20220181244 - HU; Dyi-Chung | 2022-06-09 |
Package substrate and package structure
Grant 11,309,252 - Hu April 19, 2 | 2022-04-19 |
Integrated Substrate Structure, Electronic Assembly, And Manufacturing Method Thereof
App 20220037245 - HU; Dyi-Chung | 2022-02-03 |
Manufacturing Method Of Integrated Substrate
App 20210382088 - HU; Dyi-Chung | 2021-12-09 |
Semiconductor Device And Manufacturing Method Thereof
App 20210302495 - HU; Dyi-Chung | 2021-09-30 |
Integrated substrate and manufacturing method thereof
Grant 11,125,781 - Hu September 21, 2 | 2021-09-21 |
Manufacturing Method Of Carrier For Semiconductor Chip Mounting Thereon
App 20210272864 - HU; Dyi-Chung | 2021-09-02 |
Carrier for chip packaging and manufacturing method thereof
Grant 11,049,779 - Hu June 29, 2 | 2021-06-29 |
Substrate structure with high-density wiring and manufacturing method thereof
Grant 11,024,573 - Hu June 1, 2 | 2021-06-01 |
Space transformer and manufacturing method thereof
Grant 11,018,082 - Hu May 25, 2 | 2021-05-25 |
Integrated Substrate Structure, Redistribution Structure, And Manufacturing Method Thereof
App 20210151382 - HU; Dyi-Chung | 2021-05-20 |
Wafer reconfiguration during a coating process or an electric plating process
Grant 10,964,580 - Hu March 30, 2 | 2021-03-30 |
Package Substrate And Method Of Fabricating The Same
App 20210066189 - Chen; Yu-Hua ; et al. | 2021-03-04 |
Semiconductor Package And Manufacturing Method Thereof
App 20210020577 - HU; Dyi-Chung | 2021-01-21 |
Package Substrate And Package Structure
App 20200411442 - HU; Dyi-Chung | 2020-12-31 |
Package substrate and method of fabricating the same
Grant 10,867,907 - Chen , et al. December 15, 2 | 2020-12-15 |
Package substrate and package structure
Grant 10,818,584 - Hu October 27, 2 | 2020-10-27 |
Substrate Structure With High-density Wiring And Manufacturing Method Thereof
App 20200227346 - HU; Dyi-Chung | 2020-07-16 |
Package substrate and package structure
Grant 10,643,936 - Hu | 2020-05-05 |
Carrier For Chip Packaging And Manufacturing Method Thereof
App 20200118898 - HU; Dyi-Chung | 2020-04-16 |
Interposer And Manufacturing Method Thereof
App 20200035591 - HU; Dyi-Chung | 2020-01-30 |
Space Transformer And Manufacturing Method Thereof
App 20200033381 - HU; Dyi-Chung | 2020-01-30 |
Substrate structure and electronic device having coarse redistribution layer electrically connected to fine redistribution layer
Grant 10,535,622 - Hu Ja | 2020-01-14 |
Electronic package and manufacturing method thereof
Grant 10,395,946 - Hu A | 2019-08-27 |
Package substrate
Grant 10,373,918 - Hu | 2019-08-06 |
Substrate Structure And Electronic Device
App 20190181112 - HU; Dyi-Chung | 2019-06-13 |
Manufacturing method of integrated circuit package
Grant 10,304,794 - Hu | 2019-05-28 |
Composite carrier for warpage management
Grant 10,304,786 - Hu | 2019-05-28 |
Package Substrate And Package Structure
App 20190148273 - HU; Dyi-Chung | 2019-05-16 |
Package substrate with embedded noise shielding walls
Grant 10,290,586 - Hu | 2019-05-14 |
Manufacturing method of package structure having embedded bonding film
Grant 10,283,455 - Hu | 2019-05-07 |
Package substrate with embedded circuit
Grant 10,236,245 - Hu | 2019-03-19 |
Electronic Package And Manufacturing Method Thereof
App 20190074195 - HU; Dyi-Chung | 2019-03-07 |
Pad structure and manufacturing method thereof
Grant 10,224,300 - Hu | 2019-03-05 |
Composite Carrier For Warpage Management
App 20190013280 - HU; Dyi-Chung | 2019-01-10 |
Metal via structure
Grant 10,157,836 - Hu Dec | 2018-12-18 |
System in package
Grant 10,153,234 - Hu Dec | 2018-12-11 |
Redistribution film for IC package
Grant 10,154,599 - Hu Dec | 2018-12-11 |
Package Substrate And Package Structure
App 20180350731 - HU; Dyi-Chung | 2018-12-06 |
Electronic package and manufacturing method thereof
Grant 10,141,198 - Hu Nov | 2018-11-27 |
Manufacturing method of interconnection structure
Grant 10,141,224 - Hu , et al. Nov | 2018-11-27 |
Package Substrate And Method Of Fabricating The Same
App 20180323143 - Chen; Yu-Hua ; et al. | 2018-11-08 |
Composite carrier for warpage management
Grant 10,109,598 - Hu October 23, 2 | 2018-10-23 |
Manufacturing Method Of Package Structure Having Embedded Bonding Film
App 20180294229 - HU; Dyi-Chung | 2018-10-11 |
Metal pillar with cushioned tip
Grant 10,090,270 - Hu October 2, 2 | 2018-10-02 |
Glass fiber reinforced package substrate
Grant 10,068,838 - Hu September 4, 2 | 2018-09-04 |
Package substrate and method of fabricating the same
Grant 10,068,847 - Chen , et al. September 4, 2 | 2018-09-04 |
System in package
Grant 10,068,889 - Hu September 4, 2 | 2018-09-04 |
Bonding film
Grant 10,049,995 - Hu August 14, 2 | 2018-08-14 |
Heatsink With Nanotwinned Copper Wall
App 20180228054 - HU; Dyi-Chung | 2018-08-09 |
Package structure having embedded bonding film and manufacturing method thereof
Grant 10,037,946 - Hu July 31, 2 | 2018-07-31 |
Package structure and manufacturing method thereof
Grant 10,032,702 - Hu July 24, 2 | 2018-07-24 |
Package On Package Configuration
App 20180175003 - HU; Dyi-Chung | 2018-06-21 |
Package on package configuration
Grant 10,002,852 - Hu June 19, 2 | 2018-06-19 |
Package Structure And Manufacturing Method Thereof
App 20180166371 - HU; Dyi-Chung | 2018-06-14 |
Joint structure for metal pillars
Grant 9,972,604 - Hu May 15, 2 | 2018-05-15 |
Glass Fiber Reinforced Package Substrate
App 20180122736 - HU; Dyi-Chung | 2018-05-03 |
Embedded optical fiber module
Grant 9,958,616 - Hu May 1, 2 | 2018-05-01 |
Manufacturing Method Of Interconnection Structure
App 20180096889 - Hu; Dyi-Chung ; et al. | 2018-04-05 |
Metal Via Structure
App 20180068943 - HU; Dyi-Chung | 2018-03-08 |
Package Structure Having Embedded Bonding Film And Manufacturing Method Thereof
App 20180053723 - HU; Dyi-Chung | 2018-02-22 |
Pad Structure And Manufacturing Method Thereof
App 20180040577 - HU; Dyi-Chung | 2018-02-08 |
Electronic Package And Manufacturing Method Thereof
App 20180012774 - HU; Dyi-Chung | 2018-01-11 |
Bonding Film
App 20180005968 - HU; Dyi-Chung | 2018-01-04 |
Interconnection structure and manufacturing method thereof
Grant 9,859,159 - Hu , et al. January 2, 2 | 2018-01-02 |
Metal via structure
Grant 9,859,213 - Hu January 2, 2 | 2018-01-02 |
Spacer connector
Grant 9,859,202 - Hu January 2, 2 | 2018-01-02 |
Manufacturing method of interposed substrate
Grant 9,859,130 - Hu , et al. January 2, 2 | 2018-01-02 |
3d Spiral Inductor
App 20170365395 - HU; Dyi-Chung | 2017-12-21 |
Manufacturing Method Of Integrated Circuit Package
App 20170365573 - HU; Dyi-Chung | 2017-12-21 |
Coaxial copper pillar
Grant 9,837,347 - Hu December 5, 2 | 2017-12-05 |
Package Substrate With Embedded Noise Shielding Walls
App 20170345771 - HU; Dyi-Chung | 2017-11-30 |
Manufacturing method of interposed substrate
Grant 9,831,103 - Hu , et al. November 28, 2 | 2017-11-28 |
Bonding film for signal communication between central chip and peripheral chips and fabricating method thereof
Grant 9,806,044 - Hu October 31, 2 | 2017-10-31 |
High density film for IC package
Grant 9,799,622 - Hu October 24, 2 | 2017-10-24 |
Package substrate with double sided fine line RDL
Grant 9,799,616 - Hu October 24, 2 | 2017-10-24 |
Circuit board structure with embedded fine-pitch wires and fabrication method thereof
Grant 9,788,427 - Hu October 10, 2 | 2017-10-10 |
Method of fabricating packaging substrate having embedded through-via interposer
Grant 9,781,843 - Hu , et al. October 3, 2 | 2017-10-03 |
Package Substrate With Embedded Circuit
App 20170278779 - HU; Dyi-Chung | 2017-09-28 |
Metal Pillar With Cushioned Tip
App 20170278815 - HU; Dyi-Chung | 2017-09-28 |
Redistribution Film For Ic Package
App 20170265312 - HU; Dyi-Chung | 2017-09-14 |
Package Substrate With Double Sided Fine Line Rdl
App 20170263579 - HU; Dyi-Chung | 2017-09-14 |
Redistribution film for IC package
Grant 9,756,738 - Hu September 5, 2 | 2017-09-05 |
Reflective sensing module having light chip and sensor chip mounted to bottom surface of transparent top cover, and wristband comprising said reflective sensing module
Grant 9,737,215 - Hu August 22, 2 | 2017-08-22 |
Molding compound wrapped package substrate
Grant 9,735,079 - Hu August 15, 2 | 2017-08-15 |
Bonding Film
App 20170229409 - HU; Dyi-Chung | 2017-08-10 |
Package Substrate And Method Of Fabricating The Same
App 20170194249 - Chen; Yu-Hua ; et al. | 2017-07-06 |
Fabricating process for package substrate
Grant 9,691,717 - Hu June 27, 2 | 2017-06-27 |
Low profile IC package
Grant 9,691,661 - Hu June 27, 2 | 2017-06-27 |
System In Package
App 20170179102 - HU; Dyi-Chung | 2017-06-22 |
Stacked package-on-package memory devices
Grant 9,685,429 - Hu June 20, 2 | 2017-06-20 |
Package Substrate
App 20170162523 - HU; Dyi-Chung | 2017-06-08 |
Metal Via Structure
App 20170162497 - HU; Dyi-Chung | 2017-06-08 |
System in package
Grant 9,673,148 - Hu June 6, 2 | 2017-06-06 |
Heatsink With Nanotwinned Copper Wall
App 20170142862 - HU; Dyi-Chung | 2017-05-18 |
System In Package
App 20170125348 - HU; Dyi-Chung | 2017-05-04 |
System In Package
App 20170125347 - HU; Dyi-Chung | 2017-05-04 |
Package substrate
Grant 9,627,285 - Hu April 18, 2 | 2017-04-18 |
Molding Compound Wrapped Package Substrate
App 20170103943 - HU; Dyi-Chung | 2017-04-13 |
Wafer Reconfiguration
App 20170092526 - HU; Dyi-Chung | 2017-03-30 |
Fabricating Process For Package Substrate
App 20170084548 - HU; Dyi-Chung | 2017-03-23 |
Circuit board structure and method for manufacturing the same
Grant 9,578,742 - Cheng , et al. February 21, 2 | 2017-02-21 |
Circuit Board Structure And Method For Manufacturing The Same
App 20170048973 - CHENG; Shih-Liang ; et al. | 2017-02-16 |
Coaxial Copper Pillar
App 20170047281 - HU; Dyi-Chung | 2017-02-16 |
Wafer reconfiguration
Grant 9,545,776 - Hu January 17, 2 | 2017-01-17 |
Fabricating Process For Redistribution Layer
App 20170011934 - HU; Dyi-Chung | 2017-01-12 |
Package substrate with lateral communication circuitry
Grant 9,543,249 - Hu January 10, 2 | 2017-01-10 |
Spacer Connector
App 20160379922 - HU; Dyi-Chung | 2016-12-29 |
Embedded Optical Fiber Module
App 20160356961 - HU; Dyi-Chung | 2016-12-08 |
Molding compound supported RDL for IC package
Grant 9,502,322 - Hu November 22, 2 | 2016-11-22 |
Thin film RDL for IC package
Grant 9,502,321 - Hu November 22, 2 | 2016-11-22 |
Package substrate having photo-sensitive dielectric layer and method of fabricating the same
Grant 9,485,874 - Chen , et al. November 1, 2 | 2016-11-01 |
Carrier and method for fabricating coreless packaging substrate
Grant 9,485,863 - Tseng , et al. November 1, 2 | 2016-11-01 |
Solder Mask First Process
App 20160316573 - HU; Dyi-Chung | 2016-10-27 |
Substrate components for packaging IC chips and electronic device packages of the same
Grant 9,478,472 - Hu October 25, 2 | 2016-10-25 |
Reflective Sensing Module
App 20160296117 - HU; Dyi-Chung | 2016-10-13 |
Packaging substrate having a through-holed interposer
Grant 9,460,992 - Tseng , et al. October 4, 2 | 2016-10-04 |
Low Profile Ic Package
App 20160284620 - HU; Dyi-Chung | 2016-09-29 |
Interconnection Structure And Manufacturing Method Thereof
App 20160268206 - Hu; Dyi-Chung ; et al. | 2016-09-15 |
Composite Carrier For Warpage Management
App 20160254233 - HU; Dyi-Chung | 2016-09-01 |
Molding compound supported RDL for IC package
Grant 9,431,335 - Hu August 30, 2 | 2016-08-30 |
Wafer Reconfiguration
App 20160214349 - HU; Dyi-Chung | 2016-07-28 |
Packaging substrate having embedded interposer and fabrication method thereof
Grant 9,385,056 - Hu , et al. July 5, 2 | 2016-07-05 |
Method For Manufacturing An Interposer, Interposer And Chip Package Structure
App 20160190050 - Tain; Ra-Min ; et al. | 2016-06-30 |
Packaging carrier and manufacturing method thereof and chip package structure
Grant 9,374,896 - Chen , et al. June 21, 2 | 2016-06-21 |
Method for manufacturing an interposer, interposer and chip package structure
Grant 9,368,442 - Tain , et al. June 14, 2 | 2016-06-14 |
Bonding process for a chip bonding to a thin film substrate
Grant 9,362,256 - Hu June 7, 2 | 2016-06-07 |
Package stack device and fabrication method thereof
Grant 9,362,140 - Hu June 7, 2 | 2016-06-07 |
Circuit Board Structure With Embedded Fine-pitch Wires And Fabrication Method Thereof
App 20160157340 - HU; Dyi-Chung | 2016-06-02 |
Packaging substrate having embedded through-via interposer
Grant 9,357,659 - Hu , et al. May 31, 2 | 2016-05-31 |
Redistribution Film For Ic Package
App 20160141262 - HU; Dyi-Chung | 2016-05-19 |
Manufacturing Method Of Interposed Substrate
App 20160133483 - Hu; Dyi-Chung ; et al. | 2016-05-12 |
Method of fabricating a through-holed interposer
Grant 9,337,136 - Tseng , et al. May 10, 2 | 2016-05-10 |
Molding Compound Supported Rdl For Ic Package
App 20160118328 - HU; Dyi-Chung | 2016-04-28 |
Molding Compound Supported Rdl For Ic Package
App 20160118312 - HU; Dyi-Chung | 2016-04-28 |
Thin Film Rdl For Ic Package
App 20160118311 - HU; Dyi-Chung | 2016-04-28 |
Bonding Process For A Chip Bonding To A Thin Film Substrate
App 20160104690 - HU; Dyi-Chung | 2016-04-14 |
Interposer and packaging substrate having the interposer
Grant 9,312,219 - Hu April 12, 2 | 2016-04-12 |
Method of making a circuit board structure with embedded fine-pitch wires
Grant 9,295,163 - Hu March 22, 2 | 2016-03-22 |
Interposed substrate and manufacturing method thereof
Grant 9,282,646 - Hu , et al. March 8, 2 | 2016-03-08 |
High Density Ic Package
App 20160064254 - HU; Dyi-Chung | 2016-03-03 |
Thin film RDL for nanochip package
Grant 9,263,373 - Hu February 16, 2 | 2016-02-16 |
Stacked Package-on-package Memory Devices
App 20160035711 - HU; Dyi-Chung | 2016-02-04 |
Package Substrate
App 20160027712 - HU; Dyi-Chung | 2016-01-28 |
Method of fabricating packaging substrate having a through-holed interposer
Grant 9,224,683 - Tseng , et al. December 29, 2 | 2015-12-29 |
High Density Film For Ic Package
App 20150371965 - HU; Dyi-Chung | 2015-12-24 |
Thin Film Rdl For Nanochip Package
App 20150371932 - HU; Dyi-Chung | 2015-12-24 |
Substrate Components For Packaging Ic Chips And Electronic Device Packages Of The Same
App 20150334823 - HU; Dyi-Chung | 2015-11-19 |
Method of manufacturing passive component module
Grant 9,125,320 - Hu September 1, 2 | 2015-09-01 |
Method of fabricating semiconductor package structure
Grant 9,111,948 - Tseng , et al. August 18, 2 | 2015-08-18 |
Packaging Substrate Having A Through-holed Interposer
App 20150187692 - Tseng; Tzyy-Jang ; et al. | 2015-07-02 |
Method Of Fabricating A Through-holed Interposer
App 20150179476 - Tseng; Tzyy-Jang ; et al. | 2015-06-25 |
Method Of Fabricating Packaging Substrate Having A Through-holed Interposer
App 20150179475 - Tseng; Tzyy-Jang ; et al. | 2015-06-25 |
Method Of Fabricating Packaging Substrate Having Embedded Through-via Interposer
App 20150135527 - Hu; Dyi-Chung ; et al. | 2015-05-21 |
Packaging Substrate Having Embedded Through-via Interposer
App 20150129285 - Hu; Dyi-Chung ; et al. | 2015-05-14 |
Manufacturing Method Of Interposed Substrate
App 20150097318 - Hu; Dyi-Chung ; et al. | 2015-04-09 |
Through-holed interposer, packaging substrate, and methods of fabricating the same
Grant 8,981,570 - Tseng , et al. March 17, 2 | 2015-03-17 |
Method of fabricating an electronic device comprising photodiode
Grant 8,956,909 - Tseng , et al. February 17, 2 | 2015-02-17 |
Interposed substrate and manufacturing method thereof
Grant 8,952,268 - Hu , et al. February 10, 2 | 2015-02-10 |
Packaging substrate having embedded through-via interposer and method of fabricating the same
Grant 8,946,564 - Hu , et al. February 3, 2 | 2015-02-03 |
Circuit Board Structure With Embedded Fine-pitch Wires And Fabrication Method Thereof
App 20140352135 - HU; Dyi-Chung | 2014-12-04 |
Package Substrate And Method For Testing The Same
App 20140264335 - Hu; Dyi-Chung ; et al. | 2014-09-18 |
Electronic device comprising electrical contact pads
Grant 8,835,992 - Tseng , et al. September 16, 2 | 2014-09-16 |
Interposer And Packaging Substrate Having The Interposer
App 20140182906 - Hu; Dyi-Chung | 2014-07-03 |
Interposed Substrate And Manufacturing Method Thereof
App 20140138142 - Hu; Dyi-Chung ; et al. | 2014-05-22 |
Package Substrate And Method Of Forming The Same
App 20140117557 - CHEN; Yu-Hua ; et al. | 2014-05-01 |
Fabrication method of packaging substrate having through-holed interposer embedded therein
Grant 8,709,865 - Hu , et al. April 29, 2 | 2014-04-29 |
Electronic Device And Method Of Fabricating The Same
App 20140110713 - Tseng; Tzyy-Jang ; et al. | 2014-04-24 |
Package Substrate And Method Of Fabricating The Same
App 20140102777 - CHEN; Yu-Hua ; et al. | 2014-04-17 |
Packaging Carrier And Manufacturing Method Thereof And Chip Package Structure
App 20140102772 - Chen; Ming-Chih ; et al. | 2014-04-17 |
Package Substrate And Method Of Fabricating The Same
App 20140084413 - CHEN; Yu-Hua ; et al. | 2014-03-27 |
Method Of Fabricating Semiconductor Package Structure
App 20140084463 - Tseng; Tzyy-Jang ; et al. | 2014-03-27 |
Through-holed Interposer, Packaging Substrate, And Methods Of Fabricating The Same
App 20140027925 - Tseng; Tzyy-Jang ; et al. | 2014-01-30 |
Conductive line structure and the method of forming the same
Grant 8,637,402 - Hu , et al. January 28, 2 | 2014-01-28 |
Method of fabricating package structure
Grant 8,633,061 - Tseng , et al. January 21, 2 | 2014-01-21 |
Semiconductor package structure and method of fabricating the same
Grant 8,624,366 - Tseng , et al. January 7, 2 | 2014-01-07 |
Carrier And Method For Fabricating Coreless Packaging Substrate
App 20130335928 - Tseng; Tzyy-Jang ; et al. | 2013-12-19 |
Interposed Substrate And Manufacturing Method Thereof
App 20130313011 - Hu; Dyi-Chung ; et al. | 2013-11-28 |
Method Of Fabricating Package Structure
App 20130309817 - Tseng; Tzyy-Jang ; et al. | 2013-11-21 |
Packaging Substrate
App 20130249083 - Hu; Dyi-Chung ; et al. | 2013-09-26 |
Package structure, fabricating method thereof, and package-on-package device thereby
Grant 8,513,796 - Tseng , et al. August 20, 2 | 2013-08-20 |
Package Stack Device And Fabrication Method Thereof
App 20130175687 - Hu; Dyi-Chung | 2013-07-11 |
Packaging Substrate Having Embedded Through-via Interposer And Method Of Fabricating The Same
App 20130105213 - Hu; Dyi-Chung ; et al. | 2013-05-02 |
Fabrication Method Of Packaging Substrate Having Through-holed Interposer Embedded Therein
App 20130040427 - Hu; Yu-Shan ; et al. | 2013-02-14 |
Packaging Substrate Having Embedded Interposer And Fabrication Method Thereof
App 20130032390 - Hu; Dyi-Chung ; et al. | 2013-02-07 |
Chip packaging structure
Grant 8,304,923 - Hu , et al. November 6, 2 | 2012-11-06 |
Semiconductor Package Structure And Method Of Fabricating The Same
App 20120273930 - Tseng; Tzyy-Jang ; et al. | 2012-11-01 |
Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
Grant 8,269,337 - Hu , et al. September 18, 2 | 2012-09-18 |
Package Structure, Fabricating Method Thereof, And Package-on-package Device Thereby
App 20120228764 - Tseng; Tzyy-Jang ; et al. | 2012-09-13 |
Package Structure And Method Of Fabricating The Same
App 20120217627 - Tseng; Tzyy-Jang ; et al. | 2012-08-30 |
Packaging Substrate Having Through-holed Interposer Embedded Therein And Fabrication Method Thereof
App 20120146209 - Hu; Yu-Shan ; et al. | 2012-06-14 |
Conductive Line Structure And The Method Of Forming The Same
App 20120077340 - Hu; Yu-Shan ; et al. | 2012-03-29 |
Back Side Protective Structure For A Semiconductor Package
App 20120061830 - HU; Yu-Shan ; et al. | 2012-03-15 |
Electronic Device And Method Of Fabricating The Same
App 20120012962 - Tseng; Tzyy-Jang ; et al. | 2012-01-19 |
Integrated Circuit Package Having Under-Bump Metallization
App 20110254161 - Hu; Dyi-Chung | 2011-10-20 |
System-in-package and manufacturing method of the same
Grant 7,884,461 - Hu , et al. February 8, 2 | 2011-02-08 |
Back Side Protective Structure For A Semiconductor Package
App 20100109156 - Hu; Yu-Shan ; et al. | 2010-05-06 |
Inter-connecting Structure For Semiconductor Package And Method For The Same
App 20100007017 - Wei; Shih-Chuan ; et al. | 2010-01-14 |
System-in-package and manufacturing method of the same
App 20090321915 - Hu; Dyi-Chung ; et al. | 2009-12-31 |
Conductive line structure and the method of forming the same
App 20090184425 - Hu; Yu-Shan ; et al. | 2009-07-23 |
Method for circuits inspection and method of the same
Grant 7,534,632 - Hu , et al. May 19, 2 | 2009-05-19 |
Trace Structure And Method For Fabricating The Same
App 20080308307 - Chang; Jui-Hsien ; et al. | 2008-12-18 |
Chip Packaging Structure And Chip Packaging Process
App 20080237834 - Hu; Dyi-Chung ; et al. | 2008-10-02 |
Method for circuits inspection and the method of the same
App 20080199391 - Hu; Yu-Shan ; et al. | 2008-08-21 |
Chip Package And Chip Package Array
App 20080073774 - Yang; Wen-Kun ; et al. | 2008-03-27 |
Method of fabricating film carrier
Grant 7,122,124 - Hu , et al. October 17, 2 | 2006-10-17 |
Method Of Fabricating Film Carrier
App 20050196902 - Hu, Dyi-Chung ; et al. | 2005-09-08 |
Method Of Fabricating Film Carrier
App 20050194349 - Hu, Dyi-Chung ; et al. | 2005-09-08 |
Composite bump bonding
App 20020070463 - Chang, Shyh-Ming ; et al. | 2002-06-13 |
Composite bump bonding
Grant 6,365,500 - Chang , et al. April 2, 2 | 2002-04-02 |
Method of making accurate dimension alignment film for LCD
Grant 6,099,786 - Hu , et al. August 8, 2 | 2000-08-08 |
Apparatus for increasing the effective yield of displays with integregated row select driver circuit
Grant 5,619,223 - Lee , et al. April 8, 1 | 1997-04-08 |
Redundant scheme for LCD display with integrated data driving circuit
Grant 5,555,001 - Lee , et al. September 10, 1 | 1996-09-10 |
System for protection of drive circuits formed on a substrate of a liquid crystal display
Grant 5,517,344 - Hu , et al. May 14, 1 | 1996-05-14 |
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