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Method and device for controlling storage format of on-chip storage resource
Grant 11,455,108 - Ding , et al. September 27, 2 | 2022-09-27 |
Method And Device For Controlling Storage Format Of On-chip Storage Resource
App 20220269430 - DING; Ruiqiang ; et al. | 2022-08-25 |
Chip Interconnection Package Structure And Method
App 20220254651 - WANG; Yao ; et al. | 2022-08-11 |
Spotlight lamp with snap-fit anti-glare ring
Grant 11,333,327 - Hu , et al. May 17, 2 | 2022-05-17 |
Integrated circuit packaging method and integrated packaging circuit
Grant 11,335,664 - Hu , et al. May 17, 2 | 2022-05-17 |
Chip Packaging Structure And Method
App 20220149007 - BAO; Yuan ; et al. | 2022-05-12 |
Keyphase Extraction Beyond Language Modeling
App 20220108078 - XIONG; Li ; et al. | 2022-04-07 |
Heat dissipation structure for lamp and LED lamp
Grant 11,255,492 - Hu , et al. February 22, 2 | 2022-02-22 |
Fan-out Packaging Method and Fan-out Packaging Plate
App 20220051908 - HU; Chuan ; et al. | 2022-02-17 |
Keyphrase extraction beyond language modeling
Grant 11,250,214 - Xiong , et al. February 15, 2 | 2022-02-15 |
Integrated circuit packaging structure and method
Grant 11,183,458 - Hu , et al. November 23, 2 | 2021-11-23 |
Fan-out Packaging Method Employing Combined Process
App 20210358883 - HU; Chuan ; et al. | 2021-11-18 |
Heat Dissipation Structure For Lamp And Led Lamp
App 20210190275 - HU; Chuan ; et al. | 2021-06-24 |
Packaging Method And Package Structure For Filter Chip
App 20210184649 - YAN; Yingqiang ; et al. | 2021-06-17 |
Spotlight Lamp
App 20210080085 - HU; Chuan ; et al. | 2021-03-18 |
Integrated circuit system and packaging method therefor
Grant 10,930,634 - Hu , et al. February 23, 2 | 2021-02-23 |
Keyphrase Extraction Beyond Language Modeling
App 20210004439 - XIONG; Li ; et al. | 2021-01-07 |
Extracting Key Phrase Candidates From Documents And Producing Topical Authority Ranking
App 20210004416 - XIONG; Li ; et al. | 2021-01-07 |
Integrated circuit packaging method and integrated packaged circuit
Grant 10,867,959 - Hu , et al. December 15, 2 | 2020-12-15 |
Single layer low cost wafer level packaging for SFF SiP
Grant 10,867,961 - Hu , et al. December 15, 2 | 2020-12-15 |
Chip wiring method and structure
Grant 10,847,496 - Hu , et al. November 24, 2 | 2020-11-24 |
Integrated circuit multichip stacked packaging structure and method
Grant 10,615,151 - Hu , et al. | 2020-04-07 |
Integrated Circuit Packaging Method and Integrated Packaging Circuit
App 20200043886 - Hu; Chuan ; et al. | 2020-02-06 |
Multi-layer package
Grant 10,535,634 - Nair , et al. Ja | 2020-01-14 |
Integrated circuit system and packaging method therefor
App 20200006310 - HU; Chuan ; et al. | 2020-01-02 |
Solder in cavity interconnection structures
Grant 10,468,367 - Hu , et al. No | 2019-11-05 |
Integrated Circuit Packaging Method and Integrated Packaged Circuit
App 20190326207 - Hu; Chuan ; et al. | 2019-10-24 |
Integrated Circuit Multichip Stacked Packaging Structure and Method
App 20190326261 - Hu; Chuan ; et al. | 2019-10-24 |
Chip Wiring Method and Structure
App 20190295982 - HU; Chuan ; et al. | 2019-09-26 |
Integrated Circuit Packaging Structure and Method
App 20190287909 - Hu; Chuan ; et al. | 2019-09-19 |
Packaged semiconductor die and CTE-engineering die pair
Grant 10,381,288 - Hu A | 2019-08-13 |
Multi-chip-module semiconductor chip package having dense package wiring
Grant 10,256,211 - Hu , et al. | 2019-04-09 |
Packaged Semiconductor Die And Cte-engineering Die Pair
App 20190035711 - Hu; Chuan | 2019-01-31 |
Magnetic nanocomposite materials and passive components formed therewith
Grant 10,122,089 - Nair , et al. November 6, 2 | 2018-11-06 |
Packaged semiconductor die and CTE-engineering die pair
Grant 10,096,535 - Hu October 9, 2 | 2018-10-09 |
Three-dimensional Touch Screen and Touch Foil Structure
App 20180275792 - Hu; Chuan | 2018-09-27 |
Single layer low cost wafer level packaging for SFF SiP
Grant 10,014,277 - Hu , et al. July 3, 2 | 2018-07-03 |
Solder In Cavity Interconnection Structures
App 20180151529 - Hu; Chuan ; et al. | 2018-05-31 |
Wavy interconnect for bendable and stretchable devices
Grant 9,942,980 - Hu , et al. April 10, 2 | 2018-04-10 |
Electric circuit on flexible substrate
Grant 9,930,793 - Hu , et al. March 27, 2 | 2018-03-27 |
Solder in cavity interconnection technology
Grant 9,848,490 - Hu December 19, 2 | 2017-12-19 |
Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
Grant 9,761,514 - Ma , et al. September 12, 2 | 2017-09-12 |
Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packages
Grant 9,741,645 - Hu August 22, 2 | 2017-08-22 |
Multi-layer Package
App 20170207170 - NAIR; Vijay K. ; et al. | 2017-07-20 |
Package With Dielectric Or Anisotropic Conductive (acf) Buildup Layer
App 20170179099 - Hu; Chuan ; et al. | 2017-06-22 |
Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer
Grant 9,685,390 - Hu June 20, 2 | 2017-06-20 |
Integrated circuit package assemblies including a glass solder mask layer
Grant 9,673,131 - Hu , et al. June 6, 2 | 2017-06-06 |
Semiconductor device with pre-molding chip bonding
Grant 9,659,885 - Hu May 23, 2 | 2017-05-23 |
Wavy Interconnect For Bendable And Stretchable Devices
App 20170079135 - HU; Chuan ; et al. | 2017-03-16 |
Package with dielectric or anisotropic conductive (ACF) buildup layer
Grant 9,543,197 - Hu , et al. January 10, 2 | 2017-01-10 |
Solder in cavity interconnection structures
Grant 9,530,747 - Hu , et al. December 27, 2 | 2016-12-27 |
Microelectronic package having direct contact heat spreader and method of manufacturing same
Grant 9,508,675 - Lu , et al. November 29, 2 | 2016-11-29 |
Substrate For Integrated Circuit Devices Including Multi-layer Glass Core And Methods Of Making The Same
App 20160322290 - Ma; Qing ; et al. | 2016-11-03 |
Magnetic Nanocomposite Materials And Passive Components Formed Therewith
App 20160322707 - Nair; Vijay K. ; et al. | 2016-11-03 |
Multi-chip-module Semiconductor Chip Package Having Dense Package Wiring
App 20160293578 - Hu; Chuan ; et al. | 2016-10-06 |
Method apparatus and material for radio frequency passives and antennas
Grant 9,461,355 - Nair , et al. October 4, 2 | 2016-10-04 |
Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
Grant 9,420,707 - Ma , et al. August 16, 2 | 2016-08-16 |
Single Layer Low Cost Wafer Level Packaging For Sff Sip
App 20160163676 - Hu; Chuan ; et al. | 2016-06-09 |
Solder In Cavity Interconnection Structures
App 20160148892 - Hu; Chuan ; et al. | 2016-05-26 |
Single layer low cost wafer level packaging for SFF SiP
Grant 9,281,292 - Hu , et al. March 8, 2 | 2016-03-08 |
Electric Circuit On Flexible Substrate
App 20150282341 - Hu; Chuan ; et al. | 2015-10-01 |
Electronic Package And Method Of Forming An Electronic Package
App 20150279824 - Nair; Vijay K. ; et al. | 2015-10-01 |
Solder In Cavity Interconnection Structures
App 20150187727 - Hu; Chuan ; et al. | 2015-07-02 |
Off-plane conductive line interconnects in microelectronic devices
Grant 9,072,187 - Hu June 30, 2 | 2015-06-30 |
Solder in cavity interconnection structures
Grant 9,006,890 - Hu , et al. April 14, 2 | 2015-04-14 |
Solder in cavity interconnection structures
Grant 8,936,967 - Hu , et al. January 20, 2 | 2015-01-20 |
Semiconductor Device With Pre-molding Chip Bonding
App 20150008595 - Hu; Chuan | 2015-01-08 |
Semiconductor device with pre-molding chip bonding
Grant 8,872,355 - Hu October 28, 2 | 2014-10-28 |
Integrated Circuit Package Assemblies Including A Glass Solder Mask Layer
App 20140299999 - Hu; Chuan ; et al. | 2014-10-09 |
Method Apparatus and Material for Radio Frequency Passives and Antennas
App 20140293529 - Nair; Vijay K. ; et al. | 2014-10-02 |
Solder In Cavity Interconnection Technology
App 20140240943 - Hu; Chuan | 2014-08-28 |
Package With Dielectric Or Anisotropic Conductive (acf) Buildup Layer
App 20140167217 - Hu; Chuan ; et al. | 2014-06-19 |
Off-plane Conductive Line Interconnects In Microelectronic Devices
App 20140063761 - Hu; Chuan | 2014-03-06 |
Semiconductor Device With Pre-molding Chip Bonding
App 20140061954 - Hu; Chuan | 2014-03-06 |
Microelectronic Package Having Non-coplanar, Encapsulated Microelectronic Devices And A Bumpless Build-up Layer
App 20140048959 - Hu; Chuan | 2014-02-20 |
Dense Interconnect With Solder Cap (disc) Formation With Laser Ablation And Resulting Semiconductor Structures And Packages
App 20140035134 - Hu; Chuan | 2014-02-06 |
Packaged Semiconductor Die And Cte-engineering Die Pair
App 20140001629 - Hu; Chuan | 2014-01-02 |
Microelectronic Package Having Direct Contact Heat Spreader And Method Of Manufacturing Same
App 20130344659 - Lu; Daoqiang ; et al. | 2013-12-26 |
Single Layer Low Cost Wafer Level Packaging For Sff Sip
App 20130343022 - Hu; Chuan ; et al. | 2013-12-26 |
Microelectronic package having direct contact heat spreader and method of manufacturing same
Grant 8,541,876 - Lu , et al. September 24, 2 | 2013-09-24 |
Solder In Cavity Interconnection Technology
App 20130206820 - Hu; Chuan | 2013-08-15 |
Solder in cavity interconnection technology
Grant 8,424,748 - Hu April 23, 2 | 2013-04-23 |
Solder In Cavity Interconnection Structures
App 20120241965 - Hu; Chuan ; et al. | 2012-09-27 |
Die-warpage compensation structures for thinned-die devices, and methods of assembling same
Grant 8,080,870 - Hu December 20, 2 | 2011-12-20 |
Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
App 20110147059 - Ma; Qing ; et al. | 2011-06-23 |
Solder in Cavity Interconnection Technology
App 20110147440 - Hu; Chuan | 2011-06-23 |
Thinned die integrated circuit package
Grant 7,888,183 - Liu , et al. February 15, 2 | 2011-02-15 |
Method of forming electronic package having fluid-conducting channel
Grant 7,882,624 - Hu , et al. February 8, 2 | 2011-02-08 |
Die-warpage compensation structures for thinned-die devices, and methods of assembling same
App 20100320576 - Hu; Chuan | 2010-12-23 |
Diamond substrate formation for electronic assemblies
Grant 7,713,839 - Hu , et al. May 11, 2 | 2010-05-11 |
Electronic assemblies having a low processing temperature
Grant 7,682,876 - Lu , et al. March 23, 2 | 2010-03-23 |
Thermal management of dies on a secondary side of a package
Grant 7,646,093 - Braunisch , et al. January 12, 2 | 2010-01-12 |
Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same
Grant 7,626,251 - Lu , et al. December 1, 2 | 2009-12-01 |
Densely packed thermoelectric cooler
Grant 7,560,640 - Hu , et al. July 14, 2 | 2009-07-14 |
Semiconductor Packages With Thermal Interface Materials
App 20090166852 - Hu; Chuan | 2009-07-02 |
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
Grant 7,531,429 - Tolchinsky , et al. May 12, 2 | 2009-05-12 |
Wafer-level Assembly Of Heat Spreaders For Dual Ihs Packages
App 20090034206 - Lu; Daoqiang ; et al. | 2009-02-05 |
Wafer-level assembly of heat spreaders for dual IHS packages
Grant 7,476,568 - Lu , et al. January 13, 2 | 2009-01-13 |
Microelectronic package and method of manufacturing same
App 20080277779 - Gupta; Abhishek ; et al. | 2008-11-13 |
Thinned die integrated circuit package
Grant 7,420,273 - Liu , et al. September 2, 2 | 2008-09-02 |
Wafer-level diamond spreader
Grant 7,397,119 - Chrysler , et al. July 8, 2 | 2008-07-08 |
Thermal Management Of Dies On A Secondary Side Of A Package
App 20080150125 - Braunisch; Henning ; et al. | 2008-06-26 |
Thinned Die Integrated Circuit Package
App 20080153209 - Liu; Cheng-Yi ; et al. | 2008-06-26 |
Multi-chip package having two or more heat spreaders
App 20080142954 - Hu; Chuan | 2008-06-19 |
Electronic Assemblies Having A Low Processing Temperature
App 20080096324 - LU; Daoqiang ; et al. | 2008-04-24 |
Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same
App 20080079125 - Lu; Daoqiang ; et al. | 2008-04-03 |
Electronic assemblies having a low processing temperature
Grant 7,319,048 - Lu , et al. January 15, 2 | 2008-01-15 |
Wafer-level assembly of heat spreaders for dual IHS packages
App 20080003719 - Lu; Daoqiang ; et al. | 2008-01-03 |
Heat spreader for use in conjunction with a semiconducting device and method of manufacturing same
App 20070295482 - Fitzgerald; Thomas J. ; et al. | 2007-12-27 |
Microelectronic die having a thermoelectric module
Grant 7,279,796 - Hu , et al. October 9, 2 | 2007-10-09 |
Integrated Circuit Coolant Microchannel Assembly With Targeted Channel Configuration
App 20070217147 - Chang; Je-Young ; et al. | 2007-09-20 |
Integrated circuit coolant microchannel assembly with targeted channel configuration
Grant 7,259,965 - Chang , et al. August 21, 2 | 2007-08-21 |
Microelectronic package having direct contact heat spreader and method of manufacturing same
App 20070075420 - Lu; Daoqiang ; et al. | 2007-04-05 |
Formation of assemblies with a diamond heat spreader
App 20070004216 - Hu; Chuan ; et al. | 2007-01-04 |
Electronic packages, assemblies, and systems with fluid cooling
Grant 7,126,822 - Hu , et al. October 24, 2 | 2006-10-24 |
Integrated circuit coolant microchannel assembly with targeted channel configuration
App 20060226539 - Chang; Je-Young ; et al. | 2006-10-12 |
Package with integrated wick layer and method for heat removal
Grant 7,095,111 - Hu , et al. August 22, 2 | 2006-08-22 |
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
Grant 7,091,108 - Tolchinsky , et al. August 15, 2 | 2006-08-15 |
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
App 20060177994 - Tolchinsky; Peter ; et al. | 2006-08-10 |
Electronic packages, assemblies, and systems with fluid cooling and associated methods
App 20060139883 - Hu; Chuan ; et al. | 2006-06-29 |
Densely packed thermoelectric cooler
App 20060107988 - Hu; Chuan ; et al. | 2006-05-25 |
Bumpless die and heat spreader lid module bonded to bumped die carrier
Grant 7,038,316 - Hu , et al. May 2, 2 | 2006-05-02 |
Wafer-level diamond spreader
App 20060084197 - Chrysler; Gregory M. ; et al. | 2006-04-20 |
Diamond substrate formation for electronic assemblies
App 20060073640 - Hu; Chuan ; et al. | 2006-04-06 |
Wafer-level diamond spreader
Grant 7,012,011 - Chrysler , et al. March 14, 2 | 2006-03-14 |
Electronic assemblies having a low processing temperature
App 20060051898 - Lu; Daoqiang ; et al. | 2006-03-09 |
Fluxless die-to-heat spreader bonding using thermal interface material
Grant 7,009,289 - Hu , et al. March 7, 2 | 2006-03-07 |
Wafer-level Diamond Spreader
App 20050287766 - Chrysler, Gregory M. ; et al. | 2005-12-29 |
Bumpless die and heat spreader lid module bonded to bumped die carrier
App 20050211749 - Hu, Chuan ; et al. | 2005-09-29 |
Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
App 20050136640 - Hu, Chuan ; et al. | 2005-06-23 |
Thinned die integrated circuit package
App 20050121778 - Liu, Cheng-Yi ; et al. | 2005-06-09 |
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
App 20050059221 - Tolchinsky, Peter ; et al. | 2005-03-17 |
Microelectronic die having a thermoelectric module
App 20050029637 - Hu, Chuan ; et al. | 2005-02-10 |
Fluxless die-to-heat spreader bonding using thermal interface material
Grant 6,833,289 - Hu , et al. December 21, 2 | 2004-12-21 |
Fluxless die-to-heat spreader bonding using thermal interface material
App 20040227249 - Hu, Chuan ; et al. | 2004-11-18 |
Fluxless die-to-heat spreader bonding using thermal interface material
App 20040227229 - Hu, Chuan ; et al. | 2004-11-18 |
Package with integrated wick layer and method for heat removal
App 20040188829 - Hu, Chuan ; et al. | 2004-09-30 |
Electronic assembly with fluid cooling and associated methods
App 20040190254 - Hu, Chuan ; et al. | 2004-09-30 |
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